Ihame: Filime kama ikorwa hejuru yumuringa hejuru yumuzunguruko, irinda byimazeyo ubuso bwumuringa mushya, kandi irashobora no gukumira okiside n’umwanda ku bushyuhe bwinshi. Ubunini bwa firime ya OSP bugenzurwa kuri micron 0.2-0.5.

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2. Ubwoko bwibikoresho bya OSP: Rosin, Actin Resin na Azole. Ibikoresho bya OSP bikoreshwa na Shenzhen United Circuits kuri ubu bikoreshwa cyane azole OSPs.

Nubuhe buryo bwo kuvura hejuru ya OSP yubuyobozi bwa PCB?

3. Ibiranga: uburinganire bwiza, nta IMC ikorwa hagati ya firime ya OSP n'umuringa wikibaho cyumuzunguruko, cyemerera kugurisha mu buryo butaziguye umudandaza wumuringa wumuringa mugihe cyo kugurisha (wettability nziza), tekinoroji yo gutunganya ubushyuhe buke, igiciro gito (igiciro gito) ) Kuri HASL), ingufu nke zikoreshwa mugihe cyo gutunganya, nibindi. Birashobora gukoreshwa kumyanya yumuzunguruko wubuhanga buke hamwe na chip packaging substrates. Ubuyobozi bwa PCB Proofing Yoko butanga ibitagenda neza: inspection kugenzura isura biragoye, ntibikwiriye kugurishwa byinshi (muri rusange bisaba inshuro eshatu); Surface Ubuso bwa firime ya OSP biroroshye gushushanya; Ibidukikije bibikwa ni byinshi; Time igihe cyo kubika ni gito.

4. Uburyo bwo kubika nigihe: amezi 6 mugupakira vacuum (ubushyuhe 15-35 ℃, ubuhehere RH≤60%).

5. Ibisabwa kuri site ya SMT: board Ikibaho cy’umuzunguruko wa OSP kigomba kubikwa ku bushyuhe buke n’ubushyuhe buke (ubushyuhe 15-35 ° C, ubuhehere RH ≤ 60%) kandi ukirinda guhura n’ibidukikije byuzuye gaze ya aside, kandi guterana bitangira muri 48 amasaha nyuma yo gupakurura paki ya OSP; ② Birasabwa kuyikoresha mu masaha 48 nyuma yuko igice kimwe kirangiye, kandi birasabwa kuzigama mu kabari gafite ubushyuhe buke aho gupakira vacuum;