Ụkpụrụ: A na-emepụta ihe nkiri organic n'elu ọla kọpa nke bọọdụ sekit, bụ nke na-echebe elu ọla kọpa ọhụrụ, ma nwee ike igbochi oxidation na mmetọ na okpomọkụ dị elu. A na-achịkwa ọkpụrụkpụ ihe nkiri OSP na 0.2-0.5 microns.

1. Usoro nhazi: degreasing → mmiri ịsacha → micro-erosion → ịsacha mmiri → ịsacha acid → ịsacha mmiri dị ọcha → OSP → ịsacha mmiri dị ọcha → ihicha.

2. Ụdị ihe OSP: Rosin, Resin Active na Azole. Ngwa OSP nke Shenzhen United Circuits ji eme ihe ugbu a azole OSP.

Gịnị bụ OSP elu ọgwụgwọ usoro nke PCB osisi?

3. Atụmatụ: ezi flatness, ọ dịghị IMC na-guzobere n'etiti OSP film na ọla kọpa nke sekit osisi pad, ikwe kpọmkwem soldering nke solder na sekit osisi ọla kọpa n'oge soldering (ezi wettability), ala okpomọkụ nhazi technology, ala na-eri (obere na-eri) ) Maka HASL), a na-eji obere ike eme ihe n'oge nhazi, wdg. Enwere ike iji ya mee ihe na bọọdụ sekit dị ala na ihe mkpuchi mkpuchi mgbawa dị elu. PCB Proofing Yoko Board na-akpalite adịghị ike: ① nlele anya siri ike, ọ bụghị adabara maka ọtụtụ reflow soldering (na-achọkarị ugboro atọ); ② OSP ihe nkiri n'elu dị mfe ọkọ; ③ nchekwa gburugburu chọrọ dị elu; ④ oge nchekwa dị mkpụmkpụ.

4. Usoro nchekwa na oge: 6 ọnwa na oghere nkwakọ (okpomọkụ 15-35 ℃, iru mmiri RH≤60%).

5. SMT saịtị chọrọ: ① A ghaghị idobe bọọdụ sekit OSP na obere okpomọkụ na iru mmiri dị ala (okpomọkụ 15-35 ° C, iru mmiri RH ≤60%) ma zere ikpughe na gburugburu ebe jupụtara na gas acid, na mgbakọ na-amalite n'ime 48. awa mgbe ewepụchara ngwugwu OSP; ② A na-atụ aro ka ị jiri ya n'ime awa 48 ka emechara otu akụkụ ahụ, a na-atụkwa aro ka ịchekwa ya na kọbọd na-ekpo ọkụ na-ekpo ọkụ kama ịkwado nkwakọ ngwaahịa;