Multilayer PCBamapangidwa makamaka ndi zojambula zamkuwa, prepreg, ndi core board. Pali mitundu iwiri ya zida zopangira lamination, zomwe ndizo, kapangidwe kake kazitsulo zamkuwa ndi bolodi loyambira komanso kapangidwe kake ka board ndi core board. Chojambula chamkuwa ndi core board lamination structure chimakondedwa, ndipo core board lamination structure ingagwiritsidwe ntchito pama mbale apadera (monga Rogess44350, etc.)
1.Design zofunikira pakukankhira kamangidwe Pofuna kuchepetsa warpage ya PCB, mawonekedwe a PCB lamination ayenera kukwaniritsa zofunikira za symmetry, ndiko kuti, makulidwe a zojambulazo zamkuwa, mtundu ndi makulidwe a dielectric wosanjikiza, mtundu wogawa chitsanzo. (wosanjikiza wozungulira, wosanjikiza ndege), kuyanika, ndi zina zambiri zokhudzana ndi PCB ofukula Centrosymmetric,
2.Conductor mkuwa makulidwe
(1) Makulidwe a mkuwa wa conductor omwe akuwonetsedwa pachithunzichi ndi makulidwe a mkuwa womalizidwa, ndiko kuti, makulidwe akunja kwa mkuwa ndi makulidwe a zojambula zamkuwa zapansi kuphatikiza ndi makulidwe a wosanjikiza wa electroplating, ndi makulidwe ake. wa mkati wosanjikiza zamkuwa ndi makulidwe a mkati wosanjikiza wa pansi mkuwa zojambulazo. Pazojambula, makulidwe akunja amkuwa amalembedwa kuti "makina a zojambula zamkuwa + zokutira, ndipo makulidwe amkati amkuwa amalembedwa kuti "makina a zojambula zamkuwa".
(2) Njira zodzitetezera pakugwiritsa ntchito 2OZ ndi pamwamba pa mkuwa wokhuthala Ayenera kugwiritsidwa ntchito mofananira ponseponse.
Pewani kuziyika pazigawo za L2 ndi Ln-2 momwe mungathere, ndiko kuti, zigawo zakunja zapamwamba ndi Pansi, kuti mupewe mawonekedwe a PCB osagwirizana ndi makwinya.
3. Zofunikira pakukanikiza kapangidwe
Njira yopangira lamination ndi njira yofunika kwambiri popanga PCB. The kwambiri chiwerengero cha laminations, choipitsitsa kulondola kwa mayendedwe mabowo ndi litayamba, ndipo kwambiri mapindikidwe PCB, makamaka pamene asymmetrically laminated. Lamination ali zofunika stacking, monga mkuwa makulidwe ndi dielectric makulidwe ayenera kufanana.