Causa plating, ostendit quod siccum amet et aeris ffoyle laminam vinculum non est fortis, ita ut plating solutio altum, unde in "negativa phase" pars in causis;

I. altus aut humilis nuditate navitas

Subtrahere subtrahere lumen photoinitiator, quae lucis industria, erumpit in libero radicalis ad inchoare photopoolymerizmerizmerizmerizari de monomers, formatam corpus moleculis insolubilis in diluto alkali solution.
Sub nuditate, debitum ad imperfecta polymerization, in progressionem processus, in film tumor et mollit, unde in latere lineae et etiam film accumsan off, unde pauperem compositum de film et aeris;
Si nuditate est nimium, quod erit causa progressionem difficultates, sed etiam in electroplating processum erit producendum excorio, formatio plating.
Ita suus 'maximus ut control in nuditate industria.

II. High aut humilis film pressura

Cum film pressura est nimis humilis, in film superficiem potest esse inaequale aut gap inter aridam film et aeris laminam non occurrit requisitis de vi aere;
Si film pressura est excelsum, solvendo et volatile components de corrosio resistentia accumsan nimis volatile, unde in sicco amet facti fragili, electroplating inpulsa fiet et facti sunt fragilis, electroplating inpulsa fiet in erectionem, electroplating inpulsa fiet in erectione, electroplating inpulsa fiet in erectione.

III. High vel humilis film temperatus

Si film temperatus est nimis humilis, quia corrosio resistentia film non potest esse plene mollium et appropriare fluunt, unde in sicco film et aeris, Laminate superficiem adhaesionem pauperes;
If the temperature is too high due to the rapid evaporation of solvent and other volatile substances in the corrosion resistance bubble, and the dry film becomes brittle, in the electroplating shock formation of warping peel, resulting in percolation.