Multilayer PCBinonyanya kuumbwa nemhangura foil, prepreg, uye core board. Kune marudzi maviri ezvimiro zvelamination, zvinoti, iyo lamination chimiro chemhangura foil uye core board uye lamination chimiro che core board uye core board. Iyo yemhangura foil uye yepakati bhodhi lamination chimiro inosarudzwa, uye yepakati bhodhi lamination chimiro chinogona kushandiswa kune akakosha mahwendefa (akadai seRogess44350, nezvimwewo) akawanda-layer mabhodhi uye hybrid chimiro mapuranga.

1.Design zvinodiwa zvekutsikirira chimiro Kuti uderedze warpage yePCB, iyo PCB lamination chimiro chinofanirwa kuzadzisa symmetry zvinodiwa, ndiko kuti, ukobvu hwefoil yemhangura, rudzi uye ukobvu hweiyo dielectric layer, mhando yekugovera mhando. (circuit layer, plane layer), iyo lamination, nezvimwe zvine hukama nePCB yakatwasuka Centrosymmetric,

2.Conductor mhangura ukobvu

(1) Hukobvu hwemhangura yemhangura inoratidzwa pakudhirowa ndiko ukobvu hwemhangura yakapedzwa, ndiko kuti, ukobvu hwekunze kwemhangura ndiko ukobvu hwefoiri yemhangura yepasi pamwe neukobvu hwetambo ye electroplating, uye ukobvu. yemukati memhangura ndiko ukobvu hwemukati wefoiri yendarira yepasi. Pakudhirowa, iyo yekunze ukobvu hwemhangura inomisikidzwa se "copper foil ukobvu + plating, uye yemukati yakatsetseka ukobvu hwemhangura hunomakwa se "copper foil ukobvu".

(2) Chengetedzo yekushandiswa kwe2OZ uye pamusoro pemhangura yakakora yepasi Inofanirwa kushandiswa zvakaenzanirana mukati mestack.

Dzivisa kuaisa paL2 uye Ln-2 akaturikidzana zvakanyanya sezvinobvira, kureva, echipiri ekunze akaturikidzana ePamusoro nePazasi pepamusoro, kudzivirira isina kuenzana uye yakaunyana PCB nzvimbo.

3. Zvinodiwa zvekutsikirira chimiro

Iyo lamination process inzira yakakosha mukugadzira PCB. Kuwanda kwenhamba yelaminations, kunowedzera kurongeka kwemakomba uye dhisiki, uye zvakanyanya kuoma deformation yePCB, kunyanya kana iri asymmetrically laminated. Lamination ine zvinodiwa pakuturikidzana, senge mhangura ukobvu uye dielectric ukobvu hunofanirwa kuenderana.