3 Kutentha kwakukulu ndi zofunikira zowonongeka

Ndi miniaturization, magwiridwe antchito apamwamba, komanso kutentha kwambiri kwa zida zamagetsi, zofunikira pakuwongolera kutentha kwa zida zamagetsi zikupitilirabe, ndipo imodzi mwamayankho omwe amasankhidwa ndikupanga ma board ozungulira osindikiza a thermally conductive.Chikhalidwe choyambirira cha ma PCB osagwirizana ndi kutentha ndi kutentha ndi kutentha kwa gawo lapansi.Pakalipano, kupititsa patsogolo zinthu zoyambira ndi kuwonjezeredwa kwa zodzaza kwawonjezera kutentha kwa kutentha ndi kutentha kwapakatikati, koma kusintha kwa kutentha kwa kutentha kumakhala kochepa kwambiri.Nthawi zambiri, gawo lapansi lachitsulo (IMS) kapena bolodi losindikizidwa lachitsulo limagwiritsidwa ntchito kusungunula kutentha kwa chigawo chotenthetsera, chomwe chimachepetsa voliyumu ndi mtengo poyerekeza ndi radiator yachikhalidwe ndi kuziziritsa kwa fani.

Aluminium ndi chinthu chokongola kwambiri.Lili ndi zinthu zambiri, zotsika mtengo, zabwino zamatenthedwe madutsidwe ndi mphamvu, ndipo ndi wokonda zachilengedwe.Pakalipano, magawo ambiri azitsulo kapena zitsulo zazitsulo ndi aluminiyamu yachitsulo.Ubwino wa matabwa opangidwa ndi aluminiyamu ndi osavuta komanso okwera mtengo, kulumikizana kwamagetsi odalirika, kukhathamiritsa kwakukulu kwamafuta ndi mphamvu, kutetezedwa kwachilengedwe kopanda solder komanso kutsogola, ndi zina zambiri, ndipo zitha kupangidwa ndikugwiritsa ntchito kuchokera kuzinthu zogula kupita ku magalimoto, zida zankhondo. ndi ndege.Palibe kukayikira za madutsidwe matenthedwe ndi kutentha kukana kwa gawo lapansi zitsulo.Chinsinsi chagona pakugwira ntchito kwa zomatira zotchingira pakati pa mbale yachitsulo ndi gawo lozungulira.

Pakalipano, mphamvu yoyendetsera kayendetsedwe ka kutentha imayang'ana pa ma LED.Pafupifupi 80% ya mphamvu zolowetsa za ma LED zimasinthidwa kukhala kutentha.Choncho, nkhani ya kayendetsedwe ka kutentha kwa ma LED ndi ofunika kwambiri, ndipo cholinga chake ndi kutenthetsa kutentha kwa gawo lapansi la LED.Kupangidwa kwa zinthu zosasunthika kwambiri zosagwira kutentha komanso zachilengedwe zimayala maziko olowera pamsika wowala kwambiri wa LED.

4 Zipangizo zamagetsi zosinthika komanso zosindikizidwa ndi zofunikira zina

4.1 Zofunikira za board zosinthika

The miniaturization ndi kupatulira kwa zipangizo zamagetsi mosakayikira adzagwiritsa ntchito mapepala ambiri osinthika osindikizira (FPCB) ndi ma rigid-flex printed circuit board (R-FPCB).Msika wapadziko lonse wa FPCB pano ukuyembekezeka kukhala pafupifupi madola mabiliyoni 13 aku US, ndipo kukula kwapachaka kukuyembekezeka kukhala kokwera kuposa ma PCB olimba.

