1. Sei kushandisa ceramic circuit boards

Ordinary PCB inowanzogadzirwa nemhangura foil uye substrate bonding, uye substrate zvinhu zvakanyanya girazi fiber (FR-4), phenolic resin (FR-3) uye zvimwe zvinhu, adhesive inowanzoita phenolic, epoxy, nezvimwewo. Kugadziriswa kwePCB nekuda kwekushushikana kwekupisa, makemikari zvinhu, maitiro asina kunaka ekugadzira uye zvimwe zvikonzero, kana mukugadzira maitiro nekuda kwemativi maviri emhangura asymmetry, zviri nyore kutungamira kune akasiyana madhigirii e warping PCB board.

PCB Twist

Uye imwe PCB substrate - ceramic substrate, nekuda kwekuita kwekupisa kwekupisa, ikozvino kutakura kugona, kuvharidzira, kupisa kwekuwedzera coefficient, zvichingodaro, zviri nani kupfuura zvakajairika girazi fiber PCB board, saka inoshandiswa zvakanyanya mumagetsi emagetsi ma module. , aerospace, zvemagetsi zvechiuto uye zvimwe zvigadzirwa.

Ceramic substrates

Iine yakajairwa PCB uchishandisa adhesive mhangura foil uye substrate bonding, ceramic PCB iri munzvimbo yakakwira tembiricha, kuburikidza nenzira yekubatanidza foil yemhangura uye ceramic substrate yakabatanidzwa pamwe chete, simba rinosunga rinosunga, foil yemhangura haizodonha, kuvimbika kwepamusoro, kuita kwakagadzikana mukukwirira. tembiricha, high humidity nharaunda

2. Chinhu chikuru checeramic substrate

Alumina (Al2O3)

Alumina ndiyo inonyanya kushandiswa substrate zvinhu muceramic substrate, nekuti mune mechanika, inopisa uye magetsi zvivakwa zvichienzaniswa nemamwe akawanda oxide ceramics, kusimba kwepamusoro uye kugadzikana kwemakemikari, uye hupfumi hunobva hwezvinhu zvakasvibirira, zvakakodzera kune akasiyana tekinoroji kugadzira uye akasiyana maumbirwo. . Zvinoenderana nehuwandu hwealuminium (Al2O3) inogona kukamurwa kuita 75 porcelain, 96 porcelain, 99.5 porcelain. Iwo emagetsi zvimiro zvealumina anenge asina kukanganiswa neakasiyana emukati ealuminium, asi ayo emakanika zvimiro uye thermal conductivity inoshanduka zvakanyanya. Iyo substrate ine kuchena kwakaderera ine girazi rakawanda uye yakakura pamusoro roughness. Iyo yakakwirira kuchena kweiyo substrate, iyo yakanyanya kupfava, compact, yepakati kurasikirwa yakaderera, asi mutengo zvakare wakakwira

Beryllium oxide (BeO)

Iyo ine yakakwirira yekupisa conductivity kupfuura simbi aluminium, uye inoshandiswa mumamiriro ezvinhu apo yakakwirira yekupisa conductivity inodiwa. Inodzikira nekukurumidza mushure mekunge tembiricha yadarika 300 ℃, asi kukura kwayo kunogumira nehupfu hwayo.

Aluminium nitride (AlN) 

Aluminium nitride ceramics ma ceramics ane aluminium nitride powders sechikamu chikuru chekristalline. Kuenzaniswa nealumina ceramic substrate, insulation kuramba, insulation inomira yakakwira voltage, yakaderera dielectric inogara. Thermal conductivity yayo ndeye 7 ~ 10 nguva iyo yeAl2O3, uye iyo thermal expansion coefficient (CTE) inenge inofananidzwa nesilicon chip, iyo inonyanya kukosha kune yakakwirira-simba semiconductor chips. Muchigadzirwa chekugadzira, iyo yekupisa conductivity yeAlN inobatwa zvakanyanya nezviri mukati meyakasara yeokisijeni tsvina, uye iyo yekupisa conductivity inogona kuwedzerwa zvakanyanya nekuderedza iyo okisijeni yemukati. Parizvino, thermal conductivity yemaitiro

Zvichienderana nezvikonzero zviri pamusoro apa, zvinogona kuzivikanwa kuti alumina ceramics iri munzvimbo inotungamira muminda yemicroelectronics, magetsi emagetsi, yakasanganiswa microelectronics uye simba modules nekuda kwehukuru hwekuita kwavo kwakazara.

Zvichienzaniswa nemusika wehukuru hwakafanana (100mm × 100mm×1mm), zvinhu zvakasiyana zveceramic substrate mutengo: 96% alumina 9.5 yuan, 99% alumina 18 yuan, aruminiyamu nitride 150 yuan, beryllium oxide 650 yuan, zvinogona kuonekwa kuti mutengo wepakati pakati pe substrates dzakasiyana zvakare yakakura

3. Zvakanakira uye zvakaipira zvedongo PCB

Zvakanakira

1. Yakakura ikozvino kutakura kugona, 100A ikozvino inoenderera kuburikidza ne1mm 0.3mm gobvu muviri wemhangura, tembiricha inokwira ingangoita 17 ℃
2. Tembiricha inokwira ingangoita 5 ℃ apo 100A ikozvino inoramba ichipfuura nepakati pe2mm 0.3mm gobvu muviri wemhangura.
3. Zvirinani kupisa kupisa kuita, kuderera kwekuwedzera kwemafuta ekuwedzera, chimiro chakagadzikana, hazvisi nyore kurwisa.
4. Insulation yakanaka, yakakwira voltage kuramba, kuve nechokwadi chekuchengetedzwa kwemunhu nemidziyo.

Zvakaipa

Fragility ndiyo imwe yezvipingamupinyi zvikuru, izvo zvinotungamirira pakugadzira mapuranga maduku chete.

Mutengo wacho unodhura, zvinodiwa zvezvigadzirwa zvemagetsi zvinowedzera uye mitemo yakawanda, ceramic circuit board kana kushandiswa mune zvimwe zvezvigadzirwa zvepamusoro-soro, zvigadzirwa zvepasi hazvizoshandiswi zvachose.

4. Kushandiswa kweceramic PCB

a. Yakakwira simba remagetsi module, solar panel module, nezvimwe

1. High frequency switching power supply, solid state relay
2. Zvemagetsi zvemotokari, aerospace, zvechiuto zvemagetsi
3. High simba LED chiedza zvigadzirwa
4. Kukurukurirana antenna