Mabhodhi edunhu akadhindwa anoshandiswa mumagetsi emazuva ano uye zvishandiso zvine akawanda emagetsi zvikamu zvakasungirirwa. Ichi ndicho chokwadi chakakosha, sezvo nhamba yezvikamu zvemagetsi pane yakadhindwa yedunhu bhodhi inowedzera, ndizvo zvinoita saizi yebhodhi redunhu. Nekudaro, extrusion yakadhindwa redunhu bhodhi saizi, BGA package iri kushandiswa parizvino.

Heano mabhenefiti makuru eiyo BGA package iwe yaunofanirwa kuziva nezvayo mune izvi. Saka, tarisa ruzivo rwakapihwa pazasi:

1. BGA soldered package ine high density

BGAs ndeimwe yemhinduro dzinoshanda kudambudziko rekugadzira tumapakeji twesekete akanyatsobatanidzwa ane nhamba huru yemapini. Dual in-line surface mount uye pini grid array mapakeji ari kugadzirwa nekudzikisa voids Mazana emapini ane nzvimbo pakati pemapini aya.

Nepo izvi zvichishandiswa kuunza yakakwira density mazinga, izvi zvinoita kuti maitiro ekusodha pini anetsa kubata. Izvi zvinodaro nekuti njodzi yekubvongodza netsaona-kune-musoro mapini iri kuwedzera sezvo nzvimbo iri pakati pepini inodzikira. Nekudaro, BGA Soldering iyo pasuru inogona kugadzirisa dambudziko iri nani.

2. Kuitisa kupisa

Imwe yemabhenefiti anoshamisa eiyo BGA package ndeye kuderedzwa kwemafuta kuramba pakati pePCB nepasuru. Izvi zvinobvumira kupisa kunoitwa mukati mepakeji kuyerera zvirinani nedunhu rakasanganiswa. Uyezve, ichadzivirirawo chip kubva pakupisa nenzira yakanakisisa inobvira.

3. Lower inductance

Zvakanakisa, mapfupi emagetsi conductor anoreva yakaderera inductance. Inductance hunhu hunogona kukonzera kukanganiswa kusingadiwe kwezviratidzo mumaseketi emagetsi akakwira. Sezvo BGA ine chinhambwe chipfupi pakati pePCB uye pasuru, ine yakaderera lead inductance, ichapa kuita kurinani kwepini zvishandiso.