Ndi kukulitsidwa kwa ntchitoyo, kuwonjezera pa kuchuluka kwa chiwerengerocho, padzakhala zofunikira zambiri zatsopano.Mafilimu a polyimide amapezeka mumtundu wopanda utoto komanso wowonekera, woyera, wakuda, ndi wachikasu, ndipo ali ndi kutentha kwakukulu komanso kutsika kwa CTE katundu, omwe ali oyenera nthawi zosiyanasiyana.Magawo amafilimu otsika mtengo a polyester amapezekanso pamsika.Zovuta zatsopano zogwirira ntchito zimaphatikizapo kukhazikika kwapamwamba, kukhazikika kwa mawonekedwe, mawonekedwe amtundu wa filimu, ndi kulumikizana kwazithunzi zazithunzi ndi kukana chilengedwe kuti zikwaniritse zofunikira zomwe zimasintha nthawi zonse za ogwiritsa ntchito.

FPCB ndi matabwa olimba a HDI ayenera kukwaniritsa zofunikira za kutumizira ma signal othamanga kwambiri komanso othamanga kwambiri.Kutayika kwa dielectric kosasintha ndi dielectric kwa magawo osinthika kuyeneranso kuyang'aniridwa.Ma polytetrafluoroethylene ndi magawo apamwamba a polyimide angagwiritsidwe ntchito kupanga kusinthasintha.Dera.Kuonjezera ufa wa inorganic ndi carbon fiber filler ku polyimide resin kumatha kupanga magawo atatu a gawo lapansi losinthika la thermally conductive substrate.Ma inorganic fillers omwe amagwiritsidwa ntchito ndi aluminium nitride (AlN), aluminium oxide (Al2O3) ndi hexagonal boron nitride (HBN).Gawoli lili ndi 1.51W/mK matenthedwe matenthedwe ndipo amatha kupirira 2.5kV kupirira voteji ndi 180 digiri kupinda mayeso.

Misika yamapulogalamu a FPCB, monga mafoni anzeru, zida zotha kuvala, zida zamankhwala, maloboti, ndi zina zambiri, imayika zofunikira zatsopano pamachitidwe a FPCB, ndikupanga zinthu zatsopano za FPCB.Monga ultra-thin flexible multilayer board, FPCB ya zigawo zinayi imachepetsedwa kuchokera ku 0.4mm mpaka 0.2mm;bolodi yosinthika yothamanga kwambiri, pogwiritsa ntchito gawo laling'ono la Dk ndi low-Df polyimide, kufika pa 5Gbps zofunikira zotumizira;lalikulu Gulu losinthika lamphamvu limagwiritsa ntchito kondakitala pamwamba pa 100μm kuti likwaniritse zosowa za mabwalo apamwamba kwambiri komanso apamwamba;The high heat dissipation metal-based flexible board ndi R-FPCB yomwe imagwiritsa ntchito gawo lachitsulo lachitsulo pang'ono;tactile flexible board imakhudzidwa ndi kupanikizika Kamba ndi electrode zimayikidwa pakati pa mafilimu awiri a polyimide kuti apange flexible tactile sensor;bolodi lotambasuka kapena bolodi lokhazikika, gawo lapansi losinthika ndi elastomer, ndipo mawonekedwe a waya wachitsulo amapangidwa bwino kuti athe kutambasula.Zachidziwikire, ma FPCB apaderawa amafunikira magawo osagwirizana.

4.2 Zofunikira zamagetsi zosindikizidwa

Zamagetsi zosindikizidwa zakula kwambiri m'zaka zaposachedwa, ndipo zikuloseredwa kuti pofika pakati pa 2020s, zamagetsi zosindikizidwa zidzakhala ndi msika woposa madola 300 biliyoni a US.Kugwiritsa ntchito makina osindikizira amagetsi kumakampani osindikizira ozungulira ndi gawo laukadaulo wosindikizidwa wadera, womwe wakhala mgwirizano mumakampani.Tekinoloje yamagetsi yosindikizidwa ndiyomwe ili pafupi kwambiri ndi FPCB.Tsopano opanga PCB ayika ndalama pamagetsi osindikizidwa.Anayamba ndi matabwa osinthika ndipo m'malo mwa matabwa osindikizidwa (PCB) ndi makina osindikizira amagetsi (PEC).Pakalipano, pali magawo ambiri ndi zipangizo za inki, ndipo pakangopita patsogolo pa ntchito ndi mtengo, zidzagwiritsidwa ntchito kwambiri.Opanga PCB sayenera kuphonya mwayi.

