1. Cov txheej txheem ntxiv

Cov tshuaj tooj liab txheej yog siv rau kev loj hlob ncaj qha ntawm cov kab hluav taws xob hauv zos ntawm cov khoom tsis yog tus neeg xyuas pib nrog kev pab los ntawm ib qho ntxiv inhibitor.

Txoj kev sib ntxiv hauv lub rooj tsav xwm hauv Circuit Court tuaj yeem muab faib ua tag nrho ntxiv, ib nrab ntxiv thiab ib nrab ntxiv thiab lwm txoj kev sib txawv.

2. Backpanels, Backplanes

Nws yog tuab (xws li 0.093 ", 0.125") Circuit Court board, tshwj xeeb tshaj yog siv los ntsaws thiab txuas rau lwm cov boards. Qhov no yog ua los ntawm inserting ib tug multi-pin Connector nyob rau hauv lub nruj lub qhov, tab sis tsis yog los ntawm soldering, thiab ces xaim ib tug los ntawm ib tug nyob rau hauv cov hlau los ntawm cov Connector hla lub rooj tsavxwm. Lub connector tuaj yeem muab cais tso rau hauv lub rooj sib tham dav dav. Vim qhov no yog ib tug tshwj xeeb board, nws 'los ntawm lub qhov yuav solder, tab sis cia lub qhov phab ntsa thiab qhia hlau ncaj qha daim ntawv nruj siv, yog li nws zoo thiab aperture yuav tsum nruj me ntsis, nws cov kev txiav txim kom muaj nuj nqis yog tsis ntau, feem ntau Circuit Court board Hoobkas. tsis txaus siab thiab tsis yooj yim rau kev lees txais hom kev txiav txim no, tab sis nws yuav luag dhau los ua qib siab ntawm kev lag luam tshwj xeeb hauv Tebchaws Meskas.

3. BuildUp txheej txheem

Qhov no yog ib qho tshiab ntawm kev ua rau nyias multilayer, thaum ntxov enlightenment yog muab los ntawm IBM SLC txheej txheem, nyob rau hauv nws Japanese Yasu cog kev sim ntau lawm pib nyob rau hauv 1989, txoj kev yog raws li nyob rau hauv cov tsoos ob lub vaj huam sib luag, txij li thaum ob lub vaj huam sib luag sab nrauv ua ntej kev ua tau zoo. xws li Probmer52 ua ntej txheej cov kua photosensitive, tom qab ib nrab ntawm ib tug hardening thiab rhiab heev tov zoo li ua cov mines nrog rau lwm txheej ntawm ntiav daim ntawv "sensitive qhov qhov" (Photo - Via), thiab ces mus rau cov tshuaj muaj ntau ntxiv conductor ntawm tooj liab thiab tooj liab plating. txheej, thiab tom qab kab duab thiab etching, tuaj yeem tau txais cov xov hlau tshiab thiab nrog rau qhov sib cuam tshuam hauv qab faus qhov lossis qhov qhov muag tsis pom. Rov qab txheej txheej yuav tawm los ntawm cov txheej txheem uas xav tau. Txoj kev no tuaj yeem tsis tsuas yog zam tus nqi kim ntawm cov tshuab drilling, tab sis kuj txo lub qhov taub kom tsawg dua 10mil. Tshaj li 5 ~ 6 xyoo dhau los, txhua yam ntawm kev rhuav tshem cov tsoos txheej tau txais kev ua tiav cov txheej txheem ntau lawm, nyob rau hauv European kev lag luam nyob rau hauv lub laub, ua xws li BuildUp txheej txheem, cov khoom uas twb muaj lawm muaj npe nyob rau hauv ntau tshaj 10 hom. Tsuas yog "photosensitive pores"; Tom qab tshem lub npog tooj liab nrog lub qhov, sib txawv "qhov tsim" txoj kev xws li alkaline tshuaj Etching, Laser Ablation, thiab Plasma Etching yog saws rau cov paib organic. Tsis tas li ntawd, tus tshiab Resin Coated Copper Foil (Resin Coated Copper Foil) coated nrog semi-hardened resin kuj tuaj yeem siv los ua ib qho thinner, me me thiab thinner multi-layer phaj nrog Sequential Lamination. Nyob rau hauv lub neej yav tom ntej, ntau haiv neeg ntawm tus kheej cov khoom siv hluav taws xob yuav dhau los ua qhov no nyias nyias thiab luv luv ntau txheej pawg thawj coj hauv ntiaj teb.

