Makhalidwe ofunikira a bolodi losindikizidwa la dera losindikizidwa zimadalira ntchito ya gawo lapansi.Kupititsa patsogolo luso laukadaulo la bolodi losindikizidwa, magwiridwe antchito agawo losindikizidwa amayenera kuwongolera kaye.Pofuna kukwaniritsa zosowa za chitukuko cha bolodi losindikizidwa, zipangizo zatsopano zosiyanasiyana Ikupangidwa pang'onopang'ono ndikugwiritsidwa ntchito.
M'zaka zaposachedwa, msika wa PCB wasintha chidwi chake kuchoka pamakompyuta kupita pakulankhulana, kuphatikiza masiteshoni, ma seva, ndi ma terminals am'manja.Zipangizo zoyankhulirana zam'manja zomwe zimayimiridwa ndi mafoni a m'manja zapangitsa ma PCB kukhala osalimba kwambiri, kuonda, komanso magwiridwe antchito apamwamba.Ukadaulo wamagawo osindikizidwa ndi osasiyanitsidwa ndi zinthu zapansi panthaka, zomwe zimaphatikizanso zofunikira zamagulu a PCB.Zomwe zili zofunika pazagawo la gawo lapansi tsopano zakonzedwa kukhala nkhani yapadera kuti afotokozere zamakampani.
1 Kufunika kwa kachulukidwe kwambiri komanso mizere yabwino
1.1 Kufuna zojambula zamkuwa
Ma PCB onse akupita ku chitukuko chapamwamba kwambiri komanso mizere yopyapyala, ndipo ma board a HDI ndiwodziwika kwambiri.Zaka khumi zapitazo, IPC idatanthauzira HDI board ngati mzere m'lifupi/mizere yotalikirana (L/S) ya 0.1mm/0.1mm ndi pansi.Tsopano makampaniwa amakwaniritsa L / S wamba 60μm, ndi L/S yapamwamba ya 40μm.Japan 2013 Baibulo unsembe luso roadmap deta ndi kuti mu 2014, ochiritsira L/S wa HDI bolodi anali 50μm, ndi L/S zapamwamba anali 35μm, ndi mayesero opangidwa L/S anali 20μm.
PCB dera mapangidwe mapangidwe, chikhalidwe mankhwala etching ndondomeko (subtractive njira) pambuyo photoimaging pa mkuwa zojambulazo gawo lapansi, malire a subtractive njira kupanga mizere zabwino ndi za 30μm, ndi woonda mkuwa zojambulazo (9 ~ 12μm) gawo lapansi chofunika.Chifukwa cha kukwera mtengo kwa zojambulazo zopyapyala zamkuwa za CCL komanso zolakwika zambiri pazojambula zopyapyala zamkuwa, mafakitale ambiri amapanga zojambula zamkuwa za 18μm kenako amagwiritsa ntchito etching kuti achepetse wosanjikiza wamkuwa panthawi yopanga.Njirayi ili ndi njira zambiri, kuwongolera makulidwe ovuta, komanso kukwera mtengo.Ndi bwino ntchito woonda mkuwa zojambulazo.Komanso, pamene PCB dera L/S ndi zosakwana 20μm, woonda mkuwa zojambulazo zambiri zovuta kusamalira.Pamafunika chojambula chamkuwa chowonda kwambiri (3 ~ 5μm) ndi chojambula chamkuwa chowonda kwambiri cholumikizidwa ndi chonyamuliracho.
Kuwonjezera pa zojambulazo zowonda zamkuwa, mizere yabwino yamakono imafuna kuuma kochepa pamwamba pa zojambulazo zamkuwa.Nthawi zambiri, pofuna kupititsa patsogolo mgwirizano pakati pa zojambulazo zamkuwa ndi gawo lapansi ndikuwonetsetsa kuti kondakitala akusenda mphamvu, wosanjikiza wazitsulo zamkuwa amawuma.Ukali wa zojambula zamkuwa wamba ndi wamkulu kuposa 5μm.Kuyika kwa nsonga zamkuwa zamkuwa kumtunda kumathandizira kukana kwa peeling, koma kuti muzitha kuwongolera kulondola kwa waya panthawi yokhotakhota, ndikosavuta kukhala ndi nsonga za gawo lapansi zotsalira, zomwe zimapangitsa kuti mabwalo afupikitsidwe pakati pa mizereyo kapena kutsika kutsika. , zomwe ndizofunikira kwambiri kwa mizere yabwino.Mzerewu ndi wovuta kwambiri.Chifukwa chake, zojambula zamkuwa zokhala ndi roughness yochepa (zosakwana 3 μm) komanso ngakhale zocheperapo (1.5 μm) zimafunika.
