Ibyingenzi biranga ikibaho cyumuzingo cyacapwe biterwa nimikorere yibibaho.Kunoza imikorere ya tekiniki yumuzunguruko wacapwe, imikorere yumuzingo wacapwe wumuzunguruko ugomba kubanza kunozwa.Kugirango uhuze ibikenewe byiterambere ryibibaho byacapwe, ibikoresho bishya Biragenda bitezwa imbere buhoro buhoro bigashyirwa mubikorwa.
Mu myaka yashize, isoko rya PCB ryahinduye intego ziva kuri mudasobwa zijya mu itumanaho, harimo sitasiyo fatizo, seriveri, hamwe na terefone zigendanwa.Ibikoresho byitumanaho bigendanwa byerekanwa na terefone zigendanwa byatumye PCBs ziyongera cyane, zoroshye, kandi zikora neza.Ikoranabuhanga ryumuzunguruko ryacapwe ntirishobora gutandukana nibikoresho bya substrate, nabyo bikubiyemo ibisabwa bya tekinike ya PCB substrates.Ibikubiye mubikoresho bya substrate ubu byateguwe mubice bidasanzwe kugirango inganda zerekanwe.
1 Icyifuzo cyumubyigano mwinshi n'umurongo mwiza
1.1 Gusaba ifu y'umuringa
PCBs zose ziratera imbere zigana ubucucike bukabije kandi butera imbere, kandi ikibaho cya HDI kiragaragara cyane.Imyaka icumi ishize, IPC yasobanuye ikibaho cya HDI nkubugari bwumurongo / umurongo (L / S) wa 0.1mm / 0.1mm na munsi.Noneho inganda ahanini zigera kuri L / S isanzwe ya 60μm, na L / S yateye imbere ya 40 mm.Ubuyapani bwa 2013 bwerekana amakuru yerekana ikarita yerekana ikarita yerekana ko muri 2014, L / S isanzwe yubuyobozi bwa HDI yari 50 mm, L / S yateye imbere yari 35μm, naho L / S yakozwe nigeragezwa yari 20 mm.
Imiterere yumuzunguruko wa PCB, uburyo bwa gakondo bwo gutondeka imiti (uburyo bwo gukuramo) nyuma yo kwifotoza hejuru yumuringa wumuringa, ntarengwa ntarengwa yuburyo bwo gukuramo bwo gukora imirongo myiza ni nka 30μm, kandi hasabwa insimburangingo yumuringa yoroheje (9 ~ 12μm).Bitewe nigiciro kinini cyumuringa muto wumuringa CCL hamwe nudusembwa twinshi mumashanyarazi yoroheje yumuringa, inganda nyinshi zitanga umuringa wa mμ 18 mm hanyuma ugakoresha etching kugirango unanure umuringa mugihe cyo gukora.Ubu buryo bufite inzira nyinshi, kugenzura ubunini bugoye, nigiciro kinini.Nibyiza gukoresha ifu yoroheje y'umuringa.Mubyongeyeho, iyo PCB umuzenguruko wa PCB L / S uri munsi ya 20 mm, ifu yumuringa yoroheje muri rusange biragoye kubyitwaramo.Irasaba umuringa wa ultra-thin umuringa (3 ~ 5μm) substrate hamwe na feri yumuringa ultra-thin ifatanye nuwitwaye.
Usibye ifiriti yoroheje y'umuringa, imirongo myiza isaba ubukana buke hejuru yumuringa wumuringa.Mubisanzwe, kugirango tunonosore imbaraga zihuza hagati yumuringa wumuringa na substrate no kwemeza imbaraga za kondora, imbaraga zumuringa zirakomera.Ubukonje bwumuringa usanzwe burenze 5 mm.Kwinjiza impinga zumuringa zumuringa muri substrate byongera imbaraga zo guhangana, ariko kugirango ugenzure neza neza insinga mugihe cyo gutonda umurongo, biroroshye ko hashyirwaho impinga ya substrate yimisozi, bigatera imiyoboro migufi hagati yumurongo cyangwa kugabanuka kwizuba. , ni ngombwa cyane kumirongo myiza.Umurongo urakomeye.Kubwibyo, umuringa wumuringa ufite ubukana buke (munsi ya 3 mkm) ndetse nuburemere buke (1.5 mm).
