CHII CHINONZI BHORA RASOLDER?

Bhora rekutengesa ndechimwe chezvakanyanya kukanganiswa reflow defects inowanikwa paunenge uchiisa pamusoro pepamusoro tekinoroji kubhodhi redunhu rakadhindwa. Chokwadi kune zita ravo, ivo ibhora re solder rakapatsanurwa kubva kumuviri mukuru unoumba iyo yakabatana fusing pamusoro pegomo zvikamu kubhodhi.

Solder balls vari conductive zvinhu, kureva kuti kana akakunguruka pamusoro rakadhindwa redunhu bhodhi, vanogona kukonzera magetsi zvikabudura, zvakaipa kukanganisa kuvimbika rakadhindwa redunhu bhodhi.

Per theIPC-A-610, PCB ine mabhora anodarika mashanu (<=0.13mm) mukati me600mm² haina kukwana, sezvo dhayamita yakakura kupfuura 0.13mm inotyora mutemo wemagetsi mashoma. Zvisinei, kunyange zvazvo mitemo iyi ichitaura kuti mabhora ekutengesa anogona kusiiwa akasimba kana akanamatira akachengeteka, hapana nzira chaiyo yekuziva kuti ndeyechokwadi.

KURENGESA SEI MABHHORO ESOOLDER ASATI AITIKA

Solder mabhora anogona kukonzerwa nezvinhu zvakasiyana-siyana, zvichiita kuti kuongororwa kwedambudziko kwakaoma. Mune zvimwe zviitiko, vanogona kunge vakangoitika zvachose. Heano mashoma ezvikonzero zvakajairwa solder mabhora fomu muPCB musangano maitiro.

Humidity-Unyoroyakawedzera kuva imwe yenyaya huru kune dzakadhindwa redunhu bhodhi vanogadzira nhasi. Kunze kweiyo popcorn effect uye microscopic cracking, inogonawo kukonzera solder mabhora kuumbwa nekuda kwekupukunyuka kwemhepo kana mvura. Ita shuwa kuti akadhindwa edunhu mabhodhi akaomeswa zvakanaka pamberi pekuisa solder, kana kuita shanduko yekudzora humidity munzvimbo yekugadzira.

Solder Paste- Matambudziko mune solder paste pachayo anogona kubatsira pakuumbwa kwe solder balling. Nekudaro, hazvikurudzirwe kushandisa zvakare solder paste kana kubvumira kushandiswa kwesolder paste yapfuura zuva rekupera kwayo. Solder paste inofanirawo kuchengetedzwa zvakanaka uye kubatwa maererano nemirairo yemugadziri. Mvura soluble solder paste inogonawo kubatsira kune yakawandisa mwando.

Stencil Design- Solder balling inogona kuitika kana stencil yakacheneswa zvisina kunaka, kana iyo stencil yakadhindwa zvisirizvo. Nokudaro, kuvimba neruzivo rwakadhindwa redunhu bhodhi kugadzirauye imba yegungano inogona kukubatsira kudzivisa kukanganisa uku.

Reflow Temperature Profile-A flex solvent inoda kubuda pamwero chaiwo. Ahigh ramp-upkana pre-heat rate inogona kutungamirira pakuumbwa kwe solder balling. Kugadzirisa izvi, iva nechokwadi chekuti ramp-up yako iri pasi pe1.5°C/sec kubva paavhareji tembiricha yemukamuri kusvika 150°C.

KUBVISA BHORO RSOSODERA

Pfaya mumhepondiyo yakanakisa nzira yekubvisa solder bhora kusvibiswa. Michina iyi inoshandisa mitsipa yemhepo yakakwira inobvisa nechisimba mabhora anotengeswa kubva pamusoro pebhodhi redunhu rakadhindwa nekuda kwekumanikidza kwavo kukuru.

Nekudaro, rudzi urwu rwekubvisa harushande kana chisakiso chinobva kune misprinted PCBs uye pre-reflow solder paste nyaya.

Nekuda kweizvozvo, zvakanakisa kuongorora chikonzero chekutengesa mabhora nekukurumidza sezvinobvira, sezvo maitiro aya anogona kukanganisa PCB yako kugadzira nekugadzira. Kudzivirira kunopa zvibereko zvakanakisisa.

RUKA ZVINOGONA NEIMAGINEERING INC

PaImagineering, tinonzwisisa kuti chiitiko ndiyo nzira yakanakisa yekudzivirira iyo hiccups inouya pamwe nePCB yekugadzira uye kusangana. Isu tinopa yakanakisa-mu-kirasi mhando yakavimbika mumauto uye aerospace application, uye tinopa nekukurumidza kutendeuka pane prototyping nekugadzira.

Wagadzirira kuona Imagineering musiyano?Bata nesu nhasikuti uwane quote pane yedu PCB yekugadzira uye magungano maitiro.