News
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What is the relationship between PCB wiring, through hole and current carrying capacity?
The electrical connection between the components on the PCBA is achieved through copper foil wiring and through-holes on each layer. The electrical connection between the components on the PCBA is achieved through copper foil wiring and through-holes on each layer. Due to the different products...Read more -
Function introduction of each layer of multi-layer PCB circuit board
Multilayer circuit boards contain many types of working layers, such as: protective layer, silk screen layer, signal layer, internal layer, etc. How much do you know about these layers? The functions of each layer are different, let us Let’s take a look at what the functions of each level h...Read more -
Introduction and advantages and disadvantages of ceramic PCB board
1. Why use ceramic circuit boards Ordinary PCB is usually made of copper foil and substrate bonding, and the substrate material is mostly glass fiber (FR-4), phenolic resin (FR-3) and other materials, adhesive is usually phenolic, epoxy, etc. In the process of PCB processing due to thermal stres...Read more -
Infrared + hot air reflow soldering
In the mid-1990s, there was a trend to transfer to infrared + hot air heating in reflow soldering in Japan. It is heated by 30% infrared rays and 70% hot air as a heat carrier. The infrared hot air reflow oven effectively combines the advantages of infrared reflow and forced convection hot air r...Read more -
What is PCBA processing?
PCBA processing is a finished product of PCB bare board after SMT patch, DIP plug-in and PCBA test, quality inspection and assembly process, referred to as PCBA. The entrusting party delivers the processing project to the professional PCBA processing factory, and then waits for the finished prod...Read more -
Etching
PCB board etching process, which uses traditional chemical etching processes to corrode unprotected areas. Kind of like digging a trench, a viable but inefficient method. In the etching process, it is also divided into a positive film process and a negative film process. The positive film process...Read more -
Printed Circuit Board Global Market Report 2022
Major players in the printed circuit board market are TTM Technologies, Nippon Mektron Ltd, Samsung Electro-Mechanics, Unimicron Technology Corporation, Advanced Circuits, Tripod Technology Corporation, DAEDUCK ELECTRONICS Co.Ltd., Flex Ltd., Eltek Ltd, and Sumitomo Electric Industries. The globa...Read more -
1. DIP package
DIP package (Dual In-line Package), also known as dual in-line packaging technology, refers to integrated circuit chips that are packaged in dual in-line form. The number generally does not exceed 100. A DIP packaged CPU chip has two rows of pins that need to be inserted into a chip socket with a...Read more -
Difference Between FR-4 Material and Rogers Material
1. FR-4 material is cheaper than Rogers material 2. Rogers material has high frequency compared to FR-4 material. 3. The Df or dissipation factor of the FR-4 material is higher than that of the Rogers material, and the signal loss is greater. 4. In terms of impedance stability, the Dk value range...Read more -
Why need cover with the gold for the PCB?
1. Surface of PCB: OSP, HASL, Lead-free HASL, Immersion Tin, ENIG, Immersion Silver, Hard gold plating, Plating gold for whole board, gold finger, ENEPIG… OSP: low cost, good solderability, harsh storage conditions, short time, environmental technology, good welding, smooth… HASL: usually it’s m...Read more -
Organic Antioxidant (OSP)
Applicable occasions: It is estimated that about 25%-30% of PCBs currently use the OSP process, and the proportion has been rising (it is likely that the OSP process has now surpassed the spray tin and ranks first). The OSP process can be used on low-tech PCBs or high-tech PCBs, such as single-si...Read more -
WHAT IS A SOLDER BALL DEFECT?
WHAT IS A SOLDER BALL DEFECT? A solder ball is one of the most common reflow defects found when applying surface mount technology to a printed circuit board. True to their name, they are a ball of solder that has separated from the main body that forms the joint fusing surface mount components to...Read more
