Chiyambi chaKudzera mu Pad:

Iwo amadziwika kuti vias (VIA) akhoza kugawidwa yokutidwa ndi dzenje, akhungu vias dzenje ndi kukwiriridwa vias dzenje, amene ntchito zosiyanasiyana.

Ndi chitukuko cha mankhwala pakompyuta, vias ndi mbali yofunika kwambiri interlayer interconnection wa kusindikizidwa matabwa dera. Via-in-Pad imagwiritsidwa ntchito kwambiri mu PCB yaying'ono ndi BGA (Ball Grid Array). Ndi chitukuko chosalephereka cha kuchulukana kwakukulu, BGA (Ball Grid Array) ndi SMD chip miniaturization, kugwiritsa ntchito ukadaulo wa Via-in-Pad kukukhala kofunika kwambiri.

Vias mu ziyangoyango ndi zabwino zambiri pa akhungu ndi kukwiriridwa vias:

. Oyenera phula labwino BGA.

. Ndi yabwino kupanga apamwamba kachulukidwe PCB ndi kusunga mawaya malo.

. Kuwongolera bwino kwamafuta.

. Anti-low inductance ndi mapangidwe ena othamanga kwambiri.

. Amapereka malo osalala a zigawo.

. Chepetsani malo a PCB ndikuwongoleranso ma waya.

Chifukwa cha ubwino umenewu, kudzera-mu-pad chimagwiritsidwa ntchito PCBs ang'onoang'ono, makamaka PCB mapangidwe kumene kutentha kutengerapo ndi liwiro mkulu chofunika ndi zochepa BGA phula. Ngakhale akhungu ndi kukwiriridwa vias kumathandiza kuonjezera kachulukidwe ndi kusunga malo pa PCBs, vias mu ziyangoyango akadali kusankha bwino kasamalidwe matenthedwe ndi mkulu-liwiro zigawo zikuluzikulu kapangidwe.

Ndi njira yodalirika yogwiritsira ntchito kudzaza / plating capping, teknoloji ya-in-pad ingagwiritsidwe ntchito kupanga ma PCB olemera kwambiri popanda kugwiritsa ntchito nyumba za mankhwala ndikupewa zolakwika za soldering. Kuphatikiza apo, izi zitha kupereka mawaya owonjezera olumikizira mapangidwe a BGA.

Pali zida zosiyanasiyana zodzaza dzenje mu mbale, phala la siliva ndi phala lamkuwa lomwe nthawi zambiri limagwiritsidwa ntchito popanga zinthu, ndipo utomoni umagwiritsidwa ntchito kwambiri pazinthu zopanda conductive.