Multilayer PCBbụ nke ihe mejupụtara ya bụ foil ọla kọpa, prepreg, na bọọdụ isi. E nwere ụdị abụọ nke ihe owuwu lamination, ya bụ, usoro nke lamination nke foil ọla kọpa na isi bọọdụ na nhazi nke isi bọọdụ isi na bọọdụ isi. The ọla kọpa foil na isi osisi lamination Ọdịdị na-họọrọ, na isi osisi lamination Ọdịdị nwere ike iji maka pụrụ iche efere (dị ka Rogess44350, wdg) multi-layer mbadamba na ngwakọ Ọdịdị mbadamba.

1.Design chọrọ maka ịpị usoro iji belata warpage nke PCB, PCB lamination Ọdịdị kwesịrị izute symmetry chọrọ, ya bụ, ọkpụrụkpụ nke ọla kọpa foil, ụdị na ọkpụrụkpụ nke dielectric oyi akwa, ụkpụrụ nkesa ụdị. (okirikiri okirikiri, oyi akwa ụgbọ elu), lamination, wdg. metụtara PCB vetikal Centrosymmetric,

2.Conductor ọla kọpa ọkpụrụkpụ

(1) Ọkpụrụkpụ ọla kọpa nke onye na-eduzi ego a gosipụtara na eserese bụ ọkpụrụkpụ nke ọla kọpa emechara, ya bụ, ọkpụrụkpụ nke ọla kọpa dị n'elu bụ ọkpụrụkpụ nke foil ọla kọpa nke ala gbakwunyere ọkpụrụkpụ nke oyi akwa electroplating, na ọkpụrụkpụ. nke n'ime oyi akwa nke ọla kọpa bụ ọkpụrụkpụ nke n'ime oyi akwa nke ala ọla kọpa foil. Na eserese ahụ, a na-akara ọkpụrụkpụ ọla kọpa dị n'elu dị ka “ọkpụkpụ foil ọla kọpa + plating, na ọkpụrụkpụ ọla kọpa dị n'ime ka a na-akara ya dị ka “ọkpụkpụ foil ọla kọpa”.

(2) Akpachara anya maka itinye 2OZ na n'elu ọla kọpa dị n'okpuru ala ga-eji symmetrically mee ihe n'oge mkpokọta.

Zere idowe ha n'ígwé L2 na Ln-2 dị ka o kwere mee, ya bụ, elu elu elu nke abụọ nke elu na ala, ka ịzenarị elu PCB na-adịghị mma na nke wrinkred.

3. Ihe achọrọ maka nhazi usoro

Usoro lamination bụ isi usoro na PCB n'ichepụta. Ọnụ ọgụgụ nke lamination na-akawanye njọ, na-akawanye njọ nke nhazi nke oghere na diski ahụ, na-akawanye njọ na deformation nke PCB, karịsịa mgbe ọ na-asymmetrically laminated. Lamination nwere ihe achọrọ maka ikpokọta, dị ka ọkpụrụkpụ ọla kọpa na ọkpụrụkpụ dielectric ga-adakọrịrị.