1.2 Ibisabwa kumpapuro za dielectric
Ikiranga tekiniki yubuyobozi bwa HDI nuko inzira yo kwiyubaka (BuildingUpProcess), ikunze gukoreshwa na resin-coater yumuringa wumuringa (RCC), cyangwa igipande cyometse kumyenda yikirahure ya epoxy yakira ikirahure hamwe numuringa wumuringa biragoye kugera kumurongo mwiza.Kugeza ubu, uburyo bwo kongeramo igice (SAP) cyangwa uburyo bunoze bwo gutunganyirizwa hamwe (MSAP) bukunze gukurikizwa, ni ukuvuga ko firime ya dielectric ikoreshwa mu gutondeka, hanyuma hakoreshwa umuringa utagira amashanyarazi ukoreshwa mu gukora umuringa umuyobozi.Kuberako umuringa ari muto cyane, biroroshye gukora imirongo myiza.
Imwe mu ngingo zingenzi zuburyo bwongeweho ni ibikoresho bya dielectric yamashanyarazi.Kugirango wuzuze ibisabwa byumurongo mwiza cyane, ibikoresho byashyizwe kumurongo bishyira imbere ibisabwa mumashanyarazi ya dielectric, insulation, kurwanya ubushyuhe, imbaraga zihuza, nibindi, hamwe nuburyo bwo guhuza n'ubuyobozi bwa HDI.Kugeza ubu, ibikoresho mpuzamahanga byitangazamakuru bya HDI byashyizwe ahagaragara cyane cyane nibicuruzwa byuruhererekane rwa ABF / GX byo mu Buyapani Ajinomoto, bikoresha epoxy resin hamwe n’ibintu bitandukanye bivura kugira ngo bongereho ifu ya organic organique kugirango bongere ubukana bwibikoresho kandi bigabanye CTE, nigitambara cya fibre fibre ni na Byakoreshejwe Kuri Kongera Ubukomere..Hariho kandi ibikoresho bisa na firime ya laminate ya Sekisui Uruganda rukora imiti mu Buyapani, kandi Ikigo cy’ubushakashatsi mu by'ikoranabuhanga cya Tayiwani nacyo cyateje imbere ibikoresho nkibi.Ibikoresho bya ABF nabyo bikomeza kunozwa no gutezwa imbere.Igisekuru gishya cyibikoresho byanduye cyane bisaba ubuso buke, kwaguka kwinshi kwumuriro, gutakaza dielectric nkeya, no gukomera gukomeye.
Mu bipfunyika bya semiconductor kwisi yose, IC packaging substrates yasimbuye ceramic substrates hamwe nubutaka kama.Ikibanza cya flip chip (FC) gipakira ibikoresho bigenda biba bito kandi bito.Noneho umurongo usanzwe ubugari / umurongo uri hagati ya 15μm, kandi bizaba byoroshye mugihe kizaza.Imikorere yabatwara ibyiciro byinshi cyane cyane isaba imitungo mike ya dielectric, coefficente yo kwagura ubushyuhe buke hamwe nubushyuhe bwinshi, hamwe no gukurikirana insimburangingo zihenze hashingiwe ku ntego zikorwa.Kugeza ubu, umusaruro mwinshi wumuzunguruko mwiza usanga ahanini ukoresha inzira ya MSPA yo gukingirwa hamwe na fayili yoroheje.Koresha uburyo bwa SAP kugirango ukore imiterere yumuzingi hamwe na L / S munsi ya 10 mm.
Iyo PCB ihindutse cyane kandi yoroheje, tekinoroji yubuyobozi ya HDI yavuye mububiko burimo intungamubiri zirimo laminates zidafite ishingiro Anylayer ihuza imiyoboro (Anylayer).Inzira iyo ari yo yose ihuza imbaho za HDI ya HDI ifite imikorere imwe iruta iyambere irimo intoki zirimo laminate HDI.Ubuso nubunini birashobora kugabanukaho 25%.Ibi bigomba gukoresha byoroheje kandi bigakomeza ibintu byiza byamashanyarazi byurwego rwa dielectric.
