1. Usoro mgbakwunye

A na-eji oyi akwa ọla kọpa kemịkal maka uto ozugbo nke ahịrị ndị na-eduzi mpaghara n'elu ala na-abụghị onye ndu site n'enyemaka nke ihe mgbochi ọzọ.

Enwere ike kewaa ụzọ mgbakwunye na bọọdụ sekit na mgbakwunye zuru oke, ọkara mgbakwunye na mgbakwunye akụkụ na ụzọ ndị ọzọ dị iche iche.

2. Backpanels, Backplanes

Ọ bụ bọọdụ sekit (dị ka 0.093″,0.125″) nke a na-eji kpọnye na jikọọ bọọdụ ndị ọzọ. A na-eme nke a site n'itinye njikọ njikọ multi-pin n'ime oghere siri ike, ma ọ bụghị site na ịgbanye ya, wee jiri otu otu n'otu n'otu na waya nke njikọ ahụ na-esi na bọọdụ ahụ gafere. Enwere ike itinye njikọ ahụ iche n'ime bọọdụ sekit izugbe. N'ihi na nke a bụ a pụrụ iche osisi, ya' site oghere apụghị solder, ma ka oghere mgbidi na-eduzi waya kpọmkwem kaadị uko ojiji, otú ya àgwà na aperture chọrọ karịsịa siri ike, ya iji nke ukwu abụghị ọtụtụ, izugbe sekit osisi factory. adịghị njikere na ọ dịghị mfe ịnakwere ụdị usoro a, ma ọ fọrọ nke nta ka ọ bụrụ ọkwa dị elu nke ụlọ ọrụ pụrụ iche na United States.

3. BuildUp usoro

Nke a bụ a ọhụrụ ubi nke na-eme ka mkpa multilayer, mmalite nghọta na-enwetara site IBM SLC usoro, na ya Japanese Yasu osisi ikpe mmepụta malitere na 1989, ụzọ dabeere na omenala abụọ panel, ebe ọ bụ na abụọ elu panel mbụ keukwu àgwà. dị ka Probmer52 tupu mkpuchi mmiri mmiri photosensitive, mgbe ọkara a hardening na mmetụta uche ngwọta dị ka ime ka mines na-esote oyi akwa nke-emighị emi ụdị "echiche nke ngwa anya oghere" (Photo - Via), na mgbe ahụ ka chemical keukwu abawanye conductor nke ọla kọpa na ọla kọpa plating. oyi akwa, na mgbe akara imaging na etching, nwere ike nweta ọhụrụ waya na na n'okpuru interconnection lie oghere ma ọ bụ kpuru oghere. Nkwadebe ugboro ugboro ga-ewepụta ọnụọgụ nke ọkwa achọrọ. Usoro a nwere ike ọ bụghị naanị na-ezere ọnụ ahịa dị oke ọnụ nke mkpọpu igwe, kamakwa belata dayameta oghere na ihe na-erughị 10mil. N'ime afọ 5 ~ 6 gara aga, ụdị ọ bụla nke imebi oyi akwa ọdịnala na-agbaso teknụzụ multilayer na-aga n'ihu, na ụlọ ọrụ Europe n'okpuru nrụgide, mee usoro BuildUp dị otú ahụ, a na-edepụta ngwaahịa ndị dị ugbu a karịa ụdị 10. Ewezuga “pores nke nwere mmetụta foto”; Mgbe o wepụsịrị mkpuchi ọla kọpa nwere oghere, a na-anabata ụzọ dị iche iche "nhazi oghere" dị ka alkaline chemical Etching, Laser Ablation, na Plasma Etching maka efere organic. Na mgbakwunye, ọhụrụ Resin Coated Copper Foil (Resin Coated Copper Foil) nke etinyere na resin siri ike nke ọkara nwekwara ike iji mee efere multi-layer nke dị gịrịgịrị, nke pere mpe na nke dị nro nke nwere usoro Lamination. N'ọdịnihu, ngwaahịa eletrọnịkị nkeonwe dị iche iche ga-abụ ụdị bọọdụ bọọdụ dị mkpụmkpụ na nke dị mkpụmkpụ.

