Pamusoro peiyo impedance yeRF chiratidzo mutsara, iyo laminated chimiro cheRF PCB single board inodawo kufunga nyaya dzakadai sekupisa kupisa, zvazvino, zvishandiso, EMC, chimiro uye ganda maitiro. Kazhinji isu tiri mukuisa uye stacking ye multilayer akadhindwa mapuranga. Tevedzera zvimwe zvakakosha:
A) Imwe neimwe tambo yeRF PCB yakafukidzwa nenzvimbo hombe isina ndege yemagetsi. Iwo epamusoro uye akadzika ari padyo akaturikidzana eRF wiring layer anofanira kunge ari pasi ndege.
Kunyangwe iri dhijitari-analog yakasanganiswa bhodhi, chikamu chedhijitari chinogona kuva nendege yemagetsi, asi nzvimbo yeRF ichiri kufanira kuzadzisa zvinodikanwa zvenzvimbo hombe-paving pane imwe neimwe pasi.
B) Kune iyo RF yakapetwa kaviri pani, iyo yepamusoro layer ndiyo chiratidzo chechiratidzo, uye yepasi pasi indege yepasi.
Ina-layer RF single board, iyo yepamusoro layer ndiyo chiratidzo chechiratidzo, chechipiri nechina mataira ndege dzepasi, uye yechitatu layer ndeyesimba uye mitsara yekudzora. Muzviitiko zvakakosha, mamwe mitsara yeRF chiratidzo inogona kushandiswa pane yechitatu layer. Zvimwe zvikamu zveRF mabhodhi, zvichingodaro.
C) Kune iyo RF backplane, iyo yepamusoro uye yepasi pepamusoro maseru ese ari pasi. Kuti uderedze iyo impedance discontinuity inokonzerwa ne vias uye zvibatanidza, yechipiri, yechitatu, yechina, uye yechishanu akaturikidzana anoshandisa masaini edhijitari.
Mamwe ma stripline layer ari pasi pepasi ese ari pasi masignal layer. Saizvozvo, iwo maviri ari padivi peiyo RF chiratidzo layer anofanirwa kuve pasi, uye imwe neimwe layer inofanirwa kuvharwa nenzvimbo hombe.
D) Kune yakakwirira-simba, yakakwirira-ikozvino RF mabhodhi, iyo RF main link inofanirwa kuiswa pamusoro pedenga uye yakabatana neyakakura microstrip mutsara.
Izvi zvinobatsira pakupisa kupisa uye kurasikirwa kwesimba, kuderedza zvikanganiso zvekuora kwewaya.
E) Ndege yemagetsi yechikamu chedhijitari inofanira kuva pedyo nendege yepasi uye yakarongeka pasi pepasi pasi.
Nenzira iyi, iyo capacitance pakati pemarata maviri esimbi inogona kushandiswa seyakatsetseka capacitor yemagetsi, uye panguva imwecheteyo, ndege yepasi inogonawo kudzivirira iyo mwaranzi ikozvino yakagoverwa pane simba ndege.
Iyo chaiyo stacking nzira uye kupatsanurwa kwendege zvinodiwa zvinogona kureva "20050818 Yakadhindwa Circuit Board Dhizaini-EMC Zvinodiwa" yakaburitswa neEDA Dhizaini Dhipatimendi, uye zviyero zvepamhepo zvichavepo.
2
RF bhodhi wiring zvinodiwa
2.1 Corner
Kana iyo RF inoteedzera chiratidzo ichienda kumakona ekurudyi, iyo inobudirira mutsara upamhi pamakona ichawedzera, uye iyo impedance ichave isingaenderere mberi uye ichikonzera kuratidzwa. Nokudaro, zvakakosha kutarisana nemakona, kunyanya nenzira mbiri: kucheka kwekona uye kutenderera.
(1) Kona yakachekwa inokodzera mabhendi madiki, uye frequency inoshanda yekona yakachekwa inogona kusvika 10GHz.
(2) Iyo radius yearc angle inofanira kunge yakakura zvakakwana. Kazhinji kutaura, simbisa: R> 3W.
2.2 Microstrip wiring
Iyo yepamusoro yePCB inotakura chiratidzo cheRF, uye iyo ndege yepasi pasi pechiratidzo cheRF inofanirwa kunge iri ndege yepasi yakazara kuti igadzire microstrip mutsara chimiro. Kuti ive nechokwadi chekuvimbika kwechimiro cheiyo microstrip mutsara, pane zvinotevera zvinodiwa:
(1) Micheto pamativi ese emutsetse wemicrostrip inofanira kunge iri 3W yakafara kubva kumucheto kwepasi pasi. Uye muchikamu che3W, hapafanirwe kunge paine isina-ground vias.
(2) Chinhambwe pakati peiyo microstrip mutsara uye madziro ekudzivirira inofanira kuchengetwa pamusoro pe2W. (Cherechedza: W ndiyo upamhi hwemutsara).
(3) Mitsetse yemicrostrip isina kubatanidzwa mumutsara mumwe chete inofanira kubatwa neganda remhangura yevhu uye pasi vias inofanira kuwedzerwa kune pasi peganda remhangura. Iyo gomba spacing ishoma pane λ/20, uye dzakarongeka zvakaenzana.
Mucheto wepasi mhangura foil inofanira kunge yakatsetseka, yakadzikama, uye isina mabhura anopinza. Zvinokurudzirwa kuti mupendero wemhangura yepasi-yakavharwa yakakura kudarika kana yakaenzana nehupamhi hwe 1.5W kana 3H kubva kumucheto we microstrip line, uye H inomiririra hupamhi hwe microstrip substrate medium.
(4) Hazvibvumirwi kuti RF siginecha wiring iyambuke pasi plane gap rechipiri layer.
2.3 Stripline wiring
Radio frequency masaini dzimwe nguva anopfuura nepakati pepakati pePCB. Inonyanya kuzivikanwa inobva pachikamu chechitatu. Yechipiri uye yechina mitsara inofanira kunge yakazara pasi ndege, kureva, eccentric stripline structure. Kutendeseka kwechimiro chetambo yetambo kuchavimbiswa. Zvinodiwa zvichava:
(1) Micheto pamativi ese emutsetse wetambo inokwana 3W yakafara kubva kumusoro uye yakaderera pasi pemapendero endege, uye mukati me3W, hapafanirwe kunge paine isina-ivhu.
(2) Izvo zvinorambidzwa kuti RF stripline iyambuke mukaha pakati pepamusoro nepasi pasi ndege.
(3) Mitsetse yemitsara muchikamu chimwe chete inofanira kurapwa neganda remhangura yepasi uye pasi vias inofanira kuwedzerwa kune pasi peganda remhangura. Iyo gomba spacing ishoma pane λ/20, uye dzakarongeka zvakaenzana. Mucheto wepasi mhangura foil inofanira kunge yakatsetseka, yakadzikama uye isina mabhura anopinza.
Zvinokurudzirwa kuti mupendero weganda remhangura rakavharwa pasi rakakura kudarika kana kuenzana nehupamhi hwe1.5W kana hupamhi hwe3H kubva kumucheto wemutsara wemutsara. H inomiririra huwandu hwese hwepamusoro uye hwepasi dielectric layers yemutsetse we strip.
(4) Kana mutsara wemutsetse uri wekutumira masaini-ane simba-akakwirira, kuitira kudzivirira iyo 50 ohm mutsara wakafara zvakanyanya kutetepa, kazhinji matehwe emhangura epamusoro uye ezasi mareferensi ndege enzvimbo yemutsara wemutsetse anofanirwa kuvharirwa kunze, uye hupamhi hwegomba kunze ndiyo mutsara wemitsara Inodarika kashanu iyo yakazara dielectric ukobvu, kana mutsara wakafara uchiri kusasangana nezvinodiwa, ipapo iyo yepamusoro uye yakaderera yakatarisana yechipiri layer yereferensi ndege dzakaiswa kunze.