Los ntawm PCB ntiaj teb
3 muaj cua sov thiab cua sov dissipation yuav tsum tau
Nrog rau txoj miniaturization, kev ua haujlwm siab, thiab muaj cov khoom siv hluav taws xob hauv cov khoom siv hluav taws xob txuas ntxiv, thiab ib qho ntawm cov kev daws teeb meem xaiv tau ua kom loj hlob yog los tsim cov khoom siv thermally. Tus tseem ceeb rau cov cua sov-resistant thiab tshav kub-dissipating pcbs yog cov cua sov-resistant thiab kub-dissipating cov khoom ntawm substrate. Tam sim no, kev txhim kho ntawm cov khoom siv hauv paus tau txhim kho cov khoom cua sov kom muaj qee yam, tab sis kev txhim kho cua sov hauv thermal yog txwv heev. Feem ntau, ib qho hlau tso tawm (ims) lossis hlau cov tub ntxhais sau cov khoom siv hluav taws xob yog siv los ua kom muaj cua sov, uas txo cov khoom siv cua sov thiab tus nqi ua kom txias.
Aluminium yog cov khoom siv txaus nyiam heev. Nws muaj ntau nplua nuj, tus nqi qis, zoo thermal conductivity thiab lub zog, thiab yog ib puag ncig phooj ywg. Ntawm tam sim no, feem ntau hlau substrates lossis hlau cores yog hlau aluminium. Qhov Zoo ntawm Aluminium Raws li cov khoom siv hluav taws xob yooj yim thiab muaj zog siv hluav taws xob, thiab muaj peev xwm ua tau los ntawm cov neeg siv khoom rau cov neeg siv khoom rau cov khoom lag luam, cov khoom lag luam thiab cov tub rog thiab aerospace. Tsis muaj kev tsis ntseeg txog cov thermal conductivity thiab cov cua sov kuj ntawm cov hlau substrate. Tus tseem ceeb nyob hauv kev ua haujlwm ntawm insulating nplaum ntawm cov hlau phaj thiab cov txheej txheem cellCuit.
Tam sim no, kev tsav tsheb ntawm kev tswj hwm thermal yog tsom rau LEDs. Yuav luag 80% ntawm lub zog tawm tswv yim ntawm LEDs hloov dua siab tshiab rau hauv tshav kub. Yog li ntawd, qhov teeb meem ntawm kev tswj thermal ntawm LEDs yog muaj nuj nqis heev, thiab kev tsom xam yog nyob rau ntawm tshav kub dissiption ntawm LED substrate. Qhov muaj pes tsawg leeg ntawm kev kub siab-resistant thiab ib puag ncig cua sov dissulating txheej txheej rau kev nkag mus rau hauv lub qhov loj zoo LED teeb pom kev zoo.
4 hloov tau thiab luam tawm hluav taws xob thiab lwm yam cai
4.1 Yuav Tsum Tau Ua Ntxiv Board
Lub miniaturization thiab thinning cov khoom siv hauv tshuab hluav taws xob yuav zam ntau tus lej ntawm cov laug cam uas luam tawm cov laug cam (FPCB) thiab Rigid-FlexTed Circuit Coator (R-FPCB). Lub ntiaj teb FPCB kev ua lag luam tam sim no yog tam sim no tau kwv yees li 13 billion US las, thiab qhov kev loj hlob txhua xyoo yuav tsum siab dua li ntawm PCBs sib zog.
Nrog kev nthuav dav ntawm daim ntawv thov, ntxiv rau qhov nce hauv tus lej, yuav muaj ntau yam kev xav tau tshiab. Cov yeeb yaj kiab polyimide muaj nyob rau hauv tsis muaj xim thiab pob tshab, dawb, thiab daj, thiab muaj cua sov siab thiab muaj qhov haum rau cov sijhawm sib txawv. Tus nqi-ua tau zoo polyester zaj duab xis substrates kuj muaj nyob hauv kev ua lag luam. Kev ua haujlwm tshiab muaj xws li elasticity, seem ruaj khov, thiab zaj duab xis tsis kam ua kom tau raws li cov neeg siv kawg.
FPCB thiab Rigid HDI cov laug cam yuav tsum ua kom tau raws li cov kev xav tau ntawm qhov kev sib kis tau zoo thiab muaj peev xwm ntsuas hluav taws xob ntau zaus. Lub dielectric tas li thiab dielectric poob ntawm kev saj zawg zog substrates yuav tsum tau them sai sai rau. Polytetrafluoroethylene thiab advanced polyimide substrates tuaj yeem siv los tsim kev hloov. Circuit Court. Ntxiv inyrgacic hmoov thiab carbon fiber muab muab rau rau cov khaub ncaws polyimide tuaj yeem tsim cov qauv txheej peb ntawm cov txheej txheem sib xyaw. Cov tub rog inorganic siv yog txhuas nitride (aln), txhuas oxide (al2o3) thiab hexagonal boron nitride (HBN). Lub substrate muaj 1.51w / mk thermal conductivity thiab tuaj yeem tiv thaiv 2.5kv withstand voltage thiab 180 degree dabtsi yog kev kuaj ntshav.
FPCB daim ntawv thov cov khoom lag luam, xws li cov khoom siv kho mob, cov khoom siv kho mob, thiab lwm yam. Xws li ultra-nyias pauv ruaj ruaj multilayer board, plaub-txheej FPCB raug txo los ntawm cov pa 0.4mm txog 0.2mm; Kev Tshaj Tawm Loj Tshaj Tawm Cov Khoom Tshaj Tawm Loj Tshaj Tawm, siv qis-df polyimide substrate, mus txog 5gbps kis tau cov kev xav tau; Loj lub hwj chim hloov tau Board siv tus neeg xyuas pib saum 100μm kom tau raws li qhov kev xav tau ntawm cov kev siv hluav taws xob siab thiab kev kub siab tam sim no; Qhov siab kub disspipation hlau-raws li cov rooj sib haum hloov tau yog ib qho RPCB uas siv cov phaj hlau substrate ib nrab; Kev tiv thaiv kev tiv thaiv kev nyuaj siab yog lub siab-paub txog daim nyias nyias thiab electrode yog cov qhaub cij ntawm ob zaj yeeb yaj kiab polyimide los ua ib qho sensile yooj yim; Ib qho teeb meem yoog raws li pawg thawj coj tawm lossis cov khoom siv tsis ruaj khov Ntawm chav kawm, cov FPCS tshwj xeeb yuav tsum muaj kev tsis muaj kev tsis muaj peev xwm.
4.2 Luam Ntawv Hluav Taws Xob
Cov ntawv luam hluav taws xob tau nce lub zog nyob rau hauv xyoo tsis ntev los no, thiab nws tau kwv yees tau tias thaum nruab nrab-2020s, cov luam ntawv luam tawm yuav muaj kev ua lag luam ntau tshaj 300 billion US las. Daim ntawv thov ntawm cov ntawv luam hluav taws xob tshuab rau cov ntawv luam tawm kev lag luam yog ib feem ntawm cov luam tawm hluav taws xob, uas tau dhau los ua kev pom zoo hauv kev lag luam. Luam tawm Electronics Technology yog qhov ze rau FPCB. Tam sim no PCB cov tuam ntxhab tau nqis peev hauv cov luam hluav taws xob luam tawm. Lawv tau pib nrog cov laug cam yoog thiab hloov cov ntawv luam tawm hluav taws xob (PCB) nrog luam hluav taws xob hluav taws xob (PEC). Tam sim no, muaj ntau cov ntaub ntawv thiab cov kua zaub hauv plab, thiab ib zaug muaj kev sib tawg hauv kev ua tau zoo thiab tus nqi, lawv yuav siv dav. PCB cov tuam ntxhab yuav tsum tsis txhob plam lub sijhawm.
Daim ntawv thov cov ntawv tseem ceeb tam sim no ntawm cov luam ntawv hluav taws xob yog qhov tsim cov xov tooj cua qis (RFID) cov cim npe, uas tuaj yeem luam tawm hauv yob. Lub peev xwm nyob hauv thaj chaw luam tawm, teeb pom kev zoo, thiab organic photovoltaics. Kev lag luam thev naus laus zis hnav tau tam sim no yog kev nyiam ua lag luam tawm. Ntau yam khoom ntawm cov cuab yeej siv hluav taws xob, xws li cov khaub ncaws ntse thiab cov kev ua si ntse, uas yuav tsav cov khoom siv hluav taws xob hloov hluav taws xob.
Ib qho tseem ceeb ntawm cov luam tawm Electronics technology yog cov khoom siv, nrog rau substrates thiab innks acks. Saj zawg zog substrates tsis tsuas yog tsim nyog rau FPCBS, tab sis kuj tseem ua haujlwm hauv substrates. Tam sim no, muaj siab-dielectric substrate cov ntaub ntawv muaj los ntawm ceramics thiab polymer resins, raws li kev kub siab substrates, tsawg heev substrates, tsawg heev substrates, tsawg heev substrates thiab colilless pob tshab substrates. , DAJ DOWTTRATE, thiab lwm yam.
4 hloov tau thiab luam tawm hluav taws xob thiab lwm yam cai
4.1 Yuav Tsum Tau Ua Ntxiv Board
Lub miniaturization thiab thinning cov khoom siv hauv tshuab hluav taws xob yuav zam ntau tus lej ntawm cov laug cam uas luam tawm cov laug cam (FPCB) thiab Rigid-FlexTed Circuit Coator (R-FPCB). Lub ntiaj teb FPCB kev ua lag luam tam sim no yog tam sim no tau kwv yees li 13 billion US las, thiab qhov kev loj hlob txhua xyoo yuav tsum siab dua li ntawm PCBs sib zog.
Nrog kev nthuav dav ntawm daim ntawv thov, ntxiv rau qhov nce hauv tus lej, yuav muaj ntau yam kev xav tau tshiab. Cov yeeb yaj kiab polyimide muaj nyob rau hauv tsis muaj xim thiab pob tshab, dawb, thiab daj, thiab muaj cua sov siab thiab muaj qhov haum rau cov sijhawm sib txawv. Tus nqi-ua tau zoo polyester zaj duab xis substrates kuj muaj nyob hauv kev ua lag luam. Kev ua haujlwm tshiab muaj xws li elasticity, seem ruaj khov, thiab zaj duab xis tsis kam ua kom tau raws li cov neeg siv kawg.
FPCB thiab Rigid HDI cov laug cam yuav tsum ua kom tau raws li cov kev xav tau ntawm qhov kev sib kis tau zoo thiab muaj peev xwm ntsuas hluav taws xob ntau zaus. Lub dielectric tas li thiab dielectric poob ntawm kev saj zawg zog substrates yuav tsum tau them sai sai rau. Polytetrafluoroethylene thiab advanced polyimide substrates tuaj yeem siv los tsim kev hloov. Circuit Court. Ntxiv inyrgacic hmoov thiab carbon fiber muab muab rau rau cov khaub ncaws polyimide tuaj yeem tsim cov qauv txheej peb ntawm cov txheej txheem sib xyaw. Cov tub rog inorganic siv yog txhuas nitride (aln), txhuas oxide (al2o3) thiab hexagonal boron nitride (HBN). Lub substrate muaj 1.51w / mk thermal conductivity thiab tuaj yeem tiv thaiv 2.5kv withstand voltage thiab 180 degree dabtsi yog kev kuaj ntshav.
FPCB daim ntawv thov cov khoom lag luam, xws li cov khoom siv kho mob, cov khoom siv kho mob, thiab lwm yam. Xws li ultra-nyias pauv ruaj ruaj multilayer board, plaub-txheej FPCB raug txo los ntawm cov pa 0.4mm txog 0.2mm; Kev Tshaj Tawm Loj Tshaj Tawm Cov Khoom Tshaj Tawm Loj Tshaj Tawm, siv qis-df polyimide substrate, mus txog 5gbps kis tau cov kev xav tau; Loj lub hwj chim hloov tau Board siv tus neeg xyuas pib saum 100μm kom tau raws li qhov kev xav tau ntawm cov kev siv hluav taws xob siab thiab kev kub siab tam sim no; Qhov siab kub disspipation hlau-raws li cov rooj sib haum hloov tau yog ib qho RPCB uas siv cov phaj hlau substrate ib nrab; Kev tiv thaiv kev tiv thaiv kev nyuaj siab yog lub siab-paub txog daim nyias nyias thiab electrode yog cov qhaub cij ntawm ob zaj yeeb yaj kiab polyimide los ua ib qho sensile yooj yim; Ib qho teeb meem yoog raws li pawg thawj coj tawm lossis cov khoom siv tsis ruaj khov Ntawm chav kawm, cov FPCS tshwj xeeb yuav tsum muaj kev tsis muaj kev tsis muaj peev xwm.
4.2 Luam Ntawv Hluav Taws Xob
Cov ntawv luam hluav taws xob tau nce lub zog nyob rau hauv xyoo tsis ntev los no, thiab nws tau kwv yees tau tias thaum nruab nrab-2020s, cov luam ntawv luam tawm yuav muaj kev ua lag luam ntau tshaj 300 billion US las. Daim ntawv thov ntawm cov ntawv luam hluav taws xob tshuab rau cov ntawv luam tawm kev lag luam yog ib feem ntawm cov luam tawm hluav taws xob, uas tau dhau los ua kev pom zoo hauv kev lag luam. Luam tawm Electronics Technology yog qhov ze rau FPCB. Tam sim no PCB cov tuam ntxhab tau nqis peev hauv cov luam hluav taws xob luam tawm. Lawv tau pib nrog cov laug cam yoog thiab hloov cov ntawv luam tawm hluav taws xob (PCB) nrog luam hluav taws xob hluav taws xob (PEC). Tam sim no, muaj ntau cov ntaub ntawv thiab cov kua zaub hauv plab, thiab ib zaug muaj kev sib tawg hauv kev ua tau zoo thiab tus nqi, lawv yuav siv dav. PCB cov tuam ntxhab yuav tsum tsis txhob plam lub sijhawm.
Daim ntawv thov cov ntawv tseem ceeb tam sim no ntawm cov luam ntawv hluav taws xob yog qhov tsim cov xov tooj cua qis (RFID) cov cim npe, uas tuaj yeem luam tawm hauv yob. Lub peev xwm nyob hauv thaj chaw luam tawm, teeb pom kev zoo, thiab organic photovoltaics. Kev lag luam thev naus laus zis hnav tau tam sim no yog kev nyiam ua lag luam tawm. Ntau yam khoom ntawm cov cuab yeej siv hluav taws xob, xws li cov khaub ncaws ntse thiab cov kev ua si ntse, uas yuav tsav cov khoom siv hluav taws xob hloov hluav taws xob.
Ib qho tseem ceeb ntawm cov luam tawm Electronics technology yog cov khoom siv, nrog rau substrates thiab innks acks. Saj zawg zog substrates tsis tsuas yog tsim nyog rau FPCBS, tab sis kuj tseem ua haujlwm hauv substrates. Tam sim no, muaj siab-dielectric substrate cov ntaub ntawv muaj los ntawm ceramics thiab polymer restrates, tsawg dua cov chaw sov thiab tsis muaj xim, thiab lwm yam.