4. Cermet

A na-agwakọta ntụ ntụ seramiiki na ntụ ntụ ígwè, a na-agbakwunyekwa nrapado dị ka ụdị mkpuchi, nke nwere ike ibipụta ya n'elu ihe nkiri sekit (ma ọ bụ n'ime oyi akwa) site na fim siri ike ma ọ bụ ihe nkiri dị mkpa, dị ka ntinye "nguzogide", kama nke mpụga resistor n'oge mgbakọ.

5. Ịgbakọ ọnụ

Ọ bụ usoro bọọdụ sekit ngwakọ ngwakọ. A na-agbanye ahịrị sekit nke Thick Film Paste nke ọla dị iche iche dị oke ọnụ ahịa e bipụtara n'elu obere bọọdụ na oke okpomọkụ. A na-agbanyụ ndị na-ebu organic dị iche iche dị na mado ihe nkiri siri ike, na-ahapụ ahịrị ndị na-eduzi ígwè dị oké ọnụ ahịa ka a ga-eji dị ka wires maka njikọ.

6. Crossover

A na-akpọ ngafe akụkụ atọ nke wires abụọ n'elu osisi na njuputa mkpuchi mkpuchi n'etiti ebe nkwụsịtụ. N'ozuzu, otu agba agba ndụ ndụ gbakwunyere carbon film jumper, ma ọ bụ usoro oyi akwa n'elu na n'okpuru wiring bụ "Crossover".

7. Discreate-Wiring Board

Okwu ọzọ maka multi-wiring osisi , mere nke gburugburu enameled waya agbakwunyere na osisi na perforated na oghere. Arụmọrụ nke ụdị multiplex osisi na elu ugboro nnyefe akara dị mma karịa larịị square ahịrị etched site nkịtị PCB.

8. DYCO strate

Ọ bụ Switzerland Dyconex ụlọ ọrụ mepụtara Buildup nke Usoro na Zurich. Ọ bụ usoro akwadoro iji wepu foil ọla kọpa na oghere dị n'elu efere ahụ na mbụ, wee tinye ya na ebe oghere mechiri emechi, wee jupụta CF4, N2, O2 ka ionize na voltaji dị elu iji mepụta Plasma na-arụ ọrụ nke ukwuu. , nke enwere ike iji mebie ihe ndabere nke oghere ndị nwere oghere ma mepụta obere oghere nduzi (n'okpuru 10mil). A na-akpọ usoro azụmahịa DYCOstrate.

9. Electro-Deposited Photoresist

Eletriki fotoresistance, electrophoretic photoresistance bụ ọhụrụ "photosensitive nguzogide" usoro ewu, na mbụ eji maka ọdịdị nke mgbagwoju metal ihe "eletrịk agba", na nso nso a ewebata na "photoresistance" ngwa. Site na electroplating, ebubo colloidal ụmụ irighiri ihe nke photosensitive charged resin na- uniformly plated n'elu ọla kọpa nke sekit osisi dị ka inhibitor megide etching. Ka ọ dị ugbu a, a na-eji ya eme ihe na-emepụta ọtụtụ ihe na usoro nke ọla kọpa kpọmkwem etching nke n'ime laminate. Enwere ike itinye ụdị ED photoresist a na anode ma ọ bụ cathode n'otu n'otu dịka usoro ọrụ dị iche iche si dị, nke a na-akpọ "anode photoresist" na "cathode photoresist". Dị ka ụkpụrụ dị iche iche photosensitive, e nwere "photosensitive polymerization" (Negative Working) na" photosensitive decomposition (Positive Working) na ndị ọzọ ụdị abụọ. Ka ọ dị ugbu a, a na-ere ahịa ụdị adịghị mma nke ED photoresistance, mana enwere ike iji ya dị ka onye na-eguzogide atụmatụ. N'ihi ihe isi ike nke photosensitive na site-oghere, ọ na-apụghị iji maka image nyefe nke elu efere. Maka "ED dị mma", nke enwere ike iji dị ka onye na-ahụ maka fotoresist maka efere dị n'èzí (n'ihi akpụkpọ ahụ nke photosensitive, enweghị mmetụta nke fotoensitive na mgbidi oghere adịghị emetụta), ụlọ ọrụ ndị Japan ka na-emewanye mgbalị. tradingize ojiji nke uka mmepụta, nke mere na mmepụta nke mkpa ahịrị nwere ike mfe nweta. A na-akpọkwa okwu ahụ Electrothoretic Photoresist.

