Cov yam ntxwv tseem ceeb ntawm cov ntawv luam tawm Circuit Board nyob ntawm qhov kev ua tau zoo ntawm lub substrate board.Txhawm rau txhim kho kev ua tau zoo ntawm cov ntawv luam tawm Circuit Board, kev ua haujlwm ntawm cov ntawv luam tawm Circuit Court substrate board yuav tsum tau txhim kho ua ntej.Txhawm rau ua kom tau raws li qhov xav tau ntawm kev txhim kho ntawm lub rooj tsav xwm luam tawm, ntau yam ntaub ntawv tshiab Nws tau maj mam tsim thiab muab tso rau hauv kev siv.

Nyob rau hauv xyoo tas los no, PCB kev lag luam tau hloov nws lub hom phiaj los ntawm cov khoos phis tawj mus rau kev sib txuas lus, suav nrog cov chaw nres tsheb hauv paus, servers, thiab mobile terminals.Cov khoom siv sib txuas lus txawb uas sawv cev los ntawm cov xov tooj smartphones tau tsav PCBs kom siab dua, nyias dua, thiab ua haujlwm ntau dua.Cov tshuab luam ntawv Circuit Court yog sib cais los ntawm cov ntaub ntawv substrate, uas kuj muaj cov kev cai ntawm PCB substrates.Cov ntsiab lus tseem ceeb ntawm cov ntaub ntawv substrate yog tam sim no muab tso rau hauv ib tsab xov xwm tshwj xeeb rau kev lag luam siv.

1 Qhov kev thov rau high-density thiab nplua-line

1.1 Kev thov rau cov ntawv ci tooj liab

PCBs yog tag nrho cov kev loj hlob mus rau high-density thiab nyias-kab txoj kev loj hlob, thiab HDI boards yog tshwj xeeb tshaj yog tseem ceeb.Kaum xyoo dhau los, IPC tau txhais lub HDI board raws li kab dav / kab sib nrug (L / S) ntawm 0.1mm / 0.1mm thiab hauv qab no.Tam sim no kev lag luam pib ua tiav cov pa L / S ntawm 60μm, thiab qib siab L / S ntawm 40μm.Nyiv xyoo 2013 version ntawm kev teeb tsa thev naus laus zis txoj hauv kev cov ntaub ntawv yog tias xyoo 2014, cov pa L / S ntawm HDI pawg thawj coj saib yog 50μm, qib siab L / S yog 35μm, thiab kev sim ua L / S yog 20μm.

PCB Circuit Court qauv tsim, cov txheej txheem tshuaj etching ib txwm (txoj kev rho tawm) tom qab kev yees duab ntawm cov ntawv ci tooj liab substrate, qhov tsawg kawg nkaus ntawm cov txheej txheem rho tawm rau kev ua cov kab zoo yog kwv yees li 30μm, thiab cov ntawv ci tooj liab (9 ~ 12μm) substrate yog xav tau.Vim yog tus nqi siab ntawm cov ntawv ci tooj liab CCL thiab ntau qhov tsis xws luag hauv nyias tooj liab ntawv ci lamination, ntau lub Hoobkas tsim 18μm tooj liab ntawv ci thiab tom qab ntawd siv etching kom nyias cov txheej tooj liab thaum tsim khoom.Txoj kev no muaj ntau cov txheej txheem, kev tswj cov thickness nyuaj, thiab tus nqi siab.Nws yog qhov zoo dua los siv nyias tooj liab ntawv ci.Tsis tas li ntawd, thaum PCB Circuit Court L / S tsawg dua 20μm, cov ntawv ci tooj liab nyias feem ntau nyuaj rau kev daws.Nws yuav tsum muaj cov ntawv ci tooj liab ultra-nyias (3 ~ 5μm) substrate thiab cov ntawv nyiaj ultra-nyias nrog rau cov cab kuj.

Ntxiv nrog rau cov ntaub ntawv nyias nyias, cov kab zoo tam sim no yuav tsum muaj qhov roughness tsawg ntawm cov ntawv ci tooj liab.Feem ntau, txhawm rau txhawm rau txhim kho lub zog sib txuas ntawm cov ntawv ci tooj liab thiab cov substrate thiab kom ntseeg tau tias cov neeg xyuas pib tev lub zog, cov txheej tooj ntawm cov ntawv ci yog roughened.Lub roughness ntawm cov pa ntawv tooj liab yog ntau tshaj 5μm.Lub embed ntawm tooj liab ntawv ci lub ncov ntxhib mus rau hauv lub substrate txhim kho cov tev tawm, tab sis kom tswj tau qhov tseeb ntawm cov hlau thaum lub sij hawm txoj kab etching, nws yog ib qho yooj yim kom muaj cov embedding substrate peaks tshuav, ua rau luv luv Circuit Court ntawm cov kab los yog txo rwb thaiv tsev. , uas yog ib qho tseem ceeb heev rau cov kab zoo.Txoj kab yog qhov tshwj xeeb.Yog li ntawd, tooj liab foils nrog tsawg roughness (tsawg dua 3 μm) thiab txawm qis roughness (1.5 μm) yuav tsum tau.

