The mainstream PCB material classification mainly includes the following: bai uses FR-4 (glass fiber cloth base), CEM-1/3 (glass fiber and paper composite substrate), FR-1 (paper-based copper clad laminate), metal base Copper clad laminates (mainly aluminum-based, a few are iron-based) are the more common types of materials currently, generally collectively referred to as rigid PCBs.

The first three are generally suitable for products requiring high-performance electronic insulation, such as FPC reinforcement boards, PCB drilling pads, glass fiber mesons, potentiometer carbon film printed glass fiber boards, precision star gears (wafer grinding), precision testing Sheets, electrical (electrical) equipment insulation stay spacers, insulation backing plates, transformer insulation plates, motor insulation parts, grinding gears, electronic switch insulation plates, etc.

The metal-based copper clad laminate is the basic material of the electronics industry, mainly used in the processing and manufacturing of printed circuit boards (PCB), which are widely used in electronic products such as televisions, radios, computers, computers, and mobile communications.