4. Cermet

Ceramic hmoov thiab hmoov hlau yog sib xyaw, thiab cov nplaum ntxiv yog ib hom txheej, uas tuaj yeem luam tawm ntawm lub rooj tsav xwm hauv Circuit Court (los yog txheej sab hauv) los ntawm cov yeeb yaj kiab tuab lossis nyias zaj duab xis, ua "resistor" qhov chaw, es tsis txhob sab nraud resistor thaum sib dhos.

5. Co-Firing

Nws yog txheej txheem ntawm porcelain Hybrid Circuit Board. Cov kab hluav taws xob ntawm Thick Film Paste ntawm ntau yam hlau muaj nuj nqis luam tawm rau saum npoo ntawm lub rooj tsavxwm me yog raug rho tawm haujlwm ntawm qhov kub thiab txias. Cov khoom siv sib txawv ntawm cov khoom siv hauv cov yeeb yaj kiab tuab yog hlawv tawm, tawm hauv cov kab ntawm cov khoom siv hlau zoo nkauj siv los ua cov xov hlau rau kev sib txuas.

6. Kev sib tw

Qhov kev hla peb-dimensional ntawm ob lub xov hlau ntawm lub rooj tsavxwm nto thiab qhov ntim ntawm insulating nruab nrab ntawm cov ntsiab lus poob yog hu ua. Feem ntau, ib qho xim ntsuab xim av ntxiv rau cov pa roj carbon zaj duab xis jumper, los yog txheej txheej saum toj thiab hauv qab cov xov hlau yog xws li "Crossover".

7. Discreate-Wiring Board

Lwm lo lus rau ntau lub rooj tsav xwm, yog ua los ntawm cov kab enameled puag ncig txuas rau lub rooj tsavxwm thiab perforated nrog qhov. Qhov kev ua tau zoo ntawm lub rooj tsavxwm multiplex no hauv cov kab ntau zaus kis tau tus mob zoo dua li cov kab square ca etched los ntawm PCB zoo tib yam.

8. DYCO strate

Nws yog Switzerland Dyconex tuam txhab tsim lub Buildup ntawm tus txheej txheem hauv Zurich. Nws yog ib txoj kev patented kom tshem tawm cov ntawv ci tooj liab ntawm qhov chaw ntawm qhov ntawm lub phaj saum npoo ua ntej, tom qab ntawd muab tso rau hauv qhov chaw kaw lub tshuab nqus tsev, thiab tom qab ntawd sau nws nrog CF4, N2, O2 rau ionize ntawm high voltage los tsim cov ntshav siab heev. , uas tuaj yeem siv los corrode lub hauv paus khoom ntawm perforated txoj hauj lwm thiab tsim me me qhia qhov (hauv qab 10mil). Cov txheej txheem kev lag luam hu ua DYCOstrate.

9. Electro-Deposited Photoresist

Hluav taws xob photoresistance, electrophoretic photoresistance yog ib qho tshiab "photosensitive resistance" txoj kev tsim kho, Ameslikas siv rau cov duab ntawm cov khoom hlau complex "hluav taws xob xim", tsis ntev los no qhia rau "photoresistance" daim ntawv thov. Los ntawm txoj kev ntawm electroplating, them colloidal hais ntawm photosensitive them resin yog uniformly plated rau ntawm tooj liab nto ntawm lub rooj tsavxwm Circuit Court raws li tus inhibitor tiv thaiv etching. Tam sim no, nws tau siv ntau lawm hauv cov txheej txheem ntawm tooj liab ncaj qha etching ntawm sab hauv laminate. Hom ED photoresist no tuaj yeem muab tso rau hauv anode lossis cathode raws li kev ua haujlwm sib txawv, uas yog hu ua "anode photoresist" thiab "cathode photoresist". Raws li cov txheej txheem photosensitive sib txawv, muaj "photosensitive polymerization" (Kev ua haujlwm tsis zoo) thiab "photosensitive decomposition" (Positive Working) thiab lwm yam ob hom. Tam sim no, hom tsis zoo ntawm ED photoresistance tau ua lag luam, tab sis nws tsuas yog siv tau los ua tus neeg sawv cev tiv thaiv kab mob. Vim yog qhov nyuaj ntawm photosensitive nyob rau hauv lub qhov dhau los, nws tsis tuaj yeem siv rau cov duab hloov ntawm cov phaj txheej. Raws li rau "zoo ED", uas tuaj yeem siv los ua tus neeg sawv cev photoresist rau sab nrauv phaj (vim yog cov photosensitive membrane, tsis muaj cov nyhuv photosensitive ntawm lub qhov phab ntsa tsis cuam tshuam), Japanese kev lag luam tseem tab tom nce siab rau coj mus muag siv cov khoom loj, kom cov khoom ntawm cov kab nyias nyias tuaj yeem ua tiav tau yooj yim dua. Lo lus tseem hu ua Electrothoretic Photoresist.

