Hlau puag tooj liab clad phaj thiab FR-4 yog ob feem ntau siv luam tawm Circuit Board (PCB) substrates hauv kev lag luam hluav taws xob. Lawv txawv nyob rau hauv cov khoom muaj pes tsawg leeg, kev ua tau zoo yam ntxwv thiab daim ntawv thov teb. Niaj hnub no, Fastline yuav muab rau koj nrog kev sib piv kev tshuaj xyuas ntawm ob cov ntaub ntawv los ntawm kev pom kev tshaj lij:

Hlau puag tooj liab clad phaj: Nws yog hlau-raws li PCB cov ntaub ntawv, feem ntau yog siv txhuas los yog tooj liab ua substrate. Nws lub ntsiab feature yog zoo thermal conductivity thiab tshav kub dissipation muaj peev xwm, yog li nws yog heev nrov nyob rau hauv daim ntawv thov uas yuav tsum tau high thermal conductivity, xws li LED teeb pom kev zoo thiab lub hwj chim converters. Cov hlau substrate tuaj yeem ua kom muaj cua sov los ntawm PCB qhov kub kub mus rau tag nrho lub rooj tsavxwm, yog li txo cov cua sov tsim thiab txhim kho tag nrho cov khoom siv.

FR-4: FR-4 yog cov khoom siv laminate nrog cov ntaub iav fiber ntau ua cov khoom siv txhawb zog thiab epoxy resin ua cov ntawv khi. Tam sim no nws yog qhov feem ntau siv PCB substrate, vim nws cov khoom siv zoo, cov khoom siv hluav taws xob thiab cov nplaim hluav taws xob thiab siv dav hauv ntau yam khoom siv hluav taws xob. FR-4 muaj cov nplaim hluav taws kub nyhiab ntawm UL94 V-0, uas txhais tau hais tias nws kub hnyiab hauv nplaim taws rau lub sijhawm luv luv thiab tsim nyog siv rau hauv cov khoom siv hluav taws xob uas muaj kev nyab xeeb siab.

Qhov tseem ceeb sib txawv:

Cov khoom siv substrate: Hlau tooj liab-clad panels siv hlau (xws li txhuas lossis tooj liab) ua lub substrate, thaum FR-4 siv fiberglass daim ntaub thiab epoxy resin.

Thermal conductivity: Lub thermal conductivity ntawm cov hlau clad ntawv yog ntau dua li ntawm FR-4, uas yog haum rau daim ntaub ntawv uas yuav tsum tau zoo tshav kub dissipation.

Qhov hnyav thiab tuab: Cov ntawv hlau clad tooj liab feem ntau hnyav dua FR-4 thiab tej zaum yuav nyias.

Cov txheej txheem muaj peev xwm: FR-4 yog ib qho yooj yim rau txheej txheem, haum rau complex multi-layer PCB tsim; Hlau clad tooj liab phaj yog nyuaj rau txheej txheem, tab sis haum rau ib txheej los yog yooj yim multi-layer tsim.

Tus nqi: Tus nqi ntawm cov ntawv hlau clad tooj liab feem ntau yog siab dua FR-4 vim tias cov nqi hlau ntau dua.

Daim ntaub ntawv: Hlau clad tooj liab daim hlau yog tsuas yog siv nyob rau hauv cov khoom siv hluav taws xob uas xav tau kom muaj cua sov zoo, xws li hluav taws xob hluav taws xob thiab LED teeb pom kev zoo. FR-4 yog ntau yam, haum rau feem ntau cov qauv hluav taws xob thiab ntau txheej PCB tsim.

Feem ntau, kev xaiv ntawm cov hlau clad los yog FR-4 feem ntau yog nyob ntawm cov kev xav tau ntawm thermal tswj cov khoom, tsim complexity, nqi peev nyiaj thiab kev ruaj ntseg.