Ntchito yofunika kwambiri pamagetsi osindikizidwa ndi kupanga ma tag otsika mtengo a radio frequency identification (RFID), omwe amatha kusindikizidwa m'mipukutu.Kuthekera kuli m'malo owonetsera osindikizidwa, kuyatsa, ndi ma organic photovoltais.Msika waukadaulo wovala pakali pano ndi msika wabwino womwe ukutuluka.Zogulitsa zosiyanasiyana zaukadaulo wovala, monga zovala zanzeru ndi magalasi amasewera anzeru, zowunikira zochitika, zowunikira kugona, mawotchi anzeru, zomverera zowoneka bwino, makampasi oyendera, ndi zina zotero. Zozungulira zamagetsi zosinthika ndizofunikira kwambiri pazida zaukadaulo zovalira, zomwe zimathandizira kukula kwa zosinthika. zosindikizidwa zamagetsi.

Mbali yofunikira yaukadaulo wamagetsi osindikizidwa ndi zida, kuphatikiza magawo ndi inki zogwira ntchito.Magawo osinthika sali oyenera ma FPCB omwe alipo, komanso magawo apamwamba kwambiri.Pakalipano, pali zipangizo zamtundu wa dielectric zomwe zimapangidwa ndi zosakaniza za ceramics ndi ma polima resins, komanso zigawo zotentha kwambiri, zotentha zotsika komanso zosaoneka bwino zopanda mtundu., gawo lapansi la Yellow, etc.

4 Zipangizo zamagetsi zosinthika komanso zosindikizidwa ndi zofunikira zina

4.1 Zofunikira za board zosinthika

The miniaturization ndi kupatulira kwa zipangizo zamagetsi mosakayikira adzagwiritsa ntchito mapepala ambiri osinthika osindikizira (FPCB) ndi ma rigid-flex printed circuit board (R-FPCB).Msika wapadziko lonse wa FPCB pano ukuyembekezeka kukhala pafupifupi madola mabiliyoni 13 aku US, ndipo kukula kwapachaka kukuyembekezeka kukhala kokwera kuposa ma PCB olimba.

Ndi kukulitsidwa kwa ntchitoyo, kuwonjezera pa kuchuluka kwa chiwerengerocho, padzakhala zofunikira zambiri zatsopano.Mafilimu a polyimide amapezeka mumtundu wopanda utoto komanso wowonekera, woyera, wakuda, ndi wachikasu, ndipo ali ndi kutentha kwakukulu komanso kutsika kwa CTE katundu, omwe ali oyenera nthawi zosiyanasiyana.Magawo amafilimu otsika mtengo a polyester amapezekanso pamsika.Zovuta zatsopano zogwirira ntchito zimaphatikizapo kukhazikika kwapamwamba, kukhazikika kwa mawonekedwe, mawonekedwe amtundu wa filimu, ndi kulumikizana kwazithunzi zazithunzi ndi kukana chilengedwe kuti zikwaniritse zofunikira zomwe zimasintha nthawi zonse za ogwiritsa ntchito.

FPCB ndi matabwa olimba a HDI ayenera kukwaniritsa zofunikira za kutumizira ma signal othamanga kwambiri komanso othamanga kwambiri.Kutayika kwa dielectric kosasintha ndi dielectric kwa magawo osinthika kuyeneranso kuyang'aniridwa.Ma polytetrafluoroethylene ndi magawo apamwamba a polyimide angagwiritsidwe ntchito kupanga kusinthasintha.Dera.Kuonjezera ufa wa inorganic ndi carbon fiber filler ku polyimide resin kumatha kupanga magawo atatu a gawo lapansi losinthika la thermally conductive substrate.Ma inorganic fillers omwe amagwiritsidwa ntchito ndi aluminium nitride (AlN), aluminium oxide (Al2O3) ndi hexagonal boron nitride (HBN).Gawoli lili ndi 1.51W/mK matenthedwe matenthedwe ndipo amatha kupirira 2.5kV kupirira voteji ndi 180 digiri kupinda mayeso.

