PCB aruminiyamu substrate ane mazita akawanda, aruminiyamu cladding, aruminiyamu PCB, simbi akapfeka akadhindwa redunhu bhodhi (MCPCB), thermally conductive PCB, etc. The mukana PCB aruminiyamu substrate ndechokuti kupisa kuparara zviri nani zvikuru kupfuura mureza FR-4 chimiro, uye iyo dielectric inoshandiswa kazhinji Iri 5 kusvika ku10 nguva yekupisa kwemaitiro epoxy girazi, uye indekisi yekupisa yekupisa yechikamu chimwe chegumi chehukobvu inoshanda zvakanyanya kupfuura tsika dzakaomarara PCB. Ngatinzwisisei mhando dzePCB aluminium substrates pazasi.
1. Flexible aluminium substrate
Chimwe chezvazvino kuvandudzwa muIMS zvinhu zvinochinjika dielectrics. Zvinhu izvi zvinogona kupa yakanakisa magetsi ekudzivirira, kuchinjika uye kupisa conductivity. Kana yaiswa kune inochinjika aluminium zvinhu senge 5754 kana zvimwe, zvigadzirwa zvinogona kuumbwa kuti zviwane akasiyana maumbirwo nemakona, izvo zvinogona kubvisa zvinodhura zvekugadzirisa midziyo, tambo uye zvinobatanidza. Kunyange zvazvo zvinhu izvi zvinoshanduka, zvakagadzirirwa kukotama panzvimbo uye kuramba zviri panzvimbo.
2. Yakasanganiswa aluminium aruminiyamu substrate
Mu "hybrid" IMS chimiro, "zvishoma-zvikamu" zvezvisiri-zvinopisa zvinhu zvinogadziriswa zvakazvimiririra, uye ipapo Amitron Hybrid IMS PCBs inosungirirwa kune aluminium substrate nezvinhu zvinopisa. Iyo yakajairika chimiro ndeye 2-layer kana 4-layer subassembly yakagadzirwa neyechinyakare FR-4, iyo inogona kusungirirwa kune aruminiyamu substrate ine thermoelectric kubatsira kubvisa kupisa, kuwedzera kusimba, uye kuita senhoo. Zvimwe zvinobatsira zvinosanganisira:
1. Mutengo wakaderera pane zvese zvinopisa conductive zvinhu.
2. Ipa zviri nani kupisa kwekuita pane zvakajairwa FR-4 zvigadzirwa.
3. Kupisa kunodhura kunyura uye matanho egungano anoenderana anogona kubviswa.
4. Inogona kushandiswa muRF zvikumbiro zvinoda RF kurasikirwa maitiro ePTFE pamusoro pedenga.
5. Shandisa chikamu mahwindo ari aruminiyamu kuti vagare kuburikidza-gomba zvinoriumba, izvo zvinobvumira connectors uye netambo kupfuura connector kuburikidza substrate apo welding dzakapoteredzwa makona kugadzira chisimbiso pasina kudiwa inokosha gaskets kana mamwe anodhura adapters.
Tatu, multilayer aluminium substrate
Mumusika wemagetsi unoshanda, multilayer IMS PCBs akagadzirwa neakawanda thermally conductive dielectrics. Zvimiro izvi zvine imwe kana kupfuura akaturikidzana maseketi akavigwa mu dielectric, uye mapofu anoshandiswa seanopisa kana nzira dzechiratidzo. Kunyangwe madhizaini e-single-layer achidhura uye asinganyanyi kufambisa kupisa, iwo anopa yakapusa uye inoshanda yekutonhodza mhinduro yemamwe madhizaini akaomarara.
Ina, kuburikidza-gomba aluminium substrate
Muchigadziro chakaoma zvikuru, chidimbu chealuminium chinogona kuumba "core" ye multilayer thermal structure. Pamberi pelamination, aluminium inoiswa electroplated uye inozadzwa nedielectric pamberi. Thermal zvinhu kana sub-zvikamu zvinogona laminated kumativi ose maviri aruminiyamu vachishandisa thermal adhesive zvinhu. Kamwe laminated, gungano rakapedzwa rinofanana neyakajairwa multilayer aluminium substrate nekuchera. Yakaputirwa nemaburi inopfuura nepamaburi muaruminiyamu kuchengetedza magetsi ekudzivirira. Neimwe nzira, iyo mhangura yepakati inogona kubvumira yakananga magetsi kubatana uye insulating vias.