10. Flush Conductor

Nws yog ib tug tshwj xeeb Circuit Court board uas yog kiag li tiaj tus nyob rau hauv tsos thiab nias tag nrho cov conductor kab rau hauv lub phaj. Kev xyaum ntawm nws ib lub vaj huam sib luag yog siv cov duab hloov mus rau etch ib feem ntawm cov ntawv ci tooj liab ntawm lub rooj tsavxwm saum npoo ntawm cov khoom siv hauv paus uas yog semi-hardened. Kev kub siab thiab kev kub siab txoj kev yuav yog lub rooj tsav xwm kab rau hauv lub phaj semi-hardened, tib lub sij hawm ua kom tiav cov phaj resin hardening ua hauj lwm, rau hauv kab rau hauv qhov chaw thiab tag nrho cov vaj huam sib luag tiaj tus. Nquag, txheej txheej tooj liab nyias yog etched tawm ntawm qhov chaw retractable Circuit Court kom 0.3mil nickel txheej, 20-nti rhodium txheej, lossis 10-nti kub txheej tuaj yeem muab plated los muab kev tiv thaiv qis dua thiab yooj yim zawv zawg thaum sib cuag. . Txawm li cas los xij, txoj kev no yuav tsum tsis txhob siv rau PTH, txhawm rau tiv thaiv lub qhov tawg thaum nias. Nws tsis yog ib qho yooj yim kom ua tiav ib tug du nto ntawm lub rooj tsavxwm, thiab nws yuav tsum tsis txhob siv nyob rau hauv high kub, nyob rau hauv cov ntaub ntawv ntawm resin expands thiab ces thawb cov kab tawm ntawm qhov chaw. Kuj tseem hu ua Etchand-Push, lub Board tiav lawm hu ua Flush-Bonded Board thiab tuaj yeem siv rau lub hom phiaj tshwj xeeb xws li Kev Hloov Hloov thiab Kev Tiv Thaiv Kev Tiv Thaiv.

11. Frit

Nyob rau hauv Poly Thick Film (PTF) luam ntawv paste, ntxiv rau cov khoom siv hlau muaj txiaj ntsig, iav hmoov tseem yuav tsum tau ntxiv txhawm rau txhawm rau ua si cov nyhuv ntawm condensation thiab adhesion nyob rau hauv qhov kub-kub melting, thiaj li hais tias cov luam ntawv muab tshuaj txhuam rau. qhov dawb paug ceramic substrate tuaj yeem tsim cov khoom muaj txiaj ntsig zoo hlau hluav taws xob.

12. Cov txheej txheem puv-Additive

Nws yog nyob rau ntawm daim ntawv ntawm cov rwb thaiv tsev tiav, tsis muaj electrodeposition ntawm hlau txoj kev (feem ntau yog cov tshuaj tooj liab), kev loj hlob ntawm kev xaiv Circuit Court xyaum, lwm qhov kev qhia uas tsis yog qhov tseeb yog "Fully Electroless".

13. Hybrid Integrated Circuit Court

Nws yog ib qho me me porcelain nyias substrate, nyob rau hauv txoj kev luam ntawv los siv cov noble hlau conductive number case kab, thiab tom qab ntawd los ntawm kub kub number case organic teeb meem kub hnyiab, tawm hauv ib tug conductor kab rau ntawm qhov chaw, thiab muaj peev xwm nqa tawm qhov chaw ntawm lub vuam. Nws yog ib yam ntawm cov khoom siv hluav taws xob ntawm cov cuab yeej siv hluav taws xob tuab ntawm cov ntawv luam tawm Circuit Board thiab semiconductor integrated circuit device. Yav dhau los siv rau kev ua tub rog lossis kev siv ntau zaus, Hybrid tau loj hlob tsawg dua nyob rau xyoo tas los no vim tias nws cov nqi siab, txo qis kev ua tub rog, thiab nyuaj rau kev tsim khoom siv, nrog rau kev nce me me thiab kev ua kom zoo ntawm cov laug cam.

