Nguva dzinoshanda: Zvinofungidzirwa kuti 25% -30% yePCB parizvino inoshandisa maitiro eOSP, uye chikamu chave kukwira (zvingangoita kuti maitiro eOSP ave kupfuura espray tin uye chinzvimbo chekutanga). Iyo OSP maitiro anogona kushandiswa pa low-tech PCBs kana yepamusoro-tech PCBs, senge-sided TV PCBs uye yakakwirira-density chip kurongedza mabhodhi. Kune BGA, kune zvakare akawandaOSPapplications. Kana iyo PCB isina chepamusoro chekubatanidza zvinoshanda zvinodikanwa kana kurambidzwa nguva yekuchengeta, maitiro eOSP ndiwo anove akanyanya kunaka ekurapa maitiro.

Kubatsira kukuru: Iine zvese zvakanakira zvekushama mhangura bhodhi welding, uye bhodhi rakapera (mwedzi mitatu) rinogona zvakare kumutswa, asi kazhinji kamwe chete.

Kukanganisa: inobatwa neasidhi uye humidity. Kana ichishandiswa kune yechipiri reflow soldering, inoda kupedzwa mukati meimwe nguva yenguva. Kazhinji, mhedzisiro yechipiri reflow soldering ichave yakashata. Kana nguva yekuchengetedza ichipfuura mwedzi mitatu, inofanira kudzorerwa zvakare. Shandisa mukati maawa makumi maviri nemana mushure mekuvhura package. OSP is an insulating layer, saka test point inofanirwa kudhindwa ne solder paste kubvisa iyo yepakutanga OSP layer kuti ibate pini yekuyedza magetsi.

Nzira: Pamvura yakachena isina mhangura, chidimbu che organic film inokura nemakemikari nzira. Iyi firimu ine anti-oxidation, thermal shock, unyoro kudzivirira, uye inoshandiswa kuchengetedza mhangura kubva kune ngura (oxidation kana vulcanization, nezvimwewo) munzvimbo yakajairika; panguva imwecheteyo, inofanira kubetserwa nyore nyore mune inotevera kutonhora kwepamusoro kwekushisa. Flux inokurumidza kubviswa kune soldering;