Taw qhia ntawmVia-hauv-Pad:

Nws paub zoo tias vias (VIA) tuaj yeem muab faib ua plated los ntawm lub qhov, qhov muag tsis pom ntawm lub qhov thiab faus vias qhov, uas muaj cov haujlwm sib txawv.

Nrog rau kev txhim kho ntawm cov khoom siv hluav taws xob, vias ua lub luag haujlwm tseem ceeb hauv kev sib cuam tshuam ntawm cov ntawv luam tawm Circuit Board. Via-in-Pad yog dav siv hauv me me PCB thiab BGA (Ball Grid Array). Nrog rau txoj kev loj hlob tsis muaj kev vam meej, BGA (Ball Grid Array) thiab SMD nti miniaturization, daim ntawv thov ntawm Via-in-Pad thev naus laus zis tau dhau los ua qhov tseem ceeb.

Vias hauv ncoo muaj ntau yam zoo dua qhov muag tsis pom thiab faus vias:

. Haum rau cov suab zoo BGA.

. Nws yog qhov yooj yim rau tus qauv tsim txiaj dua siab dua PCB thiab cawm cov xov hluav taws xob.

. Zoo dua thermal tswj.

. Anti-low inductance thiab lwm yam kev kub ceev tsim.

. Muab ib tug flatter nto rau Cheebtsam.

. Txo cov cheeb tsam PCB thiab txhim kho txuas ntxiv.

Vim yog cov txiaj ntsig zoo no, ntawm-hauv-pad yog dav siv hauv cov PCBs me me, tshwj xeeb tshaj yog nyob rau hauv PCB tsim qhov twg cov cua sov hloov mus thiab kev kub ceev yuav tsum muaj tsawg BGA suab. Txawm hais tias qhov muag tsis pom thiab faus vias pab ua kom ceev thiab txuag chaw ntawm PCBs, vias hauv ncoo tseem yog qhov kev xaiv zoo tshaj plaws rau kev tswj xyuas thermal thiab cov khoom siv hluav taws xob ceev.

Nrog rau kev txhim khu kev qha los ntawm kev sau / plating capping txheej txheem, ntawm-hauv-pad thev naus laus zis tuaj yeem siv los tsim cov PCBs siab tsis siv cov tshuaj vaj tsev thiab zam kev ua yuam kev. Tsis tas li ntawd, qhov no tuaj yeem muab cov xov hlau txuas ntxiv rau BGA tsim.

Muaj ntau yam ntaub ntawv sau rau lub qhov nyob hauv lub phaj, nyiaj muab tshuaj txhuam thiab tooj liab muab tshuaj txhuam yog feem ntau siv rau cov khoom siv hluav taws xob, thiab cov resin feem ntau yog siv rau cov khoom siv tsis zoo.