14. Interposer

Interposer yog hais txog ob txheej ntawm cov conductors nqa los ntawm lub cev insulating uas yog conductive los ntawm kev ntxiv ib co conductive muab tub lim rau hauv qhov chaw yuav conductive. Piv txwv li, nyob rau hauv lub qhov liab qab ntawm ib tug multilayer phaj, cov ntaub ntawv xws li sau nyiaj paste los yog tooj liab muab tshuaj txhuam los hloov lub orthodox tooj liab qhov phab ntsa, los yog cov ntaub ntawv xws li ntsug unidirectional conductive roj hmab txheej, yog tag nrho cov interposers ntawm hom no.

15. Laser Direct Imaging (LDI)

Nws yog txhawm rau nias lub phaj txuas rau cov yeeb yaj kiab qhuav, tsis siv qhov tsis zoo rau cov duab hloov chaw, tab sis tsis yog lub khoos phis tawj hais kom ua laser beam, ncaj qha rau ntawm zaj duab xis qhuav rau kev soj ntsuam sai sai photosensitive. Sab phab ntsa ntawm cov zaj duab xis qhuav tom qab kev yees duab yog ntsug ntau dua vim hais tias lub teeb emissions yog sib npaug zos rau ib tug concentrated zog beam. Txawm li cas los xij, txoj kev tsuas tuaj yeem ua haujlwm ntawm txhua lub rooj tsavxwm ib leeg xwb, yog li qhov kev tsim khoom loj tau nrawm dua li kev siv cov yeeb yaj kiab thiab cov tsoos raug. LDI tsuas tuaj yeem tsim 30 boards ntawm qhov nruab nrab ntawm ib teev, yog li nws tuaj yeem tshwm sim qee zaus hauv cov ntawv pov thawj lossis cov nqi siab. Vim yog tus nqi siab ntawm congenital, nws nyuaj rau kev txhawb nqa hauv kev lag luam

16.Laser Maching

Hauv kev lag luam hluav taws xob, muaj ntau yam kev ua tiav, xws li txiav, drilling, vuam, thiab lwm yam, kuj tuaj yeem siv los ua lub teeb lub zog laser, hu ua laser processing method. LASER yog hais txog "Light Amplification Stimulated Emission of Radiation" abbreviations, txhais li "LASER" los ntawm kev lag luam hauv av loj rau nws txoj kev txhais lus dawb, ntau ntxiv rau lub ntsiab lus. Laser tau tsim nyob rau hauv 1959 los ntawm American physicist th moser, uas siv ib tug beam ntawm lub teeb los tsim Laser lub teeb ntawm rubies. Ntau xyoo ntawm kev tshawb fawb tau tsim ib txoj kev ua tshiab. Sib nrug los ntawm kev lag luam hluav taws xob, nws kuj tuaj yeem siv rau hauv kev kho mob thiab kev ua tub rog

17. Micro Hlau Board

Lub rooj tsav xwm tshwj xeeb nrog PTH interlayer interconnection feem ntau hu ua MultiwireBoard. Thaum lub nthe ntom ntom yog heev (160 tus ~ 250in / in the me me (tsawg dua 25mil), nws tseem yog lub npe hu ua micro-sib khi Callcuit Court Board.

18. Moulded Cirxuit

Nws yog siv peb-dimensional pwm, ua Txhaj molding los yog transformation txoj kev ua kom tiav cov txheej txheem ntawm lub tso suab Circuit Court board, hu ua lub Molded Circuit Court los yog Molded system kev twb kev txuas Circuit Court

19. Muliwiring Board (Discrete Wiring Board)
Nws yog siv ib tug nyias enameled hlau, ncaj qha rau ntawm qhov chaw tsis muaj tooj liab phaj rau peb-dimensional cross-wiring, thiab ces los ntawm txheej tsau thiab drilling thiab plating qhov, lub multi-layer interconnect circuit board, hu ua "multi-wire board. ”. Qhov no yog tsim los ntawm PCK, ib lub tuam txhab Asmeskas, thiab tseem yog tsim los ntawm Hitachi nrog lub tuam txhab Japanese. Qhov MWB no tuaj yeem txuag lub sijhawm hauv kev tsim thiab tsim nyog rau cov tshuab me me nrog cov voj voog nyuaj.

20. Noble Metal Paste

Nws yog ib tug conductive muab tshuaj txhuam rau tuab zaj duab xis Circuit Court printing. Thaum nws tau luam tawm ntawm ceramic substrate los ntawm kev tshuaj ntsuam luam ntawv, thiab tom qab ntawd cov neeg nqa khoom organic raug hlawv tawm ntawm qhov kub siab, qhov ruaj khov noble hlau Circuit Court tshwm. Cov hmoov hlau conductive ntxiv rau muab tshuaj txhuam yuav tsum yog cov hlau zoo kom tsis txhob muaj cov oxides ntawm qhov kub thiab txias. Cov neeg siv khoom lag luam muaj kub, platinum, rhodium, palladium lossis lwm yam hlau zoo nkauj.

21. Pads nkaus xwb Board

Nyob rau hauv cov hnub thaum ntxov ntawm lub qhov ntsuas ntsuas, qee qhov kev ntseeg siab ntawm ntau lub boards tsuas yog tawm ntawm lub qhov thiab lub nplhaib vuam sab nraum lub phaj thiab nkaum cov kab sib txuas ntawm sab hauv qis kom ntseeg tau tias muag muaj peev xwm thiab kab kev nyab xeeb. Qhov no hom ntawm ob txheej ntxiv ntawm lub rooj tsavxwm yuav tsis tau luam tawm vuam ntsuab xim, nyob rau hauv cov tsos ntawm tshwj xeeb saib xyuas, zoo soj ntsuam yog nruj heev.

Tam sim no vim qhov kev sib txuas ntawm cov xov hluav taws xob nce ntxiv, ntau cov khoom siv hluav taws xob portable (xws li lub xov tooj ntawm tes), lub rooj sib tham hauv lub ntsej muag tawm tsuas yog SMT soldering ncoo los yog ob peb kab, thiab kev sib tshuam ntawm cov kab ntom ntom rau hauv txheej txheej, interlayer kuj nyuaj. mus rau mining qhov siab yog tawg qhov muag tsis pom qhov los yog qhov muag tsis pom qhov "npog" (Pads-On-Hole), raws li kev sib txuas kom txo tau tag nrho lub qhov docking nrog voltage loj tooj liab nto puas, SMT phaj kuj yog Pads nkaus xwb Board.

22. Polymer Thick Film (PTF)

Nws yog cov khoom siv hluav taws xob zoo tshaj plaws uas siv rau hauv kev tsim cov khoom siv hluav taws xob, lossis cov ntawv luam tawm ua cov ntawv luam tawm, ntawm cov khoom siv hluav taws xob, nrog rau kev tshuaj ntsuam luam ntawv thiab tom qab kub kub incineration. Thaum cov organic carrier raug hlawv tawm, ib qho kev sib txuas ntawm cov kab hluav taws xob ruaj khov yog tsim. Cov phaj zoo li no feem ntau hu ua hybrid circuits.

23. Semi-Additive txheej txheem

Nws yog taw tes rau ntawm lub hauv paus cov ntaub ntawv ntawm rwb thaiv tsev, loj hlob lub Circuit Court uas yuav tsum tau ua ntej ncaj qha nrog tshuaj tooj liab, hloov dua electroplate tooj liab txhais tau tias mus ntxiv thicken tom ntej, hu rau "Semi-Additive" txheej txheem.

Yog tias txoj kev siv tshuaj tooj liab siv rau tag nrho cov kab tuab, cov txheej txheem hu ua "tag nrho ntxiv". Nco ntsoov tias cov ntsiab lus saum toj no yog los ntawm * specification ipc-t-50e luam tawm thaum Lub Xya Hli 1992, uas txawv ntawm thawj ipc-t-50d (Kaum Ib Hlis 1988). Thaum ntxov "D version", raws li feem ntau paub nyob rau hauv kev lag luam, hais txog ib tug substrate uas yog liab qab, tsis-conductive, los yog nyias tooj liab ntawv ci (xws li 1/4oz los yog 1/8oz). Cov duab hloov pauv ntawm tus neeg sawv cev tsis zoo yog npaj thiab qhov yuav tsum tau ua yog tuab los ntawm cov tshuaj tooj liab lossis tooj liab plating. Tus tshiab 50E tsis hais lo lus "nyias tooj liab". Qhov sib txawv ntawm ob nqe lus yog qhov loj, thiab cov neeg nyeem cov tswv yim zoo li tau hloov zuj zus nrog The Times.

