Ọrụ imewe ngwaahịa Turnkey

Ọrụ imewe ngwaahịa Turnkey

Na Fastline anyị ọkachamara na imewe na imepụta ngwaọrụ IoT.

Nhazi mmepụta ihe

Site na echiche ruo nka nka

Anyị na-ejikwa usoro nhazi ụlọ ọrụ niile. Site na ịkpụzi dijitalụ na ihe ịchọ mma na nhazi akụkụ na mgbakọ.

Nhazi ụlọ ọrụ (1)

Mmụta mekanịkal injinịa

Fastline site imewe

Mgbochi nha nke ngwaọrụ ndị nwere ike ime na-eme ka imepụta ha bụrụ nka pụrụiche. Ndị injinia anyị maara ọnyà dị na ya na otu esi agbanarị ha. Site na nka miri emi n'ọhịa, anyị na-ekpuchi akụkụ ọ bụla site na imewe site na imepụta na nchekwa onye ọrụ.

Nhazi ngwaahịa maka nrụpụta na mgbakọ (DFMandDFA)

Nhazi maka nchekwa, ntụkwasị obi, ojiji, na modularity

Eletriki na Mechanical Bill- of- Materials (BOM) njikwa

Atụmatụ ihe achọrọ (MRP)

Geometric Dimensioning na ndidi

Nyocha nchịkọta nnabata

Ịkwalite ọnụ ahịa

Kere maka n'ibu na thermal nrụgide

Ndekọ ngwaahịa

Akwụkwọ ziri ezi maka nkenke
mmepụta

Akwụkwọ zuru oke, nke ziri ezi dị mkpa maka ịkekọrịta ihe ngwaahịa chọrọ n'aka onye nrụpụta nkwekọrịta. Na Fastline, ndị otu anyị nwere ahụmahụ na-emepụta akwụkwọ na ụkpụrụ ISO nke mba ụwa, na-enye ohere mgbanwe dị nro na mmepụta ihe.

Maka akụkụ igwe na plastik

Akụkụ/SUBASSY/ASSY eserese .Nkebi/SUBASSY/ASSY CAD faịlụ .Nkebi na ASSY samples

Maka Mgbakọ Board Circuit Bipụtara

.Gerber faịlụ imewe na (Design for Manufacturing) DFM analysis
.Multiple Gerber faịlụ na a mfe nkọwa ederede README faịlụ
.Board Layer Stack elu
.Bill of Materials na nkọwa zuru ezu aha / nọmba maka ọkọlọtọ ngwugwu nke 3k + nkeji na ọtụtụ ụzọ ọzọ maka ihe ndị na-agafe agafe.
.Weta ma tinye faịlụ/ ndepụta ntinye ihe .Mgbakọ schematics
.PCB Golden Sample maka benchmarking

Maka njikwa mma ntinye na mmepụta

Akwụkwọ ntuziaka nyocha
.Nnwale ntinye maka akụkụ ọ bụla (ọ bụrụ na achọrọ) na mmepụta ka a tụrụ
.Production ule eruba maka akụkụ / SUBASSY / ASSY na Final Assembly (FA) ngwaọrụ ule usoro
.Nmepụta chọrọ na nkọwapụta
.Nnwale jigs na ihe ndozi

Nhazi ngwaike

Ọrụ kacha elu site na imewe

Nhazi ngwaike bụ isi ihe na-achọpụta ihe ịga nke ọma nke wearable. Ọkachamara anyị na-ebute ngwaike dị egwu nke na-edozi ihe ndị dị ka imepụta ike dị ala na arụmọrụ ike, yana ihe ịchọ mma na ọrụ.

Nhazi nke PCB Stack up, nhọrọ ihe na nhazi nhazi isi

Nhazi nke multilayer High - Njupụta Interconnector PCBs

Nhazi nke ụdị mgbagwoju anya Ultra-thin Flexible Printed Circuits (FPC)

Akụrụngwa na-eji ọtụtụ MCU

Mmepe nke ala - sekit njikwa ike ike (PMCs) maka obere ụdị ngwaọrụ

Mgbakọ nke Relative Dielectric Constant (εr)

Ihe mgbochi elektromagnetic (EMI) maka PCB siri ike

Mmepe nke usoro ule mgbakọ PCB

Mmejuputa nha nha eletriki na nhazi sekit nchebe nke Electrostatic Discharge (ESD).

Nhazi nke njikwa batrị na sistemu nchekwa maka mkpọ batrị LiPo

Nhazi Firmware

Iwulite na njikwa akụrụngwa kacha mma

Ikike nhazi oge nke IoT na-achọ ntinye dị elu. Iji mezuo ihe ndị a na-achọsi ike, otu ndị injinia firmware anyị ọkachamara n'ichepụta ike dị ala, nke na-arụ ọrụ nke ọma maka akụrụngwa na njikwa ike kacha mma.

