Zvinoenderana nePCB board reinforcement materials, inowanzo patsanurwa kuva anotevera marudzi:

1. Phenolic PCB bepa substrate

Nokuti rudzi urwu rwePCB bhodhi rinoumbwa nemapuranga emapuranga, huni hwehuni, nezvimwewo, dzimwe nguva rinova makadhibhokisi, V0 bhodhi, bhodhi rinopisa moto uye 94HB, nezvimwewo. Chinhu chayo chikuru imapuranga pulp fiber paper, inova rudzi rwePCB. yakagadzirwa ne phenolic resin pressure.board.

Rudzi urwu rwepepa substrate harisi moto, rinogona kubaiwa, rine mutengo wakaderera, mutengo wakaderera, uye yakaderera hukama.Tinowanzoona phenolic paper substrates dzakadai seXPC, FR-1, FR-2, FE-3, nezvimwewo. Uye 94V0 ndeyepepa-retardant paperboard, iyo isingatsva.

2. Composite PCB substrate

Iri rudzi rwebhodhi rehupfu rinonziwo bhodhi rehupfu, rine huni pulp fiber bepa kana donje pulp fiber bepa sechinhu chekusimbisa, uye girazi fiber jira sechinhu chinosimbisa pamusoro.Zvinhu zviviri izvi zvakagadzirwa nemurazvo-retardant epoxy resin.Kune imwechete-sided hafu-girazi faibha 22F, CEM-1 uye kaviri-sided hafu-girazi faibha bhodhi CEM-3, pakati payo CEM-1 uye CEM-3 ndiwo anonyanya kuumbwa base copper clad laminates.

3. Girazi fiber PCB substrate

Dzimwe nguva inovawo epoxy board, girazi faibha bhodhi, FR4, faibha bhodhi, etc. Inoshandisa epoxy resin seanonamira uye girazi faibha jira sekusimbisa zvinhu.Rudzi urwu rwebhodhi redunhu rine tembiricha yepamusoro yekushanda uye haina kukanganiswa nenharaunda.Iri rudzi rwebhodhi rinowanzo shandiswa mumbiri-mativi PCB, asi mutengo unodhura kupfuura inoumbwa PCB substrate, uye ukobvu hwakajairika i1.6MM.Rudzi urwu rwe substrate rwakakodzerwa akasiyana emagetsi emagetsi mabhodhi, epamusoro-level redunhu mabhodhi, uye anoshandiswa zvakanyanya mumakomputa, midziyo yekutenderera, uye midziyo yekutaurirana.