10. Flush eduzi

Ọ bụ bọọdụ sekit pụrụ iche nke na-adị larịị kpamkpam ma na-agbanye ahịrị ndị na-eduzi n'ime efere ahụ. Omume nke otu panel ya bụ iji usoro mbufe onyonyo iji kụnye akụkụ nke foil ọla kọpa nke elu osisi ahụ n'elu bọọdụ ihe eji eme ihe nke nwere ọkara siri ike. Igwe ọkụ dị elu na ụzọ nrụgide dị elu ga-abụ ahịrị osisi ahụ n'ime efere ọkara siri ike, n'otu oge iji rụchaa ọrụ siri ike nke efere resin, n'ime akara n'ime elu na bọọdụ sekit niile dị larịị. Dị ka ọ na-adịkarị, a na-ewepụ akwa ọla kọpa dị gịrịgịrị na elu sekit a na-emegharị ahụ nke mere na oyi akwa nickel 0.3mil, oyi akwa rhodium nke anụ ọhịa 20, ma ọ bụ akwa ọla edo 10 nke anụ ọhịa nwere ike ịdonye iji nye nkwụchi kọntaktị dị ala ma dị mfe na-amị amị n'oge kọntaktị na-amị amị. . Otú ọ dị, e kwesịghị iji usoro a mee ihe maka PTH, iji gbochie oghere ahụ ka ọ gbawaa mgbe ị na-agbanye. Ọ dịghị mfe iji nweta elu zuru oke nke osisi ahụ, na e kwesịghị iji ya mee ihe na okpomọkụ dị elu, ma ọ bụrụ na resin na-agbasawanye wee wepụ eriri ahụ n'elu. A makwaara dị ka Etchand-Push, Board emechara ka a na-akpọ Flush-Bonded Board ma enwere ike iji ya mee ihe maka ebumnuche pụrụ iche dị ka Rotary Switch na Wiping Contacts.

11. Frit

Na mpempe akwụkwọ Poly Thick Film (PTF), na mgbakwunye na kemịkalụ ọla dị oké ọnụ ahịa, a ka na-agbakwunye ntụ ntụ iko iji mee ka mmetụta nke condensation na adhesion na-agbaze na okpomọkụ dị elu, nke mere na mpempe akwụkwọ ahụ na-agbanye. na oghere seramiiki mkpụrụ nwere ike na-etolite a siri ike dị oké ọnụ ahịa metal sekit usoro.

12. Usoro mgbakwunye zuru oke

Ọ bụ n'elu mpempe akwụkwọ nke mkpuchi mkpuchi zuru oke, na-enweghị electrodeposition nke usoro ígwè (ọtụtụ ka ukwuu bụ ọla kọpa kemịkalụ), uto nke omume sekit nhọrọ, okwu ọzọ na-ezighị ezi bụ "Electroless zuru ezu".

13. Hybrid Integrated Circuit

Ọ bụ obere poselin mkpa mkpụrụ, na-ebi akwụkwọ usoro itinye mara mma metal conductive ink akara, na mgbe ahụ site elu okpomọkụ ink organic okwu ọkụ pụọ, na-ahapụ a kondokto akara n'elu, na ike mepụta elu bonding akụkụ nke ịgbado ọkụ. Ọ bụ ụdị ihe na-ebu sekit nke teknụzụ ihe nkiri gbara ọkpụrụkpụ n'etiti bọọdụ sekit e biri ebi na ngwaọrụ sekit agbakwunyere semiconductor. Na mbụ eji maka agha ma ọ bụ elu-ugboro ngwa ngwa, ngwakọ amụbawo nnọọ obere ngwa ngwa na-adịbeghị anya n'ihi na nke elu na-eri, mbelata agha ike, na ike na akpaghị aka mmepụta, nakwa dị ka na-amụba miniaturization na sophistication nke sekit mbadamba.

