Nhanganyaya yeVia-in-Pad:

Zvinonyatsozivikanwa kuti vias (VIA) inogona kupatsanurwa kupinda plated kuburikidza mugomba, bofu vias gomba uye kuvigwa vias gomba, vane mabasa akasiyana.

Nekuvandudzwa kwezvigadzirwa zvemagetsi, vias inoita basa rakakosha mukubatana kwe interlayer kwemabhodhi edunhu akadhindwa. Via-in-Pad inoshandiswa zvakanyanya mudiki PCB uye BGA (Bhora Grid Array). Nekuvandudzwa kusingadzivisiki kwehupamhi hwepamusoro, BGA (Ball Grid Array) uye SMD chip miniaturization, kushandiswa kweVia-in-Pad tekinoroji kuri kuwedzera kukosha.

Vias mumapedhi ane akawanda mabhenefiti pamusoro pemapofu uye akavigwa vias:

. Inokodzera yakanaka pitch BGA.

. Zviri nyore kugadzira yakakwirira density PCB uye kuchengetedza wiring nzvimbo.

. Zvirinani thermal management.

. Anti-yakaderera inductance uye imwe yakakwirira-kumhanya dhizaini.

. Inopa nzvimbo yakatsetseka yezvikamu.

. Deredza PCB nzvimbo uye wedzera kunatsiridza wiring.

Nekuda kwemabhenefiti aya, via-in-pad inoshandiswa zvakanyanya mumaPCB madiki, kunyanya mumagadzirirwo ePCB uko kufambiswa kwekupisa uye kumhanya kwakanyanya kunodiwa ine shoma BGA pitch. Kunyange zvazvo mapofu uye akavigwa vias kubatsira kuwedzera density uye kuchengetedza nzvimbo pamusoro PCBs, vias mumapedhi vachiri yakanakisisa sarudzo yokupisa utariri uye yakakwirira-nokukurumidza dhizaini zvinoriumba.

Iine yakavimbika kuburikidza nekuzadza / plating capping process, via-in-pad tekinoroji inogona kushandiswa kugadzira yakakwira-density PCB pasina kushandisa kemikari dzimba uye kudzivirira zvikanganiso zvekutengesa. Mukuwedzera, izvi zvinogona kupa mamwe mawaya ekubatanidza eBGA magadzirirwo.

Kune zvakasiyana-siyana zvekuzadza zvinhu zvegomba mundiro, sirivheri paste uye copper paste zvinowanzo shandiswa kune conductive zvinhu, uye resin inowanzoshandiswa kune zvisiri-conductive zvinhu.