1.2 Kufunika kwa mapepala a dielectric laminated
Ukadaulo wa bolodi la HDI ndikuti njira yopangira (BuildingUpProcess), chojambula chamkuwa chomwe chimagwiritsidwa ntchito nthawi zambiri (RCC), kapena nsalu yotchinga yagalasi ya epoxy ndi zojambula zamkuwa ndizovuta kupeza mizere yabwino.Pakalipano, njira yowonjezera yowonjezera (SAP) kapena njira yowonjezera yowonjezera yowonjezera (MSAP) imayenera kutengedwa, ndiye kuti, filimu ya dielectric insulating imagwiritsidwa ntchito popanga stacking, ndiyeno electroless copper plating imagwiritsidwa ntchito kupanga mkuwa. kondakitala wosanjikiza.Chifukwa chakuti mkuwa ndi woonda kwambiri, n'zosavuta kupanga mizere yabwino.
Imodzi mwa mfundo zazikulu za njira yowonjezera yowonjezera ndi laminated dielectric material.Kuti akwaniritse zofunikira za mizere yabwino kwambiri, zinthu zopangidwa ndi laminated zimayika zofunikira za magetsi a dielectric, kutchinjiriza, kukana kutentha, mphamvu zomangira, etc., komanso kusintha kwa HDI board.Pakali pano, mayiko HDI laminated TV zipangizo makamaka ABF/GX mndandanda mankhwala a Japan Ajinomoto Company, amene ntchito epoxy utomoni ndi wothandizila zosiyanasiyana machiritso kuwonjezera inorganic ufa kuwongolera rigidity wa zinthu ndi kuchepetsa CTE, ndi galasi CHIKWANGWANI nsalu. imagwiritsidwanso ntchito kuonjezera kukhwima..Palinso zida zofananira zamakanema zopyapyala za Sekisui Chemical Company yaku Japan, ndipo Taiwan Industrial Technology Research Institute yapanganso zinthu zotere.Zida za ABF zimakonzedwanso ndikupangidwa mosalekeza.Mbadwo watsopano wa zida zopangira laminated makamaka umafunikira kuuma kocheperako, kukulitsa kwamafuta pang'ono, kuchepa kwa dielectric, komanso kulimbitsa kolimba kocheperako.
Pakuyika kwapadziko lonse lapansi kwa semiconductor, magawo oyikapo a IC alowa m'malo mwa ceramic ndi magawo achilengedwe.Kuchulukirachulukira kwa ma flip chip (FC) kumapakira akucheperachepera.Tsopano m'lifupi mwa mizere/mizere yotalikirana ndi 15μm, ndipo idzakhala yocheperapo mtsogolomo.Kugwira ntchito kwa chonyamulira chamitundu yambiri kumafunikira makamaka ma dielectric otsika, kuchuluka kwa kutentha kwamafuta ochepa komanso kukana kutentha kwambiri, komanso kufunafuna magawo otsika mtengo potengera zolinga zogwirira ntchito.Pakali pano, kupanga misa ya mabwalo abwino kumatengera njira ya MSPA ya kutchinjiriza laminated ndi zojambulazo zopyapyala zamkuwa.Gwiritsani ntchito njira ya SAP kupanga mapangidwe ozungulira ndi L/S osakwana 10μm.
Ma PCB akakhala onenepa komanso ocheperako, ukadaulo wa HDI board wasintha kuchoka pamiyala yokhala ndi coreless kupita ku Anylayer interconnection laminates (Anylayer).Ma board a HDI osanjikiza aliwonse omwe ali ndi ntchito yomweyo ndi abwino kuposa matabwa okhala ndi laminate HDI.Dera ndi makulidwe amatha kuchepetsedwa ndi 25%.Izi ziyenera kugwiritsa ntchito zowonda komanso kusunga magetsi abwino a dielectric layer.
