1.Kugona:
| layer | 1-50 layer |
| High Density Interconnect(HDI) | 2+N+2 |
| Rudzi rwezvinhu | FR-4, High TG, Halogen Yemahara, Rogers, ITEQ,ShengYi, Isola, Taconic, Arlon, Teflon, Rogers, Mhangura Yakavakirwa |
| Board ukobvu | 0.21mm kusvika 7.0mm |
| Mhangura ukobvu | 0.5 kusvika ku10 oz |
| Size | Max. Bhodhi Size: 580mm×1100mm |
| Min. Drilled Gole Size: 0.15 mm (6 mil)Maminitsi. Laser Drill 0.1mm(4mil) | |
| Min. Mutsara Upamhi: 3mil (0.075mm) | |
| Min. Mutsetse Mutsetse: 3mil (0.075mm) | |
| Surface finishing | HASL / HASL inotungamira yemahara, ENIG, Chemical Tin, Kunyudza Sirivha/Goridhe, OSP, Goridhe plating |
| Solder Mask Color | Green/Yellow/Black/White/Red/Blue |
| Kushivirira | Kushivirira kwechimiro: ± 0.13 (5mil) |
| Kushivirira kwegomba: PTH: ±0.075(3mil) NPTH: ±0.05(2mil) | |
| Chitupa | UL, ISO 9001, ISO 14001 |
| Zvinodiwa zvakakosha | Kuvigwa uye bofu kuburikidza + Inodzorwa impedance + BGA |
| Profileing | Kurova, Kufambisa, V-CUT, Beveling |
2.Products Application:
3.Factory:
4. Kufanirwa kweHigh Density Online Rogers Pcb Circuits Board:
Isu takaisa dhipatimendi rakapatsanurwa uko yakasarudzika kugadzirwa kuronga kunotevera kurongeka kwako kugadzirwa mushure mekubhadhara kwako, kusangana newako pcb kugadzirwa uye gungano zvinodiwa.
Tine pazasi qualification kuratidza pcba yedu.
5.Mutengi kushanya:
6.Package Yedu:
Isu tinoshandisa vacuum uye katoni kuputira zvinhu, kuve nechokwadi chekuti zvese zvinogona kusvika kwauri zvizere.
7.Kununura uye Kushumira:
Iwe unogona kusarudza chero kambani yekutaura yaunayo neakaundi yako, kana account yedu, kune inorema package, yegungwa yekutakura ichave iripo, zvakare.