14. Onye na-ekwu okwu

Interposer na-ezo aka n'ígwé abụọ ọ bụla eduzi nke ihe mkpuchi ahụ na-ebugharị site n'ịgbakwunye ụfọdụ ihe ndochi anya n'ebe a ga-eduzi. Dịka ọmụmaatụ, n'ime oghere efu nke efere multilayer, ihe ndị dị ka ndochi ọlaọcha ma ọ bụ tapawa ọla kọpa iji dochie mgbidi oghere ọla kọpa nke orthodox, ma ọ bụ ihe ndị dị ka vertical unidirectional conductive roba oyi akwa, bụ ndị niile interposers nke ụdị a.

15. Laser Direct Imaging (LDI)

Ọ bụ pịa efere mmasị na akọrọ film, agaghịkwa na-eji ọjọọ ikpughe maka image nyefe, ma kama kọmputa iwu laser doo, ozugbo na akọrọ film maka ngwa ngwa ịgụ isiokwu photosensitive Onyonyo. Mgbidi dị n'akụkụ nke ihe nkiri akọrọ mgbe eserese na-adịkwu ọtọ n'ihi na ọkụ na-apụta dị ka otu ọkụ ọkụ na-etinye uche. Otú ọ dị, usoro ahụ nwere ike ịrụ ọrụ na bọọdụ ọ bụla n'otu n'otu, ya mere oke mmepụta ngwa ngwa dị ngwa ngwa karịa iji ihe nkiri na ikpughe omenala. LDI nwere ike iwepụta bọọdụ 30 nke ọkara nha kwa elekere, yabụ na ọ nwere ike ịpụta naanị oge ụfọdụ n'ụdị nyocha akwụkwọ ma ọ bụ ọnụ ahịa otu dị elu. N'ihi ọnụ ahịa dị elu nke ọmụmụ, ọ na-esiri ike ịkwalite na ụlọ ọrụ ahụ

16.Laser Maching

N'ime ụlọ ọrụ eletrọnịkị, enwere ọtụtụ nhazi ziri ezi, dị ka ịcha, ịgbado ọkụ, ịgbado ọkụ, wdg, nwekwara ike iji rụọ ọrụ ọkụ ọkụ laser, nke a na-akpọ usoro nhazi laser. LASER na-ezo aka na mbiri nke "Light Amplification Stimulated Emission of Radiation", nke ụlọ ọrụ mainland sụgharịrị dị ka "LASER" maka ntụgharị ya n'efu, ruo n'ókè. Emepụtara Laser na 1959 site n'aka ọkà mmụta sayensị America th moser, bụ onye ji otu ọkụ ọkụ mepụta ọkụ Laser na rubies. Ọtụtụ afọ nke nyocha emepụtala usoro nhazi ọhụrụ. Ewezuga ụlọ ọrụ eletrọnịkị, enwere ike iji ya na ngalaba ahụike na agha

17. Micro Wire Board

A na-akpọkarị bọọdụ sekit pụrụ iche nwere njikọ interlayer PTH dị ka MultiwireBoard. Mgbe njupụta wiring dị oke elu (160 ~ 250in / in2), mana dayameta waya dị obere (ihe na-erughị 25mil), a na-akpọkwa ya bọọdụ sekit micro-sealed.

18. Molded Cirxuit

Ọ na-eji ebu ụzọ atọ, na-eme ịkpụzi injection ma ọ bụ usoro mgbanwe iji mezue usoro nke bọọdụ sekit stereo, nke a na-akpọ sekit kpụrụ ma ọ bụ sekit njikọ sistemu.

19 . Board Muliwiring (Boọdụ Wiring pụrụ iche)
Ọ na-eji a dị gịrịgịrị enameled waya, kpọmkwem n'elu na-enweghị ọla kọpa efere maka atọ akụkụ cross-wiring, na mgbe ahụ site mkpuchi ofu na mkpọpu ala na plating oghere, multi-layer interconnect circuit osisi, nke a maara dị ka "multi-waya osisi. ". Nke a bụ PCK, ụlọ ọrụ America, ma ka Hitachi na ụlọ ọrụ Japan na-emepụta ya. MWB a nwere ike ịchekwa oge na imewe ma dabara maka obere igwe igwe nwere sekit dị mgbagwoju anya.

