The 5G&6G antenna soft board is characterized by being able to carry high-frequency signal transmission and having good signal shielding ability to ensure that the internal signal of the antenna has less electromagnetic pollution to the external electromagnetic environment, and it can also ensure that the external electromagnetic environment has relatively low electromagnetic pollution to the internal signal of the antenna board. small.

At present, the main difficulties in the production of traditional 5G high-frequency circuit boards are laser processing and lamination. Laser processing mainly involves the production of electromagnetic shielding layer (laser through hole production), inter-layer interconnection (laser blind hole production), and the finished antenna The board shape is divided into boards (laser clean cold cutting).

The 5G circuit board has only emerged in the past two years. In terms of laser processing technology, including laser through-hole drilling/laser blind hole drilling of high-frequency circuit boards, and laser clean cold cutting, the basic starting point for global laser companies At the same time, Wuhan Iridium Technology has deployed a series of solutions in the field of 5G circuit boards and has core competitiveness.

Laser drilling solution for 5G circuit soft board
The dual-beam combination is used to form a composite laser focus, which is used for composite blind hole drilling. Compared with the secondary blind hole processing method, due to the composite laser focus, the plastic-containing blind hole has a better shrinkage consistency.

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Features of blind hole drilling for 5G circuit soft board
1) Composite laser blind hole drilling is especially suitable for blind hole drilling with glue;
2) One-time processing method of through hole and blind hole;
3) Flight drilling capability;
4) Blind hole uncovering method through hole drilling;
5) The new drilling principle breaks through the bottleneck of ultraviolet laser selection and greatly reduces the operation and maintenance cost of drilling equipment;
6) Protection of invention patent family.

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The characteristics of through-hole drilling for 5G circuit soft board
The invention patented laser drilling technology is used to achieve low temperature and low surface energy composite material through-hole drilling, low shrinkage, not easy to layer, high-quality connection between the upper and lower shielding layers, and the quality exceeds the existing market laser drilling machine.