Mabhodhi edunhu akadhindwa anoshandiswa mune yanhasi yemagetsi uye zvishandiso zvine zvakawanda zvemagetsi zvikamu zvemagetsi zvakamonerwa. Ichi chinhu chakakosha, sehuwandu hwezvemagetsi zvemagetsi pane bhodhi redunhu rakadhindwa rinowedzera, saka saizi yedunhu redunhu. Nekudaro, Extrusus yakadhindwa redunhu board saizi, BGA package parizvino iri kushandiswa.

Hezvino zvakanakisa zvakanakira zveBGA package iwe unofanirwa kuziva nezve panhau iyi. Saka, tarisa ruzivo rwakapihwa pazasi:

1. BGA yakasangana package ine yakakura density

Bgas ndeimwe yemhinduro dzinonyanya kushanda padambudziko rekugadzira mapakeji madiki ekushanda kwemasangano anoshanda ane huwandu hukuru hwemapini. Dual in-line Specurity Mount uye Pin Grid Array mapakeji ari kugadzirwa nekuderedza voids mazana emapini ane nzvimbo pakati pemapini aya.

Kunyange izvi zvichishandiswa kuunza huwandu hwakanyanya hwekuwedzera, izvi zvinoita kuti maitiro ekutengesa maPIN akaomarara. Izvi zvinodaro nekuti njodzi yekuvhenekera netsaona-kune-header pini iri kuwedzera sezvo nzvimbo pakati pePIN inoderera. Nekudaro, BGA kutengeswa iyo phukusi inogona kugadzirisa dambudziko iri riri nani.

2. Kupisa kuunganidzwa

Chimwe chezvakanyanya zvinoshamisa zvakanaka zveBGA package ndiyo yakaderedzwa inodzora kurwisa pakati pePCB uye iyo package. Izvi zvinobvumira kupisa kunogadzirwa mukati mekodhi kuti ifambe zviri nani nedunhu rakabatanidzwa. Uyezve, zvakare ichadzivirirawo chip kubva pakunyanyisa nenzira yakanakisa.

3. Kuderera kwekunyepedzera

Zvakanakisa, magetsi akapfupi magetsi zvinoreva kuderera kwekunyepedzera. Induction ndeye hunhu hunogona kukonzera kusanzwisisika kwekukanganisa kwemasaini mune yakakwirira-yekumhanyisa zvemagetsi. Sezvo bga ine chinhambwe pakati pePCB uye iyo package, ine yakadzika kutungamira inductance, ichaita zvirinani kuita kwePIN zvishandiso.