Kuti atsogolere kupanga ndi kupanga, PCBpcb dera bolodi jigsaw zambiri ayenera kupanga Mark mfundo, V-groove, ndi processing m'mphepete.
PCB mawonekedwe
1. Chimango (clamping m'mphepete) cha PCB splicing njira iyenera kutengera njira yotsekera yowongolera kuti iwonetsetse kuti njira yolumikizirana ya PCB siyimapunduka mosavuta pambuyo pokhazikika.
2. Kuchuluka kwa njira ya PCB splicing ndi ≤260Mm (SIEMENS mzere) kapena ≤300mm (FUJI mzere); ngati gluing basi chofunika, okwana m'lifupi PCB splicing njira ndi 125mm × 180mm.
3. Mawonekedwe a mawonekedwe a PCB boarding njira ali pafupi ndi lalikulu momwe ndingathere, ndipo tikulimbikitsidwa kugwiritsa ntchito 2 × 2, 3 × 3, ... ndi njira yokwerera; koma sikoyenera kutchula matabwa abwino ndi oipa;
pcbV-Dulani
1. Pambuyo kutsegula V-odulidwa, otsala makulidwe X ayenera (1/4～1/3) mbale makulidwe L, koma osachepera makulidwe X ayenera ≥0.4mm. Zoletsa zilipo kwa matabwa okhala ndi katundu wolemetsa, ndipo malire otsika amapezeka kwa matabwa okhala ndi katundu wopepuka.
2. Kusamuka kwa chilonda kumanzere ndi kumanja kwa V-kudula kuyenera kukhala kosakwana 0 mm; chifukwa cha malire ocheperako, njira ya V-cut splicing siyoyenera bolodi yokhala ndi makulidwe osakwana 1.3mm.
Lembani mfundo
1. Mukakhazikitsa malo osankhidwa, nthawi zambiri tulukani pamalo osakanizidwa ndi 1.5 mm okulirapo kuposa m'mphepete mwa malo osankhidwa.
2. Amagwiritsidwa ntchito pothandizira ma optics apakompyuta a makina oyika smt kuti apeze molondola ngodya yapamwamba ya bolodi ya PCB yokhala ndi zigawo za chip. Pali miyeso iwiri yosiyana. Miyezo ya kuyika kolondola kwa PCB yonse nthawi zambiri imakhala gawo limodzi. Chibale udindo wa ngodya pamwamba pa PCB; mfundo muyeso wa malo enieni a wosanjikiza PCB zamagetsi Optics zambiri pa ngodya pamwamba pa bolodi wosanjikiza PCB pcb dera.
3. Pazigawo za QFP (square flat package) yokhala ndi mawaya ≤0.5 mm ndi BGA (ball grid array package) yokhala ndi malo otalikirana ndi mpira ≤0.8 mm, kuti chiwongolero cha chip chikhale cholondola, chimayikidwa pazigawo ziwirizo. ngodya zapamwamba za IC Measuring point.
processing teknoloji mbali
1. Malire pakati pa chimango ndi bolodi lalikulu lamkati, mfundo pakati pa bolodi lalikulu ndi bolodi lalikulu sikuyenera kukhala lalikulu kapena kupitirira, ndipo m'mphepete mwa chipangizo chamagetsi ndi bolodi la dera la PCBpcb liyenera kusiya zoposa 0.5 mm zamkati. danga. Kuonetsetsa ntchito yachibadwa ya laser kudula CNC masamba.
Mabowo oyika bwino pa bolodi
1. Amagwiritsidwa ntchito pa malo enieni a bolodi lonse la PCB la gulu la dera la PCBpcb ndi zizindikiro zodziwika bwino za malo enieni a zigawo zabwino. Nthawi zonse, QFP yokhala ndi nthawi yochepera 0.65mm iyenera kukhazikitsidwa pakona yake yapamwamba; Zizindikiro zodziwika bwino za bolodi la mwana wamkazi wa PCB wa bolodi ziyenera kugwiritsidwa ntchito pawiri ndikuyalidwa m'makona apamwamba azinthu zokhazikika.
2. Zolemba zoikika bwino kapena mabowo oyika bwino ayenera kusungidwa pazinthu zazikulu zamagetsi, monga ma jacks a I / O, maikolofoni, ma jacks a batri otha kuwonjezeredwa, ma switch switch, ma earphone jacks, motors, etc.
Wopanga wabwino wa PCB akuyenera kuganizira za kapangidwe ndi kupanga popanga mapulani azithunzi kuti atsimikizire kupanga ndi kukonza kosavuta, kukonza zokolola, komanso kuchepetsa mtengo wazinthu.
Kuchokera patsamba: