Turnkey khoom tsim kev pabcuam
Ntawm Fastline peb tshwj xeeb ntawm IoT cov cuab yeej tsim thiab tsim khoom.
Tshawb xyuas peb cov kev pabcuam
Tsim kev lag luam
Los ntawm lub tswv yim mus rau craftsmanship
Peb tswj tag nrho cov txheej txheem tsim kev lag luam. Los ntawm digital sculpting thiab aesthetics mus rau qhov kev sib tw thiab kev sib dhos.
Mechanical Engineering
Fastline los ntawm kev tsim
Qhov kev txwv loj ntawm cov khoom siv hnav ua rau tsim lawv cov txuj ci tshwj xeeb. Peb cov engineers paub qhov pitfalls thiab yuav ua li cas kom zam tau lawv. Nrog kev paub tob hauv kev ua haujlwm, peb npog txhua qhov kev tsim los ntawm kev tsim khoom thiab kev nyab xeeb ntawm cov neeg siv khoom.
Cov ntaub ntawv khoom
Cov ntaub ntawv raug tseeb kom meej
ntau lawm
Ua kom tiav, cov ntaub ntawv raug yog qhov tseem ceeb rau kev sib koom cov khoom yuav tsum tau ua nrog cov chaw tsim khoom cog lus. Ntawm Fastline peb pab neeg muaj kev paub dhau los tsim cov ntaub ntawv rau thoob ntiaj teb lees paub ISO cov qauv, tso cai rau kev hloov pauv mus rau ntau lawm.
Rau cov khoom siv kho tshuab thiab cov yas
Part/SUBASSY/ASSY drawings .Part/SUBASSY/ASSY CAD cov ntaub ntawv .Part thiab ASSY qauv
Rau Printed Circuit Board Assembly
.Gerber file design thiab (Design for Manufacturing) DFM tsom xam
.Ntau cov ntaub ntawv Gerber nrog cov lus piav qhia yooj yim README cov ntaub ntawv
.Board Layer Stack up
.Txheej txheem nqi ntawm cov ntaub ntawv nrog tag nrho cov npe / cov lej rau cov qauv ntim ntau ntawm 3k+ units thiab ntau yam kev xaiv rau cov khoom siv passive
.Xaiv thiab tso cov ntaub ntawv / Cov npe tso npe tso npe .Kev sib dhos schematics
.PCB Golden Sample rau benchmarking
Rau input thiab output zoo tswj
. Cov ntawv xeem
.Input xeem rau txhua qhov (yog tias xav tau) thiab cov zis yuav ntsuas
.Production test flow rau Parts/SUBASSY/ASSY thiab Final Assembly (FA) ntaus ntawv xeem theem
.Manufacturing yuav tsum thiab specifications
.Tsim jigs thiab fixtures
Kho vajtse tsim
Peak kev ua tau zoo los ntawm kev tsim
Kev tsim kho vajtse yog qhov tseem ceeb hauv kev txiav txim siab ua tiav ntawm kev hnav khaub ncaws. Peb cov kws tshaj lij ua rau cov cuab yeej txiav-ntug uas sib npaug cov yam xws li kev tsim hluav taws xob tsawg thiab kev siv hluav taws xob, nrog rau kev zoo nkauj thiab kev ua haujlwm.
Firmware Design
Tsim kom muaj kev tswj xyuas cov peev txheej zoo
Lub sijhawm ua haujlwm ntawm lub sijhawm tiag tiag ntawm IoT yuav tsum muaj kev nkag siab ntau. Txhawm rau ua kom tau raws li cov kev xav tau no, peb pab pawg firmware engineers tshwj xeeb hauv kev tsim cov khoom siv hluav taws xob tsawg, muaj txiaj ntsig zoo rau cov peev txheej thiab kev tswj hwm lub zog.
