1. What is Immersion Gold?
To put it simply, immersion gold is the use of chemical deposition to produce a metal coating on the surface of the circuit board through a chemical oxidation-reduction reaction.

2. Why do we need to immersion gold?
The copper on the circuit board is mainly red copper, and the copper solder joints are easily oxidized in the air, which will cause the conductivity, that is, poor tin eating or poor contact, and reduce the performance of the circuit board.

Then it is necessary to perform surface treatment on the copper solder joints. Immersion gold is to plate gold on it. Gold can effectively block the copper metal and air to prevent oxidation. Therefore, Immersion Gold is a treatment method for surface oxidation. It is a chemical reaction on the copper. The surface is covered with a layer of gold, also called gold.

3. What are the benefits of surface treatment like immersion gold?
The advantage of the immersion gold process is that the color deposited on the surface is very stable when the circuit is printed, the brightness is very good, the coating is very smooth, and the solderability is very good.

Immersion gold generally has a thickness of 1-3 Uinch. Therefore, the thickness of gold produced by the surface treatment method of Immersion Gold is generally thicker. Therefore, the surface treatment method of Immersion Gold is commonly used in key boards, gold finger boards and other circuit boards. Because gold has strong conductivity, good oxidation resistance and long service life.

4. What are the benefits of using immersion gold circuit boards?
1. Immersion gold plate is bright in color, good in color and attractive in appearance.
2. The crystal structure formed by immersion gold is easier to weld than other surface treatments, can have better performance and ensure quality.
3. Because the immersion gold board only has nickel and gold on the pad, it will not affect the signal, because the signal transmission in the skin effect is on the copper layer.
4. The metal properties of gold are relatively stable, the crystal structure is denser, and oxidation reactions are not easy to occur.
5. Since the immersion gold board only has nickel and gold on the pads, the solder mask on the circuit and the copper layer are more firmly bonded, and it is not easy to cause micro short circuits.
6. The project will not affect the distance during compensation.
7. The stress of the immersion gold plate is easier to control.

5. Immersion gold and gold fingers
The golden fingers are more straightforward, they are brass contacts, or conductors.

To be more specific, because gold has strong oxidation resistance and strong conductivity, the parts connected to the memory socket on the memory stick are plated with gold, then all signals are transmitted through the gold fingers.

Because the gold finger is composed of numerous yellow conductive contacts, the surface is gold-plated and the conductive contacts are arranged like fingers, hence the name.

In layman’s terms, the golden finger is the connecting part between the memory stick and the memory slot, and all signals are transmitted through the golden finger. The gold finger is composed of many golden conductive contacts. The gold finger is actually coated with a layer of gold on the copper clad board through a special process.

Therefore, the simple distinction is that immersion gold is a surface treatment process for circuit boards, and gold fingers are components that have signal connections and conduction on the circuit board.

In the actual market, gold fingers may not be gold on the surface.

Because of the expensive price of gold, most memories are now replaced by tin plating. Tin materials have been popular since the 1990s. At present, the “golden fingers” of motherboards, memory and graphics cards are almost all made of tin. Materials, only part of the contact points of high-performance servers/workstations will continue to be gold-plated, which is naturally expensive.