1. Gomba

Iyo pinhole inokonzerwa nekudzvinyirirwa kwehydrogen gasi pamusoro pezvikamu zvakaputirwa, izvo zvisingazobudiswi kwenguva yakareba. Mushonga weplating haugone kunyorova pamusoro pezvikamu zvakapetwa, kuitira kuti electrolytic plating layer haigone kuongororwa nemagetsi. Sezvo ukobvu hwejasi hunowedzera munzvimbo yakatenderedza hydrogen evolution point, pinho inoumbwa panzvimbo yehydrogen evolution. Inoratidzwa negomba rakatenderera rinopenya uye dzimwe nguva muswe mudiki wakasimudzwa. Kana paine kushaikwa kwekunyorovesa mumiriri mune yeplating mhinduro uye yazvino density yakakwira, pinholes zviri nyore kugadzira.

2. Gomba

Pockmarks imhaka yekuti nzvimbo yakaputirwa haina kuchena, kune yakasimba zvinhu zvakashongedzwa, kana zvinhu zvakasimba zvakamiswa muplating solution. Pavanosvika pamusoro pebasa rekushanda pasi pechiito chemunda wemagetsi, vanoshambadzirwa pairi, izvo zvinokanganisa electrolysis. Izvi zvinhu zvakasimba zvakaiswa muIn electroplating layer, zviduku zviduku (dumps) zvinoumbwa. Chimiro ndechekuti inopenya, hapana chinopenya chiitiko, uye hapana chimiro chakamisikidzwa. Muchidimbu, inokonzerwa netsvina workpiece uye tsvina plating mhinduro.

3. Mitsetse yemhepo

Airflow streaks inokonzerwa nekuwedzera kwekuwedzera kana yakakwira cathode ikozvino density kana yakaoma agent, iyo inoderedza cathode ikozvino kushanda uye inoguma nehuwandu hukuru hwekushanduka kwehydrogen. Kana iyo plating solution ikayerera zvishoma nezvishoma uye cathode ichifamba zvishoma nezvishoma, iyo hydrogen gasi yaizokanganisa kurongeka kwemakristasi e electrolytic panguva yekusimuka ichipesana nepamusoro peiyo workpiece, ichigadzira mitsetse yemhepo kubva pasi kusvika kumusoro.

4. Mask plating (yakafumurwa pasi)

Mask plating imhaka yekuti iyo yakapfava kupenya panzvimbo yepini pamusoro peiyo workpiece haina kubviswa, uye iyo electrolytic deposition coating haigone kuitwa pano. Iyo yepasi zvinhu inogona kuoneka mushure me electroplating, saka inonzi yakavhurika pasi (nekuti nyoro kupenya chinhu chinopenya kana chakajeka resin chikamu).

5. Kupfeka brittleness

Mushure meSMD electroplating uye kucheka nekugadzira, zvinogona kuonekwa kuti kune kuputika pane bend yepini. Kana paine kutsemuka pakati peiyo nickel layer uye substrate, inotongwa kuti nickel layer ine brittle. Kana pakatsemuka pakati petini layer nenickel layer, zvinotariswa kuti tin layer iri brittle. Zvizhinji zvezvinokonzeresa brittleness ndezvekuwedzera, kupenya kwakanyanya, kana yakawandisa inorganic uye organic tsvina muplating mhinduro.