Kuuya kwe-multi-layer PCBs
Nhoroondo, mabhodhi edunhu akadhindwa ainyanya kuratidzwa neayo imwechete kana maviri-layered dhizaini, izvo zvaiisa zvipingamupinyi pakukodzera kwavo kwepamusoro-frequency application nekuda kwekusaina kusaina uye kukanganiswa kwemagetsi (EMI). Zvakangodaro, kuunzwa kweakadhindwa-akawanda akadhindwa edunhu mabhodhi kwakakonzera kufambira mberi kunocherechedzwa mukuperera kwechiratidzo, electromagnetic interference (EMI) kuderedza, uye kuita kwese.
Multi-layered PCBs (Figure 1) ine akawanda conductive layers akapatsanurwa ne insulating substrates. Iyi dhizaini inogonesa kutapurirana kwezviratidzo uye ndege dzemagetsi nenzira yakaoma.
Multi-layer printed circuit boards (PCBs) inosiyaniswa kubva kune imwe chete kana kaviri-layer mativi nekuvapo kwematatu kana anopfuura conductive layers ayo akapatsanurwa ne insulating zvinhu, zvinowanzozivikanwa se dielectric layers. Kubatana kwezvikamu izvi kunofambiswa ne vias, ari minuscule conductive passageways anofambisa kutaurirana pakati pezvikamu zvakasiyana. Iyo yakaoma dhizaini ye-multi-layer PCBs inogonesa kuwanda kwezvikamu uye kuomesesa kutenderera, zvichivapa zvakakosha kune-ye-the-art tekinoroji.
Multilayer PCBs anowanzo kuratidza yakakwira dhigirii yekuomarara nekuda kwedambudziko remukati rekuwana akawanda akaturikidzana mukati meinochinjika PCB chimiro. Kubatana kwemagetsi pakati pezvikamu zvinotangwa kuburikidza nekushandiswa kwemhando dzinoverengeka dzevias (mufananidzo 2), kusanganisira mapofu uye akavigwa vias.
Kugadziriswa kunosanganisira kuiswa kwezvikamu zviviri pamusoro pekuisa hukama pakati peakadhindwa redunhu bhodhi (PCB) uye nharaunda yekunze. Kazhinji, kuwanda kwezvikamu mumabhodhi edunhu akadhindwa (PCBs) kwakaenzana. Izvi zvinonyanya kukonzerwa nekukanganisika kwenhamba dzisinganzwisisike kuzvinhu zvakaita se warping.
Huwandu hwemateya hunowanzo siyana zvichienderana nekushandiswa kwacho, kazhinji kuwira mukati mechikamu chezvikamu zvina kusvika gumi nezviviri.
Kazhinji, ruzhinji rwezvishandiso runoda mashoma mana uye anopfuura masere akaturikidzana. Kusiyana neizvi, mapurogiramu akadai sema smartphones anonyanya kushandisa zvikamu gumi nezviviri.
Main applications
Multi-layer PCBs anoshandiswa mune dzakasiyana siyana dzemagetsi zvikumbiro (Mufananidzo 3), kusanganisira:
● Consumer electronics, uko maPCB ane ma-multi-layer anoita basa rinokosha achipa simba rinodiwa uye zviratidzo kune zvakasiyana-siyana zvezvigadzirwa zvakadai sema smartphones, mahwendefa, mitambo yemitambo, uye zvigadzirwa zvinopfekwa. Iwo akapfava uye anotakurika zvemagetsi izvo isu tinovimba nazvo zuva nezuva zvinokonzerwa nekwavo compact dhizaini uye yakakwirira chikamu density.
● Muchikamu chezvekufambiswa kwemashoko, kushandiswa kwePCB dzakawanda-layer kunobatsira kutapurirana kwakanaka kwezwi, data, uye zviratidzo zvevhidhiyo pamanetiweki, nekudaro kuvimbisa kutaurirana kwakavimbika uye kunoshanda.
● Maindasitiri ekudzora masisitimu anonyanya kutsamira pane akawanda-layer akadhindwa edunhu mabhodhi (PCBs) nekuda kwekugona kwavo kubata nemazvo kutonga kwakaomarara masisitimu, maitiro ekutarisa, uye otomatiki maitiro. Machine control panels, marobhoti, uye maindasitiri otomatiki vanotsamira pavari seyavo yakakosha sisitimu yekutsigira
●Multi-layer PCBs akakodzerawo kumidziyo yekurapa, sezvo yakakosha pakuona kuti ndeyechokwadi, yakavimbika, uye yakabatana. Midziyo yekuongorora, masystem ekutarisisa varwere, uye michina yekurapa inoponesa hupenyu inopesvedzerwa zvakanyanya nebasa rayo rakakosha.
Benefits uye zvakanakira
Multi-layer PCBs inopa akati wandei mabhenefiti uye mabhenefiti mune yakakwira-frequency application, kusanganisira:
● Kuvandudzwa kwechiratidzo chekutendeseka: Multi-layered PCBs inofambisa inodzorwa impedance routing, kuderedza kukanganiswa kwechiratidzo uye kuve nechokwadi chekutapurira kwakavimbika kwezviratidzo zvepamusoro-frequency. Iko kupindira kwechiratidzo chepasi kweakawanda-layer akadhindwa edunhu mabhodhi anoguma nekuvandudzwa kwekuita, velocity, uye kuvimbika.
● Yakaderedzwa EMI: Nekushandisa yakatsaurirwa pasi uye ndege dzemagetsi, akawanda-akaturikidzana maPCB anonyatso kudzvanya EMI, nekudaro achiwedzera kuvimbika kwehurongwa uye kuderedza kukanganiswa nematunhu akavakidzana.
● Compact Design: Nekukwanisa kugadzirisa zvimwe zvikamu uye zvirongwa zvakaoma zvekufambisa, maPCB akawanda-layered anogonesa compact designs, yakakosha kune nzvimbo-inomanikidzirwa zvikumbiro zvakadai semafoni efoni uye aerospace systems.
● Improved Thermal Management: Multi-layered PCBs inopa kupisa kwakanyatsonaka kwekupisa kuburikidza nekubatanidzwa kwevhesi inopisa uye yakarongeka yakaiswa mhangura yemhangura, kusimbisa kuvimbika uye hupenyu hwezvikamu zvepamusoro-simba.
●Design Flexibility: Izvo zvakasiyana-siyana zve-multi-layered PCBs zvinobvumira hukuru hwekugadzirisa kushanduka, zvichiita kuti mainjiniya akwanise kukwidziridza maitiro ekuita senge impedance matching, kunonoka kuparadzira chiratidzo, uye kugovera simba.