20. Noble Metal Tapawa

Ọ bụ a conductive mado maka oké film sekit obibi akwụkwọ. Mgbe a na-ebipụta ya na seramiiki mkpụrụ site na mbipụta ihuenyo, mgbe ahụ, a na-ere ọkụ na-ebufe organic na okpomọkụ dị elu, sekit ọla edo edo edo na-apụta. Ntụ ntụ ntụ ntụ nke agbakwunyere na tapawa ga-abụrịrị ọla dị mma iji zere nguzobe nke oxides na oke okpomọkụ. Ndị na-ere ahịa nwere ọla edo, platinum, rhodium, palladium ma ọ bụ ọla ndị ọzọ dị oke ọnụ ahịa.

21. Pads naanị bọọdụ

Na mmalite ụbọchị nke site-oghere instrumentation, ụfọdụ elu-reliability multilayer mbadamba nanị hapụrụ site-oghere na weld mgbanaka n'èzí efere ma zoo interconnecting ahịrị na ala n'ime oyi akwa iji hụ na ere ike na akara nchekwa. Ụdị ihe mgbakwunye abụọ nke bọọdụ ahụ agaghị ebi akwụkwọ ịgbado ọkụ agba akwụkwọ ndụ akwụkwọ ndụ, n'ọdịdị nlebara anya pụrụ iche, nyocha dị mma siri ike.

Ka ọ dị ugbu a n'ihi njupụta wiring na-abawanye, ọtụtụ ngwaahịa eletrọnịkị na-ebugharị (dịka ekwentị mkpanaaka), bọọdụ sekit na-eche ihu na-ahapụ naanị SMT soldering pad ma ọ bụ ahịrị ole na ole, yana njikọ nke ahịrị dị ukwuu n'ime oyi akwa, interlayer dịkwa ike. ka Ngwuputa elu na-agbajikwa kpuru oghere ma ọ bụ kpuru oghere "cover" (Pads-On-Oghere), dị ka interconnect iji belata dum oghere docking na voltaji nnukwu ọla kọpa elu mmebi, na SMT efere bụkwa Pads Naanị Board.

22. Ihe nkiri Polymer (PTF)

Ọ bụ ihe dị oké ọnụ ahịa ígwè obibi akwụkwọ tapawa eji na mmepụta nke sekit, ma ọ bụ na-ebi akwụkwọ mado na-akpụ a e biri ebi eguzogide film, na a seramiiki mkpụrụ, na ihuenyo obibi na ụdi elu okpomọkụ incineration. Mgbe a na-ere ọkụ na-ebu ihe ndị na-ebu organic, a na-emepụta usoro sekit sekit jikọtara nke ọma. A na-akpọkarị efere ndị dị otú ahụ dị ka sekit ngwakọ.

23. Usoro ihe mgbakwunye ọkara

Ọ bụ na-arụtụ aka na isi ihe nke mkpuchi, na-eto sekit kwesịrị mbụ ozugbo na chemical ọla kọpa, mgbanwe ọzọ electroplate ọla kọpa pụtara na-anọgide na thicken ọzọ, na-akpọ "Ọkara mgbakwunye" usoro.

Ọ bụrụ na ejiri usoro ọla kọpa kemịkal mee ihe maka ọkpụrụkpụ ahịrị niile, a na-akpọ usoro a “mgbakwụnye mkpokọta”. Rịba ama na nkọwapụta a dị n'elu sitere na * nkọwapụta ipc-t-50e e bipụtara na Julaị 1992, nke dị iche na nke mbụ ipc-t-50d (November 1988). Nke mbụ "D version", dị ka a na-akpọkarị na ụlọ ọrụ, na-ezo aka a mkpụrụ nke bụ ma iferi, na-adịghị eduzi, ma ọ bụ mkpa ọla kọpa foil (dị ka 1/4oz ma ọ bụ 1/8oz). A na-akwado ịnyefe ihe oyiyi nke onye na-eguzogide ihe na-adịghị mma na sekit achọrọ na-agbaze site na ọla kọpa ma ọ bụ ọla kọpa. 50E ọhụrụ ahụ ekwughị okwu ahụ "ọla kọpa dị mkpa". Oghere dị n'etiti nkwupụta abụọ ahụ buru ibu, na echiche ndị na-agụ ya yiri ka ọ sitere na Times.

