Vim yog cov txheej txheem ua haujlwm ntawm PCB, hauv kev npaj thiab kev tsim kho cov haujlwm muaj txiaj ntsig zoo, nws yog qhov kev tswj hwm, cov ntaub ntawv thiab kev ua haujlwm ntse.
Txheej Txheem Qhia Ntawv
Raws li cov naj npawb ntawm pcb txheej, nws tau muab faib ua ib leeg-ob tog, thiab ntau txheej. Peb lub rooj tsavxwm tswjfwm tsis zoo li qub.
Tsis muaj txheej txheej sab hauv cov txheej txheem rau ib leeg-tog thiab ob tog phab ntsa, cia li txiav cov txheej txheem tom qab.
Cov laug tsav multilayer yuav muaj cov txheej txheem sab hauv
1) chav vaj huam sib luag nas ntws
Txiav thiab EDGING → DRING txheej GROARDS → (Tag Nrho Board Kev Soj Ntsuam
2) txheej txheem ntws ntawm ob npaug ib sab Tin Txau board
Txiav Ntug Sib Tsoo → Hnyav Tooj Liab Plating, → Screen Screen Cim → Daim Ntawv Qhia Txog Cov Hluav Taws Kub
3) Muab ob sab npib npib tsib xee-kub plating txheej txheem
Txiav ntug sib tsoo →ring tooj liab txheej d drilling → screen luam ntawv cim → Daim Ntawv Luam Ntawv Cim → Daim Ntawv Luam Ntawv Tshaj Tawm → Kev Ntsuas Xyuas
4) Multi-txheej board board tin txau txheej txheem ntws
Kev txiav thiab sib tsoo → drilling txheej duab tshem tawm →
5) Txheej Txheem Flow ntawm Nickel thiab Kub Plating ntawm Multilayer Cam
Cutting and grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → heavy copper thickening → outer layer graphics → gold plating, film removal and etching → secondary drilling → inspection → Screen printing solder mask → screen printing characters → shape processing → testing → inspection
6) Txheej Txheem Flow ntau-txheej phaj im immersion npib ob
Kev txiav thiab sib tsoo → drilling txheej duab tshuaj tivthaiv → Cov tshuaj tshem tawm Tsib Nrab no → Silk Screen Cim → Daim Duab Ntsig → Cov Tshuaj Twv → Silk Screen Cim → Daim Duab Ntaus → Daim Duab Ntsig → Daim Duab Ntaus → Daim Duab Ntaus → Daim Duab Ua → Kev Ntsuam Xyuas → Test Kev Ntsuam Xyuas
Sab hauv txheej ntau lawm (cov duab hloov)
Sab hauv txheej: txiav board, inner txheej ua ntej ua ntej, laminating, raug, kev sib txuas
Txiav (Board Hlais)
1) Txiav Board
Lub Hom Phiaj: Txiav cov ntaub ntawv loj rau hauv qhov loj uas tau teev tseg los ntawm kev txiav txim ntawm qhov yuav tsum tau ua los ntawm kev ua haujlwm raws li kev npaj ua ntej tsim qauv)
Cov Khoom Siv Raw Lub ntsiab: Phaj Phaj, Pom Hniav
Lub substrate yog ua los ntawm tooj liab daim ntawv thiab insulating laminate. Muaj ntau cov ntaub ntawv sib txawv tuab cov ntaub ntawv tshwj xeeb raws li qhov yuav tsum tau ua. Raws li lub tooj liab tuab, nws tuaj yeem muab faib rau H / H, 1oz / 1oz, 2oz / 2oz, thiab lwm yam.
Cov kev ceev faj:
a. Txhawm rau kom tsis txhob cuam tshuam ntawm Pawg Thawj Coj Barry ntawm qhov zoo, tom qab txiav, ntug yuav polished thiab rounded.
b. Xav txog qhov cuam tshuam ntawm kev nthuav dav thiab cog lus, lub rooj tsavxwm txiav yog ci ua ntej xa mus rau cov txheej txheem
c. Txiav yuav tsum xyuam xim rau txoj ntsiab cai ntawm kev taw qhia zoo ib txwm
EDGING / Kev Sib Ntsib: Kev sib tshooj: kev siv tshuab polishing yog siv los tshem cov iav ntawm lub rooj sib xws thaum lub rooj tsavxwm tom ntej, ua rau muaj cov teeb meem
Ci Phaj: Tshem tawm cov pa dej thiab cov organic enging los ntawm ci dissabing, thiab nce sab hauv qhov ruaj khov, tshuaj ruaj khov thiab tshuab zog ntawm lub phaj
Cov ntsiab lus tswj:
Ntawv Khoom: Vaj Huam Sib Luag Loj, Thickness, Ntawv Hom, Tooj Thickness
Kev Ua Haujlwm: Ci Lub Sijhawm / Kub, Teeb Qhov Siab
(2) kev tsim khoom hauv cov txheej hauv qab tom qab txiav board
Muaj nuj nqi thiab lub hauv paus ntsiab lus:
Sab hauv tooj liab phaj roughued los ntawm cov hniav sib tsoo Nws tsis tuaj yeem yaj nyob rau hauv qaug zog alkali, tab sis tuaj yeem yaj nyob rau hauv alkali. Qhov tsis muaj qhov tsis pom nyob hauv qhov tsis muaj zog nyob hauv Circuit Courti, thiab sab hauv yog siv cov yam ntxwv ntawm cov khoom siv los hloov cov duab liab, uas yog, duab hloov chaw.
Me mem quav naimCov duab kos rau qhov pib hauv qhov tiv thaiv hauv thaj chaw nqus cov photons thiab decomposes rau hauv radicals dawb. Cov dawb radicals pib kev sib txuas hla kev sib txuas ntawm cov monomers los ua ib qho spatial network macromolecular qauv uas yog insoluble hauv dilute alkali. Nws yog soluble hauv dilute alkali tom qab cov tshuaj tiv thaiv.
Siv ob qho kom muaj txawv solubility cov qauv nyob rau hauv tib txoj kev daws teeb meem los hloov cov qauv tsim ntawm cov tsis zoo los ua kom tiav daim duab hloov).
Tus qauv Circuit Court yuav tsum tau kub thiab vaum tej xwm txheej, feem ntau xav tau qhov kub ntawm 225 +/- 10% los tiv thaiv cov yeeb yaj kiab los ntawm kev deforming. Cