Muaj feem xyuam: Nws kwv yees li ntawm 25% -30% ntawm PCBs tam sim no siv cov txheej txheem OSP, thiab qhov kev faib ua feem tau nce siab (nws zoo li OSP txheej txheem tam sim no tau dhau ntawm cov tshuaj tsuag tin thiab qib thawj). Cov txheej txheem OSP tuaj yeem siv rau ntawm cov khoom siv hluav taws xob tsawg lossis cov khoom siv high-tech PCBs, xws li TV PCBs ib leeg thiab cov khoom ntim ntim siab. Rau BGA, kuj muaj ntau yamOSPdaim ntawv thov. Yog tias PCB tsis muaj qhov kev sib txuas ntawm qhov chaw ua haujlwm lossis kev txwv lub sijhawm cia, cov txheej txheem OSP yuav yog txheej txheem kho saum npoo zoo tshaj plaws.

Qhov zoo tshaj plaws: Nws muaj tag nrho cov txiaj ntsig ntawm cov khoom siv tooj liab liab qab vuam, thiab lub rooj tsav xwm uas tau tas sij hawm (peb lub hlis) tuaj yeem rov ua dua tshiab, tab sis feem ntau tsuas yog ib zaug xwb.

Disadvantages: susceptible rau acid thiab humidity. Thaum siv rau lwm qhov reflow soldering, nws yuav tsum tau ua kom tiav nyob rau hauv ib lub sij hawm ntawm lub sij hawm. Feem ntau, cov nyhuv ntawm qhov thib ob reflow soldering yuav tsis zoo. Yog tias lub sijhawm khaws cia ntau tshaj peb lub hlis, nws yuav tsum rov ua dua. Siv hauv 24 teev tom qab qhib lub pob. OSP yog txheej txheej insulating, yog li qhov ntsuas qhov ntsuas yuav tsum tau muab luam tawm nrog cov tshuaj txhuam kom tshem tawm cov txheej txheem OSP los tiv thaiv tus pin point rau kev kuaj hluav taws xob.

Txoj kev: Ntawm qhov huv si liab qab nto, ib txheej ntawm cov organic zaj duab xis yog zus los ntawm txoj kev tshuaj. Cov yeeb yaj kiab no muaj kev tiv thaiv oxidation, thermal shock, noo noo tsis kam, thiab yog siv los tiv thaiv tooj liab nto los ntawm xeb (oxidation los yog vulcanization, thiab lwm yam) nyob rau hauv ib puag ncig ib puag ncig; tib lub sij hawm, nws yuav tsum tau yooj yim pab nyob rau hauv lub tom ntej no kub kub ntawm vuam. Flux yog tshem tawm sai sai rau soldering;