Cellular thiab connectivity module tsim
Ua kom cov neeg siv txuas nrog thiab ruaj ntseg
Hauv kev sib txuas ntawm IoT toj roob hauv pes yog qhov tseem ceeb. Built-in cellular thiab connectivity modules cia cov neeg siv untether los ntawm lawv cov smartphones. Ntawm Fastline peb pab pawg hauv tsev yog npaj kom xa cov kev sib txuas zoo uas ua rau cov neeg siv txuas nrog thiab lawv cov ntaub ntawv ruaj ntseg.
01 Radiofrequency (RF) Path engineering, simulation, thiab sib piv
02 IoTSIM Applet for Secure End-2-End Communication (IoTSAFE) ua raws
03 IoT Security Foundation (IoTSF) ua raws.
04 Kev Ua Haujlwm ntawm Embedded SIM (eSIM) / Embedded Universal Integrated Circuit Card (eUICC) hauv Wafer Level Chip Scale Package (WLCSP) lossis Machine-to-machine Form Factor (MFF2)
05 RF calibration rau wireless interfaces xws li LTE, GSM, Wi-Fi, BT, GNSS thiab lwm yam.
LDS thiab Chip antennas hauv av tsim qauv
.Laser Direct Structuring (LDS) thiab Chip Antennas hauv av dav hlau ntawm PCB tsim
.LDS thiab Chip kav hlau txais xov prototyping, optimization, thiab validation
Kev Cai Roj Teeb
Lub zog muaj zog
Compact haum
Kev siv ntse ntawm qhov chaw yog qhov tseem ceeb hauv kev siv thev naus laus zis. Yog li ntawd, cov roj teeb yuav tsum muaj txiaj ntsig thiab muab lub zog siab ceev.
Peb pab tsim thiab tsim cov khoom siv hluav taws xob kom tau raws li cov khoom tsim nyog ntawm cov khoom siv me me.
Prototyping
Siv cov khoom siv thev naus laus zis los ntawm cov qauv mus rau kev tsim khoom
Prototyping yog cov txheej txheem tseem ceeb hauv kev tsim cov thev naus laus zis hnav. Qhov tseem ceeb tshaj plaws, nws tso cai rau kev tshawb fawb ntawm cov neeg siv kawg, kev kho kom zoo
ntawm cov neeg siv kev paub dhau los thiab tuaj yeem ua kom muaj txiaj ntsig zoo ntawm koj cov khoom. Peb cov txheej txheem prototyping muab lub hauv paus ruaj khov rau kev siv cov khoom siv, kev sau cov ntaub ntawv thiab kev txiav nqi.
Kev tsim khoom
High-quality ntau lawm ntawm tus nqi qis
Peb muab kev sab laj thiab kev txhawb nqa thoob plaws hauv kev tsim khoom. Peb pab pawg tswj hwm kev tsim khoom tau mob siab rau kev tswj hwm thiab txhim kho cov khoom zoo thaum txo cov nqi tsim khoom thiab lub sijhawm ua haujlwm.
01 Cov Khoom Muag Khoom Muag
02 Tsim rau Kev Tsim Khoom (DFM)
03 Lub Rooj Sib Tham
04 Kev Ntsuas Kev Ua Haujlwm (FCT) thiab Kev Tswj Xyuas Zoo
05 Packing thiab logistics
Daim ntawv pov thawj khoom
Ua raws li kev lag luam thoob ntiaj teb
Ua kom tau raws li cov qauv thoob ntiaj teb yog ib lub sij hawm siv, cov txheej txheem nyuaj tseem ceeb heev kom muaj kev muag khoom thoob plaws hauv cheeb tsam kev lag luam. NtawmFastline, peb nkag siab tag nrho cov hauv paus ntsiab lus thiab cov txheej txheem los xyuas kom meej tias peb cov khoom ua tau raws li cov qauv nruj no.
01 Radiofrequency txoj cai (CE, FCC, RED, RCM)
02 Cov qauv kev nyab xeeb dav dav (CE, WEEE, ROHS, REACH, CPSIA),
03 Roj Teeb Kev Nyab Xeeb Cov Qauv (UL, UN 38.3, IEC-62133-2) thiab ntau dua.
Cov piv txwv ua haujlwm