24.Substractive Usoro

Ọ bụ mkpụrụ dị n'elu nke mkpochapụ ọla kọpa na-abaghị uru, usoro bọọdụ sekit a maara dị ka “usoro mbelata”, bụ isi ihe na bọọdụ sekit ruo ọtụtụ afọ. Nke a dị iche na usoro "mgbakwunye" nke ịgbakwunye ahịrị ndị na-eduzi ọla kọpa ozugbo na mkpụrụ na-enweghị ọla kọpa.

25. Okpokoro ihe nkiri sekit

A na-ebipụta PTF (Polymer Thick Film Paste), nke nwere ọla ndị dị oké ọnụ ahịa, na mkpụrụ osisi seramiiki (dị ka aluminom trioxide) wee gbaa ọkụ na okpomọkụ dị elu iji mee ka usoro sekit ahụ jiri ígwè na-eduzi ígwè, nke a na-akpọ "mmiri ihe nkiri sekit". Ọ bụ ụdị obere Circuit Hybrid. The Silver Paste Jumper na PCBS nwere otu akụkụ bụkwa ebipụta fim mana ọ dịghị mkpa ka a chụọ ya na oke okpomọkụ. A na-akpọ ahịrị ndị a na-ebipụta n'elu ihe nkiri dị iche iche "oke ihe nkiri" naanị mgbe ọkpụrụkpụ karịrị 0.1mm [4mil], a na-akpọkwa teknụzụ mmepụta nke "usoro okirikiri" dị otú ahụ "teknụzụ ihe nkiri siri ike".

26. Teknụzụ ihe nkiri dị mkpa
Ọ bụ onye na-eduzi na sekit njikọ jikọrọ ọnụ na mkpụrụ, ebe ọkpụrụkpụ na-erughị 0.1mm [4mil], nke Vacuum Evaporation mere, Pyrolytic Coating, Cathodic Sputtering, Chemical Vapor Deposition, electroplating, anodizing, wdg, nke a na-akpọ "mkpa. teknụzụ fim". Ngwaahịa bara uru nwere sekit ngwakọ ihe nkiri dị mkpa na okirikiri ihe nkiri Integrated, wdg

27. Nyefee Laminatied Circuit

Ọ bụ a ọhụrụ sekit osisi mmepụta usoro, na-eji a 93mil oké e esichara ezigbo igwe anaghị agba nchara efere, mbụ mee na-adịghị mma akọrọ film ndịna-emeputa nyefe, na mgbe ahụ elu-ọsọ ọla kọpa plating akara. Mgbe iwepu ihe nkiri akọrọ, waya igwe anaghị agba nchara efere elu nwere ike pịa na elu okpomọkụ na ọkara siri ike ihe nkiri. Mgbe ahụ, wepụ ihe igwe anaghị agba nchara efere, ị nwere ike nweta elu nke larịị sekit agbakwunyere sekit osisi. Enwere ike ịgbaso ya site na mkpọpu na oghere oghere iji nweta njikọ interlayer.

CC - 4 ọla kọpa 4; Edelectro-deposited photoresist bụ ngụkọta mgbakwunye usoro mepụtara American PCK ụlọ ọrụ na pụrụ iche ọla-free mkpụrụ (lee isiokwu pụrụ iche na 47th mbipụta nke sekit ozi magazin maka nkọwa) .Electric ìhè eguzogide IVH (Intertitial Via Hole); MLC (Multilayer Ceramic) (mpaghara inter laminar site na oghere); Obere efere PID (Photo imagible Dielectric) seramiiki multilayer sekit mbadamba; PTF (media fotosensitive) Polymer gbara ọkpụrụkpụ ihe nkiri sekit (ya na nnukwu fim mado mpempe akwụkwọ nke bọọdụ sekit e biri ebi) SLC (Surface Laminar Circuits); The n'elu mkpuchi akara bụ ọhụrụ technology bipụtara IBM Yasu laabu, Japan na June 1993. Ọ bụ a multi-layer interconnecting ahịrị na Curtain mkpuchi mkpuchi green agba na electroplating ọla kọpa n'èzí nke okpukpu abụọ-akụkụ efere, nke na-ewepụ mkpa maka. igwu mmiri na ntinye oghere na efere.