Intangiriro yaBinyuze kuri Pad：
Birazwi neza ko vias (VIA) ishobora kugabanywamo ibice byacishijwe mu mwobo, umwobo wa vias uhumye hamwe na vias umwobo washyinguwe, ufite imirimo itandukanye.
Hamwe niterambere ryibicuruzwa bya elegitoronike, vias igira uruhare runini muguhuza imiyoboro ihuza imbaho zicapye.Via-in-Pad ikoreshwa cyane muri PCB na BGA (Ball Grid Array).Hamwe niterambere ridasubirwaho ryubucucike bukabije, BGA (Ball Grid Array) na SMD chip miniaturisation, ikoreshwa rya tekinoroji ya Via-in-Pad riragenda riba ngombwa.
Vias muri padi ifite ibyiza byinshi kurenza impumyi kandi zishyinguwe:
.Birakwiriye ikibuga cyiza BGA.
.Nibyiza gushushanya ubucucike buri hejuru PCB no kubika umwanya wiring.
.Gucunga neza ubushyuhe.
.Kurwanya-inductance hamwe nubundi buryo bwihuse.
.Itanga ubuso bushimishije kubigize.
.Mugabanye agace ka PCB kandi urusheho kunoza insinga.
Kubera izo nyungu, binyuze-muri-padi ikoreshwa cyane muri PCB ntoya, cyane cyane mubishushanyo bya PCB aho gukenera ubushyuhe n'umuvuduko mwinshi bisabwa hamwe na BGA nkeya.Nubwo impumyi zishyinguwe kandi zishyinguwe zifasha kongera ubucucike no kuzigama umwanya kuri PCBs, vias muri padi iracyahitamo neza kubicunga amashyanyarazi hamwe nibikoresho byihuse.
Hamwe nizewe binyuze muburyo bwo kuzuza / gufata plaque, hifashishijwe tekinoroji ya padiri irashobora gukoreshwa mugukora PCBs nyinshi cyane udakoresheje amazu yimiti no kwirinda amakosa yo kugurisha.Mubyongeyeho, ibi birashobora gutanga insinga zinyongera zihuza ibishushanyo bya BGA.
Hariho ibikoresho bitandukanye byuzuza umwobo uri mu isahani, paste ya feza na paste y'umuringa bikoreshwa cyane mubikoresho bitwara, naho resin ikoreshwa mubikoresho bitayobora.
