News

  • Printed Circuit Board Global Market Report 2022

    Printed Circuit Board Global Market Report 2022

    Major players in the printed circuit board market are TTM Technologies, Nippon Mektron Ltd, Samsung Electro-Mechanics, Unimicron Technology Corporation, Advanced Circuits, Tripod Technology Corporation, DAEDUCK ELECTRONICS Co.Ltd., Flex Ltd., Eltek Ltd, and Sumitomo Electric Industries. The globa...
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  • 1. DIP package

    1. DIP package

    DIP package (Dual In-line Package), also known as dual in-line packaging technology, refers to integrated circuit chips that are packaged in dual in-line form. The number generally does not exceed 100. A DIP packaged CPU chip has two rows of pins that need to be inserted into a chip socket with a...
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  • Difference Between FR-4 Material and Rogers Material

    Difference Between FR-4 Material and Rogers Material

    1. FR-4 material is cheaper than Rogers material 2. Rogers material has high frequency compared to FR-4 material. 3. The Df or dissipation factor of the FR-4 material is higher than that of the Rogers material, and the signal loss is greater. 4. In terms of impedance stability, the Dk value range...
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  • Why need cover with the gold for the PCB?

    Why need cover with the gold for the PCB?

    1. Surface of PCB: OSP, HASL, Lead-free HASL, Immersion Tin, ENIG, Immersion Silver, Hard gold plating, Plating gold for whole board, gold finger, ENEPIG… OSP: low cost, good solderability, harsh storage conditions, short time, environmental technology, good welding, smooth… HASL: usually it’s m...
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  • Organic Antioxidant (OSP)

    Organic Antioxidant (OSP)

    Applicable occasions: It is estimated that about 25%-30% of PCBs currently use the OSP process, and the proportion has been rising (it is likely that the OSP process has now surpassed the spray tin and ranks first). The OSP process can be used on low-tech PCBs or high-tech PCBs, such as single-si...
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  • WHAT IS A SOLDER BALL DEFECT?

    WHAT IS A SOLDER BALL DEFECT?

    WHAT IS A SOLDER BALL DEFECT? A solder ball is one of the most common reflow defects found when applying surface mount technology to a printed circuit board. True to their name, they are a ball of solder that has separated from the main body that forms the joint fusing surface mount components to...
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  • HOW TO PREVENT A SOLDER BALL DEFECT

    HOW TO PREVENT A SOLDER BALL DEFECT

    May 18, 2022Blog, Industry News Soldering is an essential step in the creation of printed circuit boards, particularly when applying surface mount technology. Solder acts as a conductive glue that holds these essential components tight onto the surface of a board. But when proper procedures aren’...
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  • Flaws in U.S. Approach to Electronics Manufacturing Require Urgent Changes, or Nation Will Grow More Reliant on Foreign Suppliers, New Report Says

    Flaws in U.S. Approach to Electronics Manufacturing Require Urgent Changes, or Nation Will Grow More Reliant on Foreign Suppliers, New Report Says

    U.S. circuit board sector is in worse trouble than semiconductors, with potentially dire consequences Jan 24, 2022 The United States has lost its historic dominance in a foundational area of electronics technology – printed circuit boards (PCBs) – and the lack of any significant U.S. Government s...
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  • Design Requirements for PCB Structures:

    Design Requirements for PCB Structures:

    Multilayer PCB is mainly composed of copper foil, prepreg, and core board. There are two types of lamination structures, namely, the lamination structure of copper foil and core board and the lamination structure of core board and core board. The copper foil and core board lamination structure is...
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  • What problems should be paid attention to when designing FPC flexible board?

    What problems should be paid attention to when designing FPC flexible board?

    FPC flexible board is a form of circuit fabricated on a flexible finish surface, with or without a cover layer (usually used to protect FPC circuits).  Because FPC soft board can be bent, folded or repeated movement in a variety of ways, compared with ordinary hard board (PCB), has the advantages...
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  • Global Flexible Printed Circuit Boards Market Report 2021: Market to Surpass $20 Billion by 2026 – ‘Light as a Feather’ Takes Flexible Circuits to New Level

    Dublin, Feb. 07, 2022 (GLOBE NEWSWIRE) — The “Flexible Printed Circuit Boards – Global Market Trajectory & Analytics” report has been added to ResearchAndMarkets.com’s offering. Global Flexible Printed Circuit Boards Market to Reach US$20.3 Billion by the Year 20...
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  • Advantages of BGA Soldering:

    Printed circuit boards used in today’s electronics and devices have multiple electronic components compactly mounted. This is a crucial reality, as the number of electronic components on a printed circuit board increases, so does the size of the circuit board. However, extrusion printed cir...
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