Raws li cov khoom tsim, nws tuaj yeem muab faib ua pawg thawj coj (hard board), flexible board (soft board), rigid flexible joint board, HDI board thiab pob substrate.Raws li tus naj npawb ntawm cov txheej txheem kev faib tawm, PCB tuaj yeem muab faib ua ib lub vaj huam sib luag, ob chav vaj huam sib luag thiab ntau txheej txheej.

Rig phaj

Cov yam ntxwv ntawm cov khoom: Nws yog ua los ntawm nruj substrate uas tsis yooj yim rau khoov thiab muaj qee lub zog.Nws muaj khoov tsis kam thiab tuaj yeem muab qee yam kev txhawb nqa rau cov khoom siv hluav taws xob txuas nrog nws.Lub substrate nruj muaj xws li iav fiber ntau substrate, ntawv substrate, composite substrate, ceramic substrate, hlau substrate, thermoplastic substrate, thiab lwm yam.

Daim ntaub ntawv: Cov khoom siv hauv computer thiab network, cov khoom siv sib txuas lus, kev tswj hwm kev lag luam thiab kev kho mob, cov khoom siv hluav taws xob thiab cov khoom siv hluav taws xob hauv tsheb.

Flexible phaj

Cov yam ntxwv ntawm cov khoom: Nws yog hais txog cov ntawv luam tawm Circuit Board ua los ntawm cov ntaub ntawv yooj yim insulating substrate.Nws tuaj yeem ua tau ywj siab khoov, mob, folded, arbitrarily teem raws li spatial layout yuav tsum, thiab arbitrarily tsiv thiab nthuav nyob rau hauv peb-dimensional qhov chaw.Yog li, cov khoom sib dhos thiab cov xaim txuas tuaj yeem ua ke.

Daim ntawv thov: smartphones, laptops, ntsiav tshuaj thiab lwm yam khoom siv hluav taws xob portable.

Rigid torsion bonding phaj

Cov yam ntxwv ntawm cov khoom: yog hais txog lub rooj tsav xwm luam tawm uas muaj ib lossis ntau qhov chaw nruj thiab thaj chaw hloov tau yooj yim, cov txheej nyias nyias ntawm cov ntawv luam tawm Circuit Board hauv qab thiab cov ntawv luam tawm hauv qab sib xyaw ua ke.Nws qhov zoo dua yog tias nws tuaj yeem muab lub luag haujlwm txhawb nqa ntawm cov phaj nruj, tab sis kuj muaj cov yam ntxwv khoov ntawm cov phaj hloov tau yooj yim, thiab tuaj yeem ua tau raws li qhov xav tau ntawm kev sib dhos peb sab.

Daim ntaub ntawv: Cov khoom siv kho mob siab tshaj plaws, lub koob yees duab portable thiab folding computer khoom.

HDI lub rooj tsavxwm

Khoom nta: High Density Interconnect abbreviation, uas yog, high density interconnect technology, yog ib tug luam Circuit Court board technology.HDI board feem ntau yog tsim los ntawm txheej txheej, thiab laser drilling tshuab yog siv los laum qhov hauv cov txheej txheem, kom tag nrho cov ntawv luam tawm Circuit Board ua cov ntawv sib txuas sib txuas nrog faus thiab qhov muag tsis pom qhov ua qhov tseem ceeb.Piv nrog rau cov txheej txheem ntau txheej luam tawm, HDI pawg thawj coj tuaj yeem txhim kho txoj hlua khi ntawm lub rooj tsavxwm, uas yog qhov zoo rau kev siv cov tshuab ntim khoom siab heev.Lub teeb liab tso zis zoo tuaj yeem txhim kho;Nws tseem tuaj yeem ua rau cov khoom siv hluav taws xob ntau dua thiab yooj yim rau hauv cov tsos.

Daim Ntawv Thov: Feem ntau nyob rau hauv kev lag luam ntawm cov neeg siv khoom siv hluav taws xob nrog kev xav tau siab, nws tau siv dav hauv cov xov tooj ntawm tes, khoos phis tawj khoos phis tawj, tsheb hluav taws xob thiab lwm yam khoom siv digital, ntawm cov xov tooj ntawm tes tau siv dav tshaj plaws.Tam sim no, cov khoom sib txuas lus, cov khoom lag luam network, cov khoom lag luam server, cov khoom siv tsheb thiab txawm tias cov khoom siv dav hlau siv hauv HDI thev naus laus zis.

Pob ntawv substrate

Cov khoom nta: uas yog, IC foob loading phaj, uas yog siv ncaj qha los nqa cov nti, tuaj yeem muab kev sib txuas hluav taws xob, kev tiv thaiv, kev txhawb nqa, cua sov dissipation, sib dhos thiab lwm yam haujlwm rau cov nti, txhawm rau ua tiav ntau tus pin, txo cov qhov loj ntawm cov khoom ntim, txhim kho cov khoom siv hluav taws xob thiab cov cua sov dissipation, ultra-siab ceev los yog lub hom phiaj ntawm multi-chip modularization.