24.Substractive txheej txheem

Nws yog lub substrate nto ntawm lub zos tsis siv tooj liab ntawv tshem tawm, lub Circuit Court board mus kom ze hu ua "txo txoj kev", yog lub ntsiab ntawm lub Circuit Court board tau ntau xyoo. Qhov no yog qhov sib piv rau "ntxiv" txoj kev ntawm kev ntxiv cov kab hluav taws xob tooj liab ncaj qha mus rau lub substrate tsis muaj tooj liab.

25. Thick Film Circuit Court

PTF (Polymer Thick Film Paste), uas muaj cov hlau muaj txiaj ntsig, tau luam tawm ntawm cov khoom siv hluav taws xob (xws li txhuas trioxide) thiab tom qab ntawd raug rho tawm haujlwm ntawm qhov kub thiab txias kom ua rau lub cev muaj zog nrog cov neeg xyuas pib hlau, uas yog hu ua "thick film circuit". Nws yog ib hom me me Hybrid Circuit Court. Silver Paste Jumper ntawm ib sab PCBS kuj yog tuab-zaj duab xis luam ntawv tab sis tsis tas yuav raug rho tawm haujlwm ntawm qhov kub thiab txias. Cov kab luam tawm ntawm ntau yam substrates yog hu ua "thick film" kab tsuas yog thaum lub thickness yog ntau tshaj 0.1 hli [4mil], thiab kev tsim technology ntawm xws li "circuit system" yog hu ua "thick film technology".

26. Nyias zaj duab xis Technology
Nws yog tus neeg xyuas pib thiab kev sib txuas sib txuas txuas nrog rau lub substrate, qhov thickness tsawg dua 0.1 hli [4mil], ua los ntawm Nqus Evaporation, Pyrolytic Txheej, Cathodic Sputtering, Tshuaj Vapor Deposition, electroplating, anodizing, thiab lwm yam., uas yog hu ua "thin zaj duab xis technology." Cov khoom siv tswv yim muaj nyias zaj duab xis Hybrid Circuit thiab nyias zaj duab xis Integrated Circuit, thiab lwm yam

27. Hloov Laminated Circuit Court

Nws yog ib txoj hauv kev tshiab Circuit Court board ntau lawm, siv 93mil tuab tau ua tiav du stainless hlau phaj, ua ntej ua qhov tsis zoo qhuav zaj duab xis duab hloov mus, thiab tom qab ntawd cov kab tooj liab plating high-speed. Tom qab stripping cov zaj duab xis qhuav, cov hlau stainless hlau phaj saum npoo tuaj yeem raug nias ntawm qhov kub thiab txias mus rau semi-hardened zaj duab xis. Tom qab ntawd tshem tawm cov phaj hlau stainless, koj tuaj yeem tau txais qhov chaw ntawm lub tiaj tiaj hauv Circuit Court board. Nws tuaj yeem ua raws li qhov drilling thiab plating qhov kom tau txais kev sib tshuam interlayer.

CC - 4 coppercomplexer4; Edelectro-deposited photoresist yog tag nrho cov txheej txheem ntxiv tsim los ntawm American PCK lub tuam txhab ntawm tshwj xeeb tooj liab-dawb substrate (saib tsab xov xwm tshwj xeeb ntawm 47th qhov teeb meem ntawm Circuit Court board cov ntaub ntawv xov xwm magazine kom paub meej). MLC (Multilayer Ceramic) (hauv zos inter laminar los ntawm lub qhov); me me phaj PID (Duab imagible Dielectric) ceramic multilayer circuit boards; PTF (photosensitive media) Polymer tuab zaj duab xis Circuit Court (nrog tuab zaj duab xis muab tshuaj txhuam cov ntawv luam tawm Circuit Board) SLC (Nto Laminar Circuits); Cov txheej txheej txheej txheej txheej yog cov thev naus laus zis tshiab luam tawm los ntawm IBM Yasu lub chaw kuaj mob, Nyij Pooj thaum Lub Rau Hli 1993. Nws yog cov txheej txheem sib txuas nrog ntau txheej txheej nrog Curtain Coating ntsuab xim thiab electroplating tooj liab rau sab nraud ntawm ob sab phaj, uas tshem tawm qhov xav tau. drilling thiab plating qhov ntawm lub phaj.