1.2 Qhov kev thov rau cov ntawv laminated dielectric

Cov txheej txheem ntawm HDI pawg thawj coj saib yog tias cov txheej txheem tsim (BuildingUpProcess), feem ntau siv cob-coated tooj liab ntawv ci (RCC), lossis txheej txheej txheej ntawm semi-kho epoxy iav ntaub thiab tooj liab ntawv ci yog qhov nyuaj rau kev ua tiav cov kab zoo.Tam sim no, cov txheej txheem semi-additive (SAP) lossis txoj kev txhim kho semi-processed (MSAP) yog qhov yuav tsum tau saws, uas yog, insulating dielectric zaj duab xis yog siv rau stacking, thiab tom qab ntawd electroless tooj liab plating yog siv los ua tooj liab. conductor txheej.Vim tias cov txheej tooj liab yog nyias nyias, nws yooj yim los tsim cov kab zoo.

Ib qho ntawm cov ntsiab lus tseem ceeb ntawm cov txheej txheem semi-additive yog cov khoom siv laminated dielectric.Txhawm rau ua kom tau raws li cov kev xav tau ntawm cov kab zoo siab, cov khoom siv laminated tso rau pem hauv ntej cov kev xav tau ntawm cov khoom siv hluav taws xob dielectric, rwb thaiv tsev, kub tsis kam, kev sib khi quab yuam, thiab lwm yam, nrog rau cov txheej txheem hloov kho ntawm HDI board.Tam sim no, thoob ntiaj teb HDI laminated media cov ntaub ntawv feem ntau yog ABF / GX series khoom ntawm Nyiv Ajinomoto Tuam Txhab, uas siv epoxy resin nrog sib txawv curing agents ntxiv inorganic hmoov los txhim kho cov rigidity ntawm cov khoom thiab txo cov CTE, thiab iav fiber ntau daim ntaub. kuj yog siv los ua kom cov rigidity..Kuj tseem muaj cov ntaub ntawv nyias nyias nyias nyias ntawm Sekisui Chemical Company ntawm Nyiv, thiab Taiwan Industrial Technology Research Institute kuj tau tsim cov ntaub ntawv zoo li no.ABF cov ntaub ntawv kuj tseem niaj hnub txhim kho thiab tsim.Cov tiam tshiab ntawm cov ntaub ntawv laminated tshwj xeeb yuav tsum tau muaj qhov roughness tsawg, thermal expansion, tsis tshua muaj dielectric poob, thiab nyias rigid ntxiv dag zog.

Nyob rau hauv lub ntiaj teb no semiconductor ntim, IC ntim substrates tau hloov ceramic substrates nrog organic substrates.Lub suab ntawm flip nti (FC) ntim substrates tau me dua thiab me dua.Tam sim no cov kab dav dav / kab sib nrug yog 15μm, thiab nws yuav thinner yav tom ntej.Kev ua tau zoo ntawm cov txheej txheem ntau txheej txheem feem ntau yuav tsum muaj cov khoom siv hluav taws xob tsawg, tsis tshua muaj thermal expansion coefficient thiab kub kub tsis kam, thiab kev nrhiav cov nqi qis ntawm cov substrates raws li kev ua tau zoo ntawm cov hom phiaj.Tam sim no, kev tsim khoom loj ntawm cov khoom siv hluav taws xob zoo tau txais cov txheej txheem MSPA ntawm laminated rwb thaiv tsev thiab nyias tooj liab ntawv ci.Siv txoj kev SAP los tsim cov qauv hauv Circuit Court nrog L / S tsawg dua 10μm.

Thaum PCBs ua denser thiab nyias, HDI board thev naus laus zis tau hloov zuj zus los ntawm cov txheej txheem uas muaj cov laminates mus rau coreless Anylayer interconnection laminates (Anylayer).Txhua-txheej interconnection laminate HDI boards nrog tib lub luag haujlwm zoo dua li cov tub ntxhais uas muaj laminate HDI boards.Cov cheeb tsam thiab tuab tuaj yeem txo tau li ntawm 25%.Cov no yuav tsum siv thinner thiab tswj cov khoom hluav taws xob zoo ntawm txheej dielectric.

2 High zaus thiab siab ceev thov

Kev sib txuas lus hauv tshuab hluav taws xob muaj xws li los ntawm wired mus rau wireless, los ntawm tsawg zaus thiab qis ceev mus rau high zaus thiab kev kub ceev.Kev ua haujlwm ntawm lub xov tooj ntawm tes tam sim no tau nkag mus rau 4G thiab yuav txav mus rau 5G, uas yog, kev sib kis tau nrawm dua thiab muaj peev xwm kis tau tus mob loj dua.Kev tshwm sim ntawm lub ntiaj teb huab huab xam lub sijhawm tau ua ob npaug ntawm cov ntaub ntawv tsheb, thiab cov khoom siv sib txuas lus siab thiab ceev ceev yog ib qho kev hloov tsis tau.PCB yog tsim rau high-frequency thiab high-ceev kis tau tus mob.Ntxiv nrog rau kev txo cov teeb liab cuam tshuam thiab poob hauv kev tsim hluav taws xob, tswj cov teeb liab kev ncaj ncees, thiab tswj xyuas PCB tsim kom tau raws li cov qauv tsim, nws yog ib qho tseem ceeb uas yuav tsum muaj cov txheej txheem ua haujlwm siab.

Yuav kom daws tau qhov teeb meem ntawm PCB nce ceev thiab teeb liab kev ncaj ncees, tsim engineers mas tsom rau hluav taws xob teeb liab poob zog.Lub hauv paus tseem ceeb rau kev xaiv ntawm substrate yog dielectric tas li (Dk) thiab dielectric poob (Df).Thaum Dk qis dua 4 thiab Df0.010, nws yog nruab nrab Dk / Df laminate, thiab thaum Dk qis dua 3.7 thiab Df0.005 qis dua, nws yog qib Dk / Df qib laminates, tam sim no muaj ntau yam substrates. nkag mus rau hauv kev ua lag luam xaiv los ntawm.

Tam sim no, cov feem ntau siv high-frequency Circuit Court board substrates yog mas fluorine-raws li resins, polyphenylene ether (PPO los yog PPE) resins thiab hloov epoxy resins.Fluorine-based dielectric substrates, xws li polytetrafluoroethylene (PTFE), muaj qhov qis tshaj dielectric zog thiab feem ntau yog siv saum 5 GHz.Kuj tseem muaj kev hloov kho epoxy FR-4 lossis PPO substrates.

Ntxiv nrog rau cov lus hais saum toj no thiab lwm cov ntaub ntawv insulating, qhov roughness ntawm qhov chaw (profile) ntawm tus neeg xyuas pib tooj liab kuj yog ib qho tseem ceeb uas cuam tshuam rau cov teeb liab tsis zoo, uas cuam tshuam los ntawm cov nyhuv ntawm daim tawv nqaij (SkinEffect).Cov nyhuv ntawm daim tawv nqaij yog lub electromagnetic induction generated nyob rau hauv cov hlau thaum lub sij hawm high-frequency teeb liab kis tau tus mob, thiab inductance yog loj nyob rau hauv nruab nrab ntawm cov hlau seem, yog li hais tias tam sim no los yog teeb liab yuav mloog zoo rau saum npoo ntawm cov hlau.Qhov saum npoo roughness ntawm tus neeg xyuas pib cuam tshuam qhov poob ntawm cov teeb liab kis tau tus mob, thiab qhov poob ntawm qhov chaw du yog me me.

Nyob rau tib zaus, qhov ntau dua qhov roughness ntawm tooj liab nto, lub teeb liab poob ntau dua.Yog li ntawd, nyob rau hauv qhov tseeb ntau lawm, peb sim tswj lub roughness ntawm nto tooj liab thickness kom ntau li ntau tau.Lub roughness yog me me li sai tau yam tsis muaj kev cuam tshuam rau lub zog sib txuas.Tshwj xeeb tshaj yog rau cov teeb liab nyob rau hauv ntau tshaj 10 GHz.Ntawm 10GHz, cov ntawv ci tooj liab roughness yuav tsum tsawg dua 1μm, thiab nws yog qhov zoo dua los siv super-planar tooj liab ntawv ci (nto roughness 0.04μm).Lub nto roughness ntawm tooj liab ntawv ci kuj yuav tsum tau ua ke nrog ib tug haum oxidation kev kho mob thiab bonding resin system.Nyob rau hauv lub neej yav tom ntej, yuav muaj ib tug resin-coated tooj liab ntawv ci uas yuav luag tsis muaj cov qauv, uas yuav muaj ib tug ntau dua tev lub zog thiab yuav tsis cuam tshuam rau dielectric poob.