Daim ntawv thov teb: Hauv kev sib txuas lus ntawm cov khoom lag luam xws li cov xov tooj ntse thiab cov ntsiav tshuaj hauv computer, ntim cov khoom siv tau dav siv.Xws li lub cim xeeb chips rau kev khaws cia, MEMS rau kev hnov, RF modules rau RF qhia, processor chips thiab lwm yam khoom siv yuav tsum siv ntim substrates.Kev sib txuas lus ceev ceev pob substrate tau siv dav hauv cov ntaub ntawv broadband thiab lwm yam.

Hom thib ob yog cais raws li tus naj npawb ntawm kab txheej.Raws li tus naj npawb ntawm cov txheej txheem kev faib tawm, PCB tuaj yeem muab faib ua ib lub vaj huam sib luag, ob chav vaj huam sib luag thiab ntau txheej txheej.

Ib lub vaj huam sib luag

Ib leeg-Sided Boards (ib leeg-sided Boards) Ntawm qhov yooj yim tshaj plaws PCB, cov khoom yog concentrated ntawm ib sab, cov hlau yog concentrated nyob rau sab nraud (muaj ib qho kev tivthaiv thiab cov hlau yog tib sab, thiab cov ntsaws- hauv ntaus ntawv yog lwm sab).Vim hais tias cov hlau tsuas yog tshwm ntawm ib sab, PCB no hu ua Single-sided.Vim hais tias ib lub vaj huam sib luag muaj ntau qhov kev txwv nruj ntawm cov qauv tsim (vim tias tsuas muaj ib sab xwb, cov xaim tsis tuaj yeem hla thiab yuav tsum mus ncig ntawm ib qho kev sib cais), tsuas yog thaum ntxov circuits siv cov laug cam.

Dual vaj huam sib luag

Ob chav-Sided Boards muaj xov hlau ntawm ob sab, tab sis siv cov xov hlau ntawm ob sab, yuav tsum muaj kev sib txuas ntawm ob sab.Qhov no "choj" ntawm circuits yog hu ua ib tug pilot qhov (ntawm).Lub qhov pilot yog ib lub qhov me me uas muaj los yog coated nrog hlau ntawm PCB, uas tuaj yeem txuas nrog cov xov hlau ntawm ob sab.Vim tias thaj tsam ntawm ob lub vaj huam sib luag yog ob zaug loj dua li ntawm ib lub vaj huam sib luag, ob lub vaj huam sib luag daws qhov teeb meem ntawm cov xaim cuam tshuam rau hauv ib lub vaj huam sib luag (nws tuaj yeem xa tawm los ntawm lub qhov mus rau sab nraud), thiab nws yog ntau dua. haum rau siv nyob rau hauv ntau complex circuits tshaj ib lub vaj huam sib luag.

Multi-Layer Boards Yuav kom nce thaj tsam uas tuaj yeem xaim, ntau txheej boards siv ntau dua ib zaug lossis ob tog thaiv thaiv.

Lub rooj tsav xwm luam tawm nrog ob sab hauv txheej txheej, ob txheej txheej ib sab lossis ob txheej txheej sab hauv, ob sab ib sab txheej txheej, los ntawm kev tso qhov system thiab insulating cov ntaub ntawv sib txuas ua ke thiab cov duab hluav taws xob sib cuam tshuam raws li mus rau cov qauv tsim ntawm lub rooj tsavxwm luam tawm los ua plaub-txheej, rau-txheej luam tawm Circuit Board, tseem hu ua multi-layer printed circuit board.

Tus naj npawb ntawm cov khaubncaws sab nraud povtseg tsis txhais tau hais tias muaj ntau txheej txheej txheej txheej, thiab tshwj xeeb, cov txheej khoob yuav raug ntxiv los tswj cov tuab ntawm lub rooj tsavxwm, feem ntau cov txheej txheem yog txawm, thiab muaj ob txheej txheej sab nraud. .Feem ntau ntawm lub rooj tsavxwm yog 4 mus rau 8 txheej txheej, tab sis technically nws muaj peev xwm ua tiav ze li ntawm 100 txheej ntawm PCB board.Feem ntau cov khoos phis tawj loj loj siv ntau lub ntsiab lus tseem ceeb, tab sis txij li cov khoos phis tawj no tuaj yeem hloov tau los ntawm pawg ntawm ntau lub khoos phis tawj zoo tib yam, ultra-multilayer boards tau poob ntawm kev siv.Vim tias cov khaubncaws sab nraud povtseg hauv PCB yog sib xyaw ua ke, feem ntau tsis yooj yim pom tus lej tiag tiag, tab sis yog tias koj ua tib zoo saib xyuas lub rooj tsavxwm, nws tseem tuaj yeem pom.