In MMXXIII, de valore ad global PCB industria in US pupa cecidit a 15.0% anno-in-anno
In medium et longum terminum, in industria ponere firmum incrementum. Aestimari compositis annua incrementum rate of Global PCB output a MMXXIII ad MMXXVIII est 5.4%. Ex a regional perspective, in #pcb industria in omnibus regionibus mundi quae ostensum est continua incrementum trend. Ex perspective ex productum structuram, in packaging subiectum, excelsum multi-iacuit tabula cum XVIII stratis et supra, et HDI Board erit ponere ad relative altum in altera quinque anni erit 8,8, 7,8%, et 6,2%, respectively.
For packaging substrate products, on the one hand, artificial intelligence, cloud computing, intelligent driving, the Internet of everything and other products technology upgrade and application scenario expansion, driving the electronics industry to high-end chips and advanced packaging demand growth, thus driving the global packaging substrate industry to maintain long-term growth. In particulari, quod promotus est princeps planum packaging subiectum products in altum computing potestate, integration et aliis missionibus ad ostenderet princeps incrementum trend. In alia manu, in domesticis incremento in auxilium ad progressionem de semiconductor industria, et incremento in related investment erit amplius accelerate progressionem in domesticis packaging subiecta industria. In brevi terminus, ut finem-manufacturer Semiconductor inventores paulatim redire ad normalis campester, mundi semiconductor artis mutant organization (hereinafter ad quod "WSTS" in MMXXIV Expectat in MMXXIV.
Nam PCB products, fora ut servo et notitia repono, Communications, novum industria et intelligentes incessus, et dolor electronics et permanere ut magna diu-term incrementum coegi ad industria. From the cloud perspective, with the accelerated evolution of artificial intelligence, the ICT industry's demand for high computing power and high-speed networks is becoming increasingly urgent, driving the rapid growth of demand for large-size, high-level, high-frequency and high-speed, high-level HDI, and high-heat PCB products. Ex termino parte, cum AI in mobile phones, PCs, dolor lapsum, IOT et alia productio
Cum autem continua deepenening de application of products, in demanda pro ore computing capabilities et summus celeritate notitia commutationem et transmissio in variis terminalibus applications habet ushered in explosivae incrementum. Pulsi per superius trend, in demanda ad altum frequency, princeps celeritas, integration, miniatization, tenuis et lucem, altum calor dissipatio et alia related ad crescere.