Secundum numerum PCB stratis, dividitur in unum, duplex postesque, et multi-layer tabulae. Tria tabula processus non sunt idem.

Non est interiore iacuit processus pro uno postesque et geminus-postesque tabulata, basically secans-EXERCITATIO, sequitur-sursum processus.
Multilayer tabulis erit internum processibus

I) una panel processus fluxus
Cutting and edging → drilling → outer layer graphics → (full board gold plating) → etching → inspection → silk screen solder mask → (hot air leveling) → silk screen characters → shape processing → testing → inspection

II) Processus fluxus geminus-postesque stagni spargit tabulas
Cutting Edition molere → EXERCITATIO → Gravis Aeris Dracula → Outer Layer Graphics → Tin Planta, Etching Tin Remotionem → Print Edition Solding Mask → Aurum Plated Printing → Personae → Processing → Processing → Processing → Test

III) geminus-postesque nickel, aurum plating processus
Cutting Edition Grinding → EXERCITATIO → Gravis Aeris Dracum → Outer Layer Graphics → Nickel plating, Aurum remotionem et Etching → Secundary Solding Mask → Silius → Personae Soldr

IV) processus fluxus multi-iacuit tabula stagni spargit tabulam
Cutting et molere → EXERCITATIO positioning foramina → interiorem layer graphics → interiorem layer etching → metus → → tin laminis → metus → → screen → calidum aureum Introductio → sericum screen characters → figura processui → test → inspectionem

V) Processus fluxus Nickel, aurum plating in multilayer tabulis
Cutting et molere → EXERCITATIO positioning foramina → interiorem layer graphics → interiorem layer etching → metus → aeris aeris Type, → Mask → Typography Typographia Processing → testing → inspectionem

VI) Processus fluxus multi-iacuit laminam immersionem Nickel, aurum laminam
Cutting et molere → EXERCITATIO positioning foramina → interiorem layer graphics → interiorem layer etching → metus → → tin laminis → massa immersionem screen Aurum → Silius → Personae → figura processus → test → inspectionem.