2 Kuthamanga kwambiri komanso kuthamanga kwambiri
Ukadaulo wolumikizirana pakompyuta umachokera ku mawaya mpaka opanda zingwe, kuchokera kufupipafupi komanso kutsika kwambiri mpaka kuthamanga kwambiri komanso kuthamanga kwambiri.Magwiridwe amakono a foni yam'manja alowa mu 4G ndipo adzasunthira ku 5G, ndiko kuti, kuthamanga kwachangu komanso mphamvu zazikulu zotumizira.Kubwera kwa nthawi yapadziko lonse lapansi ya cloud computing kwachulukitsa kawiri kuchuluka kwa deta, ndipo zida zoyankhulirana zothamanga kwambiri komanso zothamanga kwambiri ndizosapeŵeka.PCB ndi yoyenera kufalitsa pafupipafupi komanso kuthamanga kwambiri.Kuphatikiza pa kuchepetsa kusokoneza kwa chizindikiro ndi kutayika kwa mapangidwe a dera, kusunga umphumphu wa chizindikiro, ndi kusunga PCB kupanga kuti akwaniritse zofunikira za mapangidwe, ndikofunika kukhala ndi gawo lapansi lapamwamba kwambiri.
Kuti athetse vuto la PCB kuonjezera liwiro ndi kukhulupirika chizindikiro, akatswiri opanga makamaka kuganizira mphamvu magetsi kutaya katundu.Zomwe zimafunikira pakusankhidwa kwa gawo lapansi ndi dielectric constant (Dk) ndi dielectric loss (Df).Pamene Dk ndi otsika kuposa 4 ndi Df0.010, ndi yapakati Dk/Df laminate, ndipo pamene Dk ndi yotsika kuposa 3.7 ndipo Df0.005 ndi yotsika, imakhala yochepa Dk/Df grade laminates, tsopano pali mitundu yosiyanasiyana ya substrates. kulowa mumsika kuti musankhe.
Pakalipano, magawo omwe amagwiritsidwa ntchito kwambiri pamagulu apamwamba kwambiri amakhala ma resins opangidwa ndi fluorine, polyphenylene ether (PPO kapena PPE) resins ndi epoxy resins osinthidwa.Fluorine-based dielectric substrates, monga polytetrafluoroethylene (PTFE), ali ndi mphamvu zotsika kwambiri za dielectric ndipo amagwiritsidwa ntchito pamwamba pa 5 GHz.Palinso magawo osinthidwa a epoxy FR-4 kapena PPO.
Kuphatikiza pa utomoni wotchulidwa pamwambapa ndi zipangizo zina zotetezera, kuuma kwapamwamba (mbiri) ya mkuwa wa conductor ndi chinthu chofunika kwambiri chomwe chimakhudza kutayika kwa chizindikiro, chomwe chimakhudzidwa ndi zotsatira za khungu (SkinEffect).Zotsatira zapakhungu ndizomwe zimapangidwira muwaya panthawi yotumizira ma siginecha apamwamba kwambiri, ndipo inductance ndi yayikulu pakatikati pa gawo la waya, kotero kuti pakali pano kapena chizindikiro chimakonda kuyang'ana pamwamba pa waya.Kuuma kwapamwamba kwa woyendetsa kumakhudza kutayika kwa chizindikiro chotumizira, ndipo kutayika kwa malo osalala kumakhala kochepa.
Pamafupipafupi omwewo, kuuma kwakukulu kwa mkuwa wamkuwa, kutayika kwakukulu kwa chizindikiro.Choncho, pakupanga kwenikweni, timayesetsa kulamulira roughness pamwamba mkuwa makulidwe monga momwe tingathere.Ukali ndi wocheperako momwe ungathere popanda kukhudza mphamvu yomangirira.Makamaka ma siginecha omwe ali pamwamba pa 10 GHz.Pa 10GHz, makulidwe a zojambula zamkuwa ayenera kukhala osachepera 1μm, ndipo ndi bwino kugwiritsa ntchito zojambula zamkuwa zapamwamba kwambiri (zowoneka bwino 0.04μm).Kuuma kwapamwamba kwa zojambula zamkuwa kumafunikanso kuphatikizidwa ndi mankhwala oyenera a okosijeni ndi njira yolumikizira utomoni.Posachedwapa, padzakhala zojambula zamkuwa zokhala ndi utomoni wopanda ndondomeko, zomwe zingakhale ndi mphamvu zambiri za peel ndipo sizidzakhudza kutaya kwa dielectric.