Thick film circuit refers to the manufacturing process of the circuit, which refers to the use of partial semiconductor technology to integrate discrete components, bare chips, metal connections, etc. on a ceramic substrate. Generally, the resistance is printed on the substrate and the resistance is adjusted by laser. This type of circuit packaging has a resistance accuracy of 0.5%. It is generally used in microwave and aerospace fields.

Product Features

1. Substrate material: 96% alumina or beryllium oxide ceramic

2. Conductor material: alloys such as silver, palladium, platinum, and the latest copper

3. Resistance paste: generally ruthenate series

4. Typical process: CAD–plate making–printing–drying–sintering–resistance correction–pin installation–testing

5. Reason for the name: The resistance and conductor film thickness generally exceed 10 microns, which is a bit thicker than the film thickness of the circuit formed by sputtering and other processes, so it is called thick film. Of course, the film thickness of the current process printed resistors is also less than 10 microns.

Application areas:

Mainly used in high voltage, high insulation, high frequency, high temperature, high reliability, small volume electronic products. Some application areas are listed as follows:

1. Ceramic circuit boards for high-precision clock oscillators, voltage-controlled oscillators, and temperature-compensated oscillators.

2. Metallization of the ceramic substrate of the refrigerator.

3. Metallization of surface mount inductor ceramic substrates. Metallization of inductor core electrodes.

4. Power electronic control module high insulation high voltage ceramic circuit board.

5. Ceramic circuit boards for high temperature circuits in oil wells.

6. Solid state relay ceramic circuit board.

7. DC-DC module power ceramic circuit board.

8. Automobile, motorcycle regulator, ignition module.

9. Power transmitter module.