Fufui afifi(Dual In-line Package), also known as dual in-line packaging technology, refers to integrated circuit chips that are packaged in dual in-line form. O le numera e le sili atu le 100. O se togi afifi CPU Chip e lua laina o pine e manaʻomia ona faʻaoʻo atu i totonu o le chip socket. O le mea moni, e mafai ona tufa saʻo i totonu o se togafiti galue faʻapea foi numera tutusa o fitafita pu ma geometric faʻatulagaina mo strader. E tatau ona faʻapipiʻiina le tipiina o Chip-Packs Chips ma o le le mautonu mai le Chip Sokekes ma le tausiga faʻapitoa e aloese mai le faʻaleagaina o pine. O le DIP Packanet Force O: Major-Slti-Sourter Ceramic DIP, tasi-Sourter Ceracrac dip, storacped stress stress cress)
O le DIP SCATE E iai uiga nei:
1. Sutable mo le faʻaaogaina o le faʻaaogaina i luga o le PCB (lolomiina o le Komiti o PCB (lolomiina o le Komiti Faʻafoe)!
2. O le fua faatatau i le va o le nofoaga tutotonu ma le afifi vaega e tele, o lea o le leo e tele foi;
O le vali o le sili ona lauiloa o le Plug-i afifi, ma o ana apalai e aofia ai tulaga masani ic ic, manatua ma microcomper uaea. O le amataga o le 4004, 8008, 8086, 8088 ma isi CPA na faʻaaogaina uma ni ato tupe, ma laina e lua o le teine i luga o le Jobboard.