Mmepe dabere na Linux Embedded, Android, RTOS, Bare-Metal

Mmepe nke biometric na ngagharị algọridim maka pulse oximetry, gyroscope / accelerometer, okpomọkụ, na galvanic skin nzaghachi (GSR) sensọ

Njikọ ikuku (BLE, Wi-fi, LTE), echekwabara n'elu ikuku (OTA)

Mmepe ngwa ngwa maka ESP (ESP32), ST (STM32), Nordic (NRF32), Unisoc (SL8541E), Mediatek (W350), Goodix (GR551), Telink (TLSR9), Mba (N32), Realtek (RTL87), Dialog (RTL87) DA14), Semtech (LR1110)

Mmepe batrị - ngwa dị mma yana FWdrivers

Nhazi modul na njikọta

Dobe ndị ọrụ jikọọ na nchekwa

Na njikọ odida obodo IoT dị oke mkpa. Modul ekwentị arụnyere na njikọta na-enye ndị ọrụ ohere ịpụpụ na ekwentị ha. Na Fastline, ndị otu ụlọ anyị na-achọ ịnye njikọ dị elu nke na-eme ka ndị ọrụ jikọọ yana nchekwa data ha.

01 Refrequency (RF) injinia ụzọ, ịme anwansị, na dakọtara

02 IoTSIM Applet maka nzikọrịta ozi ngwụcha-2 njedebe (IoTSAFE) kwadoro

03 IoT Security Foundation (IoTSF) kwadoro.

04 Mmejuputa nke SIM (eSIM)/Embedded Universal Integrated Circuit Card (eUICC) na Wafer Level Chip Scale Package (WLCSP) ma ọ bụ Ụdị Ụdị Igwe-na-igwe (MFF2)

05 RF calibration maka ikuku ikuku dị ka LTE, GSM, Wi-Fi, BT, GNSS wdg.

LDS na Chip antennas ala ụgbọ elu imewe

.Laser Direct Structuring (LDS) na Chip Antennas ala ụgbọ elu nke PCB imewe

.LDS na Chip antenna prototyping, njikarịcha na nkwado

Batrị omenala

Ike dị mma

Kọmpat dabara adaba

Iji oghere eme ihe nke ọma dị oke mkpa na teknụzụ wearable. Ya mere, batrị ga-arụ ọrụ nke ọma ma na-enye ike dị elu.
Anyị na-enyere aka n'ichepụta na imepụta isi iyi ike iji mezuo ihe achọrọ ngwaahịa nke obere ụdị ihe nrụpụta.

Nhazi modul

Nkwado

Isi mmalite nke nrụpụta

Asambodo nchekwa

Asambodo UL

Prototyping

Na-ewere teknụzụ wearable site na prototype gaa na mmepụta

Prototyping bụ isi usoro na mmepe nke teknụzụ wearable. Nke kachasị, ọ na-enye ohere maka nyocha onye ọrụ njedebe, nhazi nke ọma
nke ahụmịhe onye ọrụ ma nwee ike ịbawanye atụmatụ uru nke ngwaahịa gị. Usoro prototyping anyị na-enye ntọala siri ike maka nkwado ngwaahịa, nnakọta data na mbelata ọnụ ahịa.

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Nrụpụta

Mmepụta dị elu na ọnụ ala dị ala

Anyị na-enye ndụmọdụ na nkwado n'oge usoro mmepụta ihe. Ndị otu njikwa mmepụta anyị raara onwe ha nye iji nọgide na-emeziwanye mma ngwaahịa ma na-ebelata ọnụ ahịa nrụpụta na oge ndu.

01 Onye na-eweta ngwaahịa

02 Nhazi maka nrụpụta (DFM)

03 Mgbakọ

04 Nnwale arụ ọrụ (FCT) na njikwa ogo

05 Mbukota na ngwa agha

Asambodo ngwaahịa

Nrube isi maka ahịa ụwa

Inweta nkwekọ n'ụkpụrụ mba ụwa bụ usoro na-ewe oge, usoro mgbagwoju anya dị mkpa iji mee ka ire ere gafee mpaghara akụ na ụba. NaNgwa ngwa ngwa, Anyị na-aghọta nke ọma ụkpụrụ na usoro iji hụ na anyị ngwaahịa izute ndị a stringent ụkpụrụ.

01 Iwu ugboro redio (CE, FCC, RED, RCM)

02 Ụkpụrụ nchekwa izugbe (CE, WEEE, ROHS, REACH, CPSIA),

03 Ụkpụrụ nchekwa batrị (UL, UN 38.3, IEC-62133-2) na ndị ọzọ.

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