2 Umuvuduko mwinshi kandi wihuta cyane
Ikoranabuhanga mu itumanaho rya elegitoronike riva ku nsinga kugeza kuri simsiz, kuva kuri frequency nkeya n'umuvuduko muke kugeza kuri frequency nyinshi kandi byihuse.Imikorere ya terefone igendanwa iriho ubu yinjiye muri 4G kandi izagenda yerekeza kuri 5G, ni ukuvuga umuvuduko wo kohereza byihuse hamwe nubushobozi bunini bwo kohereza.Kuza kw'ibihe byo kubara ibicu ku isi byikubye kabiri urujya n'uruza rw'amakuru, kandi ibikoresho by'itumanaho byihuta kandi byihuta ni ibintu byanze bikunze.PCB ikwiranye numuyoboro mwinshi kandi wihuta.Usibye kugabanya ibimenyetso byangirika nigihombo mugushushanya kwizunguruka, kugumana ubunyangamugayo bwibimenyetso, no gukomeza inganda za PCB kugirango zuzuze ibisabwa, ni ngombwa kugira substrate ikora cyane.
Kugirango ukemure ikibazo cya PCB byongera umuvuduko nuburinganire bwibimenyetso, abashakashatsi bashushanya cyane cyane kubintu byo gutakaza ibimenyetso byamashanyarazi.Ibintu byingenzi byo gutoranya substrate ni dielectric ihoraho (Dk) nigihombo cya dielectric (Df).Iyo Dk iri munsi ya 4 na Df0.010, ni laminate yo hagati ya Dk / Df, kandi iyo Dk iri munsi ya 3.7 na Df0.005 iri munsi, iba hasi ya Dk / Df yo murwego rwo hejuru, ubu hariho substrate zitandukanye. kwinjira ku isoko guhitamo.
Kugeza ubu, insimburangingo ikoreshwa cyane yumurongo wumuzunguruko ni insimburangingo zishingiye kuri fluor, polifhenylene ether (PPO cyangwa PPE) ibisigarira hamwe na epoxy resin yahinduwe.Fluorine ishingiye kuri dielectric substrate, nka polytetrafluoroethylene (PTFE), ifite imiterere ya dielectric yo hasi kandi ubusanzwe ikoreshwa hejuru ya 5 GHz.Hariho kandi epoxy FR-4 cyangwa PPO substrates.
Usibye resin yavuzwe haruguru hamwe nibindi bikoresho byokoresha insuline, uburinganire bwubuso (umwirondoro) wumuringa wumuyoboro nabwo ni ikintu cyingenzi kigira ingaruka ku gutakaza ibimenyetso, bigira ingaruka ku ruhu (SkinEffect).Ingaruka yuruhu ni induction ya electromagnetic ikorwa mumurongo mugihe cyohereza ibimenyetso byumuvuduko mwinshi, kandi inductance nini hagati rwagati rwicyuma, kuburyo icyuma cyangwa ibimenyetso bikunda kwibanda hejuru yinsinga.Ubuso bwubuso bwuyobora bugira ingaruka ku gutakaza ibimenyetso byogukwirakwiza, kandi gutakaza ubuso bworoshye ni bito.
Mugihe kimwe, nubunini bwubuso bwumuringa, niko gutakaza ibimenyetso.Kubwibyo, mubikorwa nyabyo, turagerageza kugenzura ubukana bwuburebure bwumuringa hejuru bishoboka.Ubukonje ni buto bushoboka butagize ingaruka ku mbaraga zihuza.Cyane cyane kubimenyetso biri murwego ruri hejuru ya 10 GHz.Kuri 10GHz, ubukana bwumuringa bugomba kuba munsi ya 1 mm, kandi nibyiza gukoresha super-planar umuringa (hejuru ya 0.04μm).Ubuso bukabije bwumuringa wumuringa nabwo bugomba guhuzwa nubuvuzi bukwiye bwa okiside hamwe na sisitemu yo guhuza.Mu minsi ya vuba, hazaba ifu yumuringa isizwe hamwe na feza idafite umurongo, ishobora kugira imbaraga zishishwa kandi ntizigire ingaruka kubihombo bya dielectric.