DIP afifi(Dual In-line Package), fa'aigoa fo'i fa'atekonolosi fa'apipi'i lua i-laina, e fa'atatau i tupe meataalo tu'ufa'atasia o lo'o fa'apipi'iina i le fomu lua i-laina. Ole numera e masani lava e le sili atu ile 100. O le DIP packaged CPU chip e lua laina o pine e mana'omia ona fa'aofi i totonu o se pusi pu'e ma se fausaga DIP. O le mea moni, e mafai foi ona tuʻu saʻo i totonu o se laupapa matagaluega ma le numera tutusa o pu solder ma faʻatulagaina geometric mo soldering. O meataalo o lo'o fa'apipi'iina i le DIP e tatau ona fa'apipi'i ma aveese mai le soketi ma le fa'aeteete fa'apitoa ina ia 'alofia le fa'aleagaina o pine. DIP fa'apipi'i fa'apena fomu o le: tele-layer ceramic DIP DIP, tasi-layer ceramic DIP DIP, ta'ita'i fa'avaa DIP (e aofia ai tioata sima ituaiga fa'amaufa'ailoga, palasitika fausaga fausaga ituaiga, sima maualalo liusuavai ituaiga afifi tioata)

DIP package ei ai uiga nei:

1. Sutable mo perforation uelo i PCB (lolomi laupapa matagaluega), faigofie ona faagaoioia;

2. O le fua faatatau i le va o le va o le vaʻa ma le pusa afifi e tele, o lea e tele foi le voluma;

O le DIP o le pusa faʻapipiʻi sili ona lauiloa, ma o ana talosaga e aofia ai le IC masani, manatua ma microcomputer circuits. O le muamua 4004, 8008, 8086, 8088 ma isi PPU na faʻaaogaina uma pusa DIP, ma o laina e lua o pine i luga e mafai ona faʻapipiʻi i totonu o avanoa i luga o le motherboard pe soldered i luga o le motherboard.