The PCB copper wire falls off (also commonly referred to as dumping copper). PCB factories all say that it is a laminate problem and requires their production factories to bear bad losses.

1. The copper foil is over-etched. The electrolytic copper foil used in the market is generally single-sided galvanized (commonly known as ashing foil) and single-sided copper-plated (commonly known as red foil). Commonly thrown copper is generally galvanized copper above 70um Foil, red foil and ash foil below 18um basically have no batch copper rejection. When the customer circuit design is better than the etching line, if the copper foil specifications are changed but the etching parameters remain unchanged, the residence time of the copper foil in the etching solution is too long. Because zinc is originally an active metal, when the copper wire on the PCB is immersed in the etching solution for a long time, it will inevitably lead to excessive side corrosion of the circuit, causing some thin circuit backing zinc layer to be completely reacted and separated from the substrate. That is, the copper wire falls off. Another situation is that there is no problem with the PCB etching parameters, but after the etching is washed with water and poor drying, the copper wire is also surrounded by the residual etching solution on the PCB surface. If it is not processed for a long time, it will also cause excessive side etching of the copper wire. Throw the copper. This situation is generally manifested as concentrating on thin lines, or during periods of humid weather, similar defects will appear on the entire PCB. Strip the copper wire to see that the color of the contact surface with the base layer (the so-called roughened surface) has changed. The color of the copper foil is different from the normal copper foil. The original copper color of the bottom layer is seen, and the peeling strength of the copper foil at the thick line is also normal.

　　2. A collision occurs locally in the PCB process, and the copper wire is separated from the substrate by external mechanical force. This poor performance is poor positioning or orientation. The dropped copper wire will have obvious twisting or scratches/impact marks in the same direction. If you peel off the copper wire at the defective part and look at the rough surface of the copper foil, you can see that the color of the rough surface of the copper foil is normal, there will be no side erosion, and the peel strength of the copper foil is normal.

　　3. The PCB circuit design is unreasonable. If a thick copper foil is used to design a circuit that is too thin, it will also cause excessive etching of the circuit and copper rejection.

2. Reasons for laminate manufacturing process:

　　 Under normal circumstances, as long as the laminate is hot pressed for more than 30 minutes, the copper foil and the prepreg will be basically completely combined, so the pressing will generally not affect the bonding force of the copper foil and the substrate in the laminate. However, in the process of stacking and stacking laminates, if the PP is contaminated or the copper foil is damaged, the bonding force between the copper foil and the substrate after lamination will also be insufficient, resulting in positioning (only for large plates) Words) or sporadic copper wires fall off, but the peel strength of the copper foil near the off wires will not be abnormal.

3. Reasons for laminate raw materials:

1. As mentioned above, ordinary electrolytic copper foils are all products that have been galvanized or copper-plated. If the peak is abnormal during the production of the wool foil, or during galvanizing/copper plating, the plating crystal branches are bad, causing the copper foil itself The peeling strength is not enough. When the bad foil pressed sheet material is made into PCB and plug-in in the electronics factory, the copper wire will fall off due to the impact of external force. This kind of poor copper rejection will not cause obvious side corrosion after peeling the copper wire to see the rough surface of the copper foil (that is, the contact surface with the substrate), but the peel strength of the entire copper foil will be poor.

2. Poor adaptability of copper foil and resin: some laminates with special properties, such as HTg sheets, are used now because of different resin systems. The curing agent used is generally PN resin, and the resin molecular chain structure is simple. The degree of crosslinking is low, and it is necessary to use copper foil with a special peak to match it. When producing laminates, the use of copper foil does not match the resin system, resulting in insufficient peeling strength of the sheet metal-clad metal foil, and poor copper wire shedding when inserting.