As an important part of electronic equipment, PCBA’s repair process requires strict compliance with a series of technical specifications and operational requirements to ensure repair quality and equipment stability. This article will discuss in detail the points that need to be paid attention to when PCBA repair from many aspects, hoping to be helpful to your friends.

1, Baking requirements
In the process of PCBA board repair, baking treatment is very important.
First of all, for the new components to be installed, they must be baked and dehumidified according to their supermarket sensitivity level and storage conditions, in accordance with the relevant requirements of the “Code for the Use of moist-sensitive Components”, which can effectively remove the moisture in the components and avoid cracks, bubbles and other problems in the welding process.
Secondly, if the repair process needs to be heated to more than 110 ° C, or there are other moisture-sensitive components around the repair area, it is also necessary to bake and remove dampness according to the requirements of the specification, which can prevent high temperature damage to the components and ensure the smooth progress of the repair process.
Finally, for the moisture-sensitive components that need to be reused after repair, if the repair process of hot air reflux and infrared heating solder joints is used, it is also necessary to bake and remove humidity. If the repair process of heating the solder joint with a manual soldering iron is used, the pre-baking process can be omitted on the premise that the heating process is controlled.

2.Storage environment requirements
After baking, moisture-sensitive components, PCBA, etc., should also pay attention to the storage environment, if the storage conditions exceed the period, these components and PCBA boards must be re-baked to ensure that they have good performance and stability during use.
Therefore, when repairing, we must pay close attention to the temperature, humidity and other parameters of the storage environment to ensure that it meets the requirements of the specification, and at the same time, we should also check the baking regularly to prevent potential quality problems.

3, The number of repair heating requirements
According to the requirements of the specification, the cumulative number of rerepair heating of the component shall not exceed 4 times, the allowable number of rerepair heating of the new component shall not exceed 5 times, and the allowable number of rerepair heating of the removed reuse component shall not exceed 3 times.
These limits are in place to ensure that components and PCBA do not suffer excessive damage when heated multiple times, affecting their performance and reliability. Therefore, the number of heating times must be strictly controlled during the repair process. At the same time, the quality of components and PCBA boards that have approached or exceeded the heating frequency limit should be carefully evaluated to avoid using them for critical parts or high-reliability equipment.