Zvishanu zvinodiwa kuti pcb kuisirwa

Kuti ifambise kugadzirwa nekugadzira, PCBpcb redunhu bhodhi jigsaw kazhinji inofanirwa kugadzira iyo Mark point, V-groove, uye kugadzirisa edge.

PCB chitarisiko dhizaini

1. Iyo furemu (clamping edge) yePCB splicing nzira inofanirwa kutora yakavharwa-loop control design scheme kuti ive nechokwadi chekuti PCB splicing nzira haisi nyore kuremara mushure mekugadziriswa pachigadziro.

2. Iyo yose yakafara yePCB splicing nzira ndeye ≤260Mm (SIEMENS line) kana ≤300mm (FUJI line); kana otomatiki gluing ichidikanwa, hupamhi hwese hwePCB splicing nzira ndeye 125mm × 180mm.

3. Chimiro chechimiro chePCB boarding method chiri padyo nechikwere sezvinobvira, uye zvinokurudzirwa kushandisa 2 × 2, 3 × 3, ... uye nzira yebhodhi; asi hazvidikanwi kuperetera mabhodhi akanaka uye asina kunaka;

 

pcbV-Cheka

1. Mushure mekuvhura V-yakatemwa, iyo yakasara ukobvu X inofanira kunge iri (1/4~1/3) ndiro ukobvu L, asi hushoma ukobvu X hunofanira kuva ≥0.4mm. Zvirambidzo zviripo kune mabhodhi ane mitoro inorema, uye miganhu yakaderera inowanikwa kune mabhodhi ane mitoro yakareruka.

2. The displacement S yevanga riri kuruboshwe uye kurudyi kumativi eV-cut inofanira kunge iri pasi pe0 mm; nekuda kweiyo shoma inonzwisisika ukobvu muganho, iyo V-cut splicing nzira haina kukodzera bhodhi ine ukobvu isingasviki 1.3mm.

Maka pfungwa

1. Paunenge uchiisa nzvimbo yekusarudza yakajairika, kazhinji ibva panzvimbo isina kuvharidzirwa isina kumira 1.5 mm yakakura kudarika periphery yenzvimbo yekusarudza.

2. Inoshandiswa kubatsira magetsi emagetsi e smt placement machine kuti awane zvakarurama kona yepamusoro yePCB board ine chip components. Pane zviyero zviviri zvakasiyana. Iwo kuyerwa mapoinzi eiyo chaiyo chinzvimbo chePCB yese anowanzo muchidimbu chimwe. Nzvimbo yehukama yekona yepamusoro yePCB; iyo yekuyera mapoinzi eiyo chaiyo chinzvimbo cheakaturikidzana PCB yemagetsi optics kazhinji ari pakona yepamusoro yeakaturikidzana PCB pcb redunhu bhodhi.

3. Kune zvikamu zveQFP (square flat package) ine waya spacing ≤0.5 mm uye BGA (ball grid array package) ine ball spacing ≤0.8 mm, kuitira kuti ivandudze kurongeka kwechip, inotsanangurwa kuti igadzirwe paviri. makona epamusoro eIC Measuring point.

processing technology side

1. Muganho pakati pepuranga uye mukati mebhodhi guru remukati, node pakati pebhodhi guru uye bhodhi huru haifaniri kunge yakakura kana kudarika, uye kumucheto kwechigadzirwa chemagetsi uye PCBpcb redunhu bhodhi rinofanira kusiya kupfuura 0.5 mm yemukati. nzvimbo. Kuve nechokwadi chekushanda kwakajairika kwelaser yekucheka CNC blades.
Makomba chaiwo ekumisikidza pabhodhi

1. Inoshandiswa kurongedza chaiyoiyo yese PCB redunhu bhodhi rePCBpcb redunhu bhodhi uye mwero mamaki ekwakanyatso kugadzika kwezvinhu zvakapatsanurwa. Mumamiriro ezvinhu akajairika, QFP ine nguva isingasviki 0.65mm inofanira kuiswa pakona yayo yepamusoro; Iwo chaiwo mamisikirwo akajairwa mamakisi ePCB mwanasikana bhodhi rebhodhi anofanirwa kuiswa ari maviri maviri uye akaiswa pamakona epamusoro eiyo chaiyo yekumisikidza zvinhu.

2. Mamiriro chaiwo ekumisikidza kana maburi ekumisikidza anofanirwa kuchengeterwa zvinhu zvakakura zvemagetsi, senge I / O jacks, maikorofoni, rechargeable bhatiri jacks, toggle switch, earphone jacks, motors, nezvimwe.

Akanaka PCB dhizaini anofanirwa kufunga nezvezvinhu zvekugadzira uye kugadzira paanenge achigadzira iyo puzzle dhizaini dhizaini kuti ive nechokwadi chekugadzira uye kugadzirisa zviri nyore, kuvandudza chibereko, uye kuderedza mutengo wechigadzirwa.

 

Kubva Webhusaiti:

http://www.blkjfw.com/shejijieda/2020/0715/403.html