Multilayer boards have long played an important role in many electronic devices due to their high wiring density and stable structure; while flexible boards, with their excellent flexibility and foldability, have brought more convenience to the design of electronic products. Lots of flexibility. Nowadays, PCB board manufacturers are gradually emerging in the application of combining multi-layer boards and flexible boards. This innovative combination model can not only give full play to the advantages of both, but also overcome their respective limitations, opening up new opportunities for the development of electronic equipment. It has embarked on a new path, showing unique and significant advantages in many aspects.
I、Structure and space utilization advantages
In the design of modern electronic equipment, the optimization of space layout is very important. When combined with flexible boards, multi-layer boards provide a stable infrastructure and high wiring density, which can carry most of the core components and complex circuits. For example, in the smart phone motherboard, the multi-layer board can firmly place the processor, memory and other key chips, and achieve high-speed signal transmission between them. The flexible plate, by virtue of its flexible and folding characteristics, cleverly extends and connects in a limited space. It can bypass other components to achieve signal transmission between multi-layer boards in different areas, or connect multi-layer boards with some special location components, such as camera modules, fingerprint recognition modules, etc. This combination greatly improves the space utilization inside the electronic equipment, enabling the product to integrate more functions in a smaller volume, providing PCB manufacturers with more room for innovation in the design of complex electronic equipment PCB solutions.
II、Signal transmission characteristics advantage
Multilayer board has certain advantages in signal transmission, and its layered structure helps to control signal integrity, and can effectively reduce signal interference and reflection by rationally planning the layout of the stratum, power layer and signal layer. When the flexible plate transmits high-frequency signals, it can also show good performance due to its material characteristics and special processing technology. When the two are combined, in some application scenarios with high signal transmission requirements, such as high-speed communication equipment and high-definition video transmission equipment, they can give full play to their respective strengths. For example, in the miniaturized module of 5G base station, the multi-layer board is responsible for processing the main baseband signal transmission and control logic, and the flexible board can be used to connect the RF signal transmission line between the antenna array and the multi-layer board, reducing signal loss and ensuring high-speed and stable signal transmission, which is an effective solution for PCB board manufacturers in the face of high-performance signal transmission needs.
III、Reliability and durability benefits
Multilayer boards usually have high mechanical strength, can withstand greater external impact and vibration, and provide stable circuit support for electronic equipment. Although the flexible plate is relatively thin and soft, it also has certain tensile and bending resistance after special material treatment and process optimization. When the two are used together, they complement each other in terms of reliability. In industrial control equipment, automotive electronics and other harsh environment applications, the combination of multi-layer board and flexible board can better cope with temperature changes, mechanical vibration, electromagnetic interference and other factors. For example, in the automobile engine control system, the multi-layer board is used as the carrier of the core control circuit, and the flexible board is used to connect the sensor and the multi-layer board, even in the bumpy, high temperature and complex electromagnetic environment during the car driving, it can ensure the circuit connection is stable and reliable, and extend the service life of the entire electronic system. This is also a design pattern that PCB manufacturers can focus on when producing high-reliability products.
VI、Cost and productivity advantages
From the production point of view, the production process of multi-layer board is relatively mature, and the cost can be effectively controlled in large-scale production. Although the production process of flexible plates is more complex, not all areas need to use flexible plates when combined with multi-layer boards, and only need to use flexible plates in specific functional connection parts, thus reducing the use of flexible plates and reducing the overall cost. Moreover, the design of this combined application can simplify the overall PCB structure to a certain extent and improve production efficiency. For example, in the production of consumer electronic products such as tablet computers, the combination of multi-layer boards and flexible boards can meet the needs of thin and multi-functional products, and reduce production costs by optimizing production processes and material use under the premise of ensuring quality, so that PCB board manufacturers have more price advantages in market competition. At the same time improve the speed of product delivery.
PCB board manufacturers use multi-layer board and flexible board application mode in today’s electronic equipment manufacturing field has an important significance that can not be ignored. With significant advantages in structure and space utilization, signal transmission characteristics, reliability and durability, as well as cost and productivity, this combined application provides a strong support for innovative design and performance improvement of electronic devices. Whether it is in consumer electronics, communication equipment, industrial control, automotive electronics and other fields, it has broad application prospects.