Flexible Printed Circuit board (Flexible Printed Circuit circuit inonzi FPC), inozivikanwawo se flexible circuit board, flexible circuit board, inovimbika zvakanyanya, yakanakisa yakadhindwa yedunhu bhodhi yakagadzirwa ne polyimide kana polyester firimu se substrate. Iyo ine hunhu hwehurefu hwe wiring density, huremu huremu, hutete hwakaonda uye kubhenda kwakanaka.
FPC zvinhu zvekusarudza nzvimbo:
1.Kusarudzwa kwezvinhu zveparutivi makiyi / makiyi
Side kiyi sarudza 18/12.5 kaviri mativi electrolytic mhangura (kunze kwakakosha), kiyi huru sarudza 18/12.5 kaviri mativi electrolytic mhangura (kunze yakakosha). Kiyi yepadivi nekiyi huru haina zvakakosha zvinodikanwa mukukotama, uye inotengeswa uye yakagadzikwa pabhodhi guru, asi iva nechokwadi chekuona kuti hapana anomaly mukukotama nekudzoka kanopfuura kasere. Ukobvu hwekiyi hune zvakanyanya kuomarara zvinodiwa, zvikasadaro zvinokanganisa kunzwa kwekiyi, saka inofanirwa kusangana nehupamhi hwese zvinodiwa nemutengi.
2.Kusarudzwa kwezvinhu zvekubatanidza waya
Iyo yekubatanidza waya ndeye 18/12.5 kaviri-sided electrolytic mhangura (kunze kwekukosha). Basa guru nderekutamba basa rekubatanidza, uye hapana zvakakosha zvinodiwa zvekubhenda zvinodiwa. Magumo ese ari maviri anogona kugadzirwa uye kugadziriswa, asi zvinofanirwa kuvimbiswa kuti hapana anomaly usati wakotama kumashure neshure kwekanopfuura kasere.
3.Kusarudzwa kwezvinhu zvekubatsira
Pakusarudza bepa rekunamira, bhodhi rakajairwa haridi SMT rinogona kushandisa tembiricha inonamira pepa (senge padivi kiyi bhodhi), uye kudiwa kweSMT kunofanirwa kushandisa tembiricha inodzivirira inonamira bepa (seSMT nekiyi bhodhi).
4.Kusarudzwa kwezvinhu zvinogadzirisa
Pakusarudza bepa rinoitisa, rakajairwa conductive adhesive rakakodzera kune avo vane yakaderera magetsi conductivity zvinodiwa (seyakajairika keyplate), uye yakanaka conductive chivakwa chakakodzera kune avo vane yakakwirira yemagetsi conductivity zvinodiwa uye vanofanirwa kushandisa pepa rekunamatira (seyakakosha keyplate, nezvimwe. ), asi bepa rekunamira iri hariwanzo kukurudzirwa nekuti mutengo wakanyanya kukwirira.
Iyo conductive midziyo yejira rinoitisa inogona kunge iri, asi iyo viscosity haina kunaka, uye inowanzoenderana nekirasi keyplate.
Conductive pure adhesive is high-simba conductive material, inowanzo shandiswa kubatanidza simbi mashizha, asi hazvikurudzirwe kushandisa iyi conductive pure adhesive, nekuti mutengo wakanyanya kukwirira.
5.Material kusarudzwa kwe sliding cover plate
Iyo kaviri-layer inotsvedza yekuvhara ndiro ndeye 1/30Z imwe-sided isiri-gel electrolytic mhangura, iyo yakapfava uye ductile. Iyo yakapetwa kaviri-mativi inotsvedza yekuvhara ndiro ndeye 1/30Z kaviri-mativi isina-inonamira electrolytic mhangura, iyo yakapfava uye ductile. Hupenyu hwechivharo chinotsvedza chevhavha chakagadzirwa ne1/30Z yakapetwa kaviri-mativi mhangura-isina electrolytic copper iri nani pane iyo ye1/30Z imwe-sided mhangura-isina electrolytic copper. Kana pasina matambudziko nechimiro, zvinokurudzirwa kugadzira iyo FPC seyakapetwa kaviri-sided sliding cover plate kusvika pazvinobvira. Panyaya yemutengo, kushandiswa kwe1/30Z yakapetwa kaviri copper-isina electrolytic copper inowedzera mutengo nezvikamu makumi matatu kubva muzana kana zvichienzaniswa nekushandiswa kwe1/30Z imwe-sided copper-isina electrolytic copper main material, asi kushandiswa kweizvi. zvinhu zvinovandudza goho rekugadzira, uye hupenyu hwekuyedza hunogonawo kuvandudzwa, hunogona kuve nechokwadi kugadzikana kweiyi rudzi rweplate.
6.Kusarudzwa kwezvinhu zve-multi-layer board
Iyo multilayer ndiro ndeye 1/30Z isiri-colloidal electrolytic mhangura, iyo yakapfava uye ductile. Muchiitiko chekushaya matambudziko ekugadzirisa, kugadzirwa kweflap kunogona kuongororwa.