Misika yamapulogalamu a FPCB, monga mafoni anzeru, zida zotha kuvala, zida zamankhwala, maloboti, ndi zina zambiri, imayika zofunikira zatsopano pamachitidwe a FPCB, ndikupanga zinthu zatsopano za FPCB.Monga ultra-thin flexible multilayer board, FPCB ya zigawo zinayi imachepetsedwa kuchokera ku 0.4mm mpaka 0.2mm;bolodi yosinthika yothamanga kwambiri, pogwiritsa ntchito gawo laling'ono la Dk ndi low-Df polyimide, kufika pa 5Gbps zofunikira zotumizira;lalikulu Gulu losinthika lamphamvu limagwiritsa ntchito kondakitala pamwamba pa 100μm kuti likwaniritse zosowa za mabwalo apamwamba kwambiri komanso apamwamba;The high heat dissipation metal-based flexible board ndi R-FPCB yomwe imagwiritsa ntchito gawo lachitsulo lachitsulo pang'ono;tactile flexible board imakhudzidwa ndi kupanikizika Kamba ndi electrode zimayikidwa pakati pa mafilimu awiri a polyimide kuti apange flexible tactile sensor;bolodi lotambasuka kapena bolodi lokhazikika, gawo lapansi losinthika ndi elastomer, ndipo mawonekedwe a waya wachitsulo amapangidwa bwino kuti athe kutambasula.Zachidziwikire, ma FPCB apaderawa amafunikira magawo osagwirizana.

4.2 Zofunikira zamagetsi zosindikizidwa

Zamagetsi zosindikizidwa zakula kwambiri m'zaka zaposachedwa, ndipo zikuloseredwa kuti pofika pakati pa 2020s, zamagetsi zosindikizidwa zidzakhala ndi msika woposa madola 300 biliyoni a US.Kugwiritsa ntchito makina osindikizira amagetsi kumakampani osindikizira ozungulira ndi gawo laukadaulo wosindikizidwa wadera, womwe wakhala mgwirizano mumakampani.Tekinoloje yamagetsi yosindikizidwa ndiyomwe ili pafupi kwambiri ndi FPCB.Tsopano opanga PCB ayika ndalama pamagetsi osindikizidwa.Anayamba ndi matabwa osinthasintha ndikusintha matabwa osindikizira (PCB) ndi ma circuit electronic osindikizidwa (PEC ).Pakalipano, pali magawo ambiri ndi zipangizo za inki, ndipo pakangopita patsogolo pa ntchito ndi mtengo, zidzagwiritsidwa ntchito kwambiri.Opanga PCB sayenera kuphonya mwayi.

Ntchito yofunika kwambiri pamagetsi osindikizidwa ndi kupanga ma tag otsika mtengo a radio frequency identification (RFID), omwe amatha kusindikizidwa m'mipukutu.Kuthekera kuli m'malo owonetsera osindikizidwa, kuyatsa, ndi ma organic photovoltais.Msika waukadaulo wovala pakali pano ndi msika wabwino womwe ukutuluka.Zogulitsa zosiyanasiyana zaukadaulo wovala, monga zovala zanzeru ndi magalasi amasewera anzeru, zowunikira zochitika, zowunikira kugona, mawotchi anzeru, zomverera zowoneka bwino, makampasi oyendera, ndi zina zotero. Zozungulira zamagetsi zosinthika ndizofunikira kwambiri pazida zaukadaulo zovalira, zomwe zimathandizira kukula kwa zosinthika. zosindikizidwa zamagetsi.

Mbali yofunikira yaukadaulo wamagetsi osindikizidwa ndi zida, kuphatikiza magawo ndi inki zogwira ntchito.Magawo osinthika sali oyenera ma FPCB omwe alipo, komanso magawo apamwamba kwambiri.Pakalipano, pali zida zapansi za dielectric zomwe zimapangidwa ndi zosakaniza za ceramics ndi ma polima resins , komanso magawo otentha kwambiri, ma substrates otsika kwambiri komanso osawoneka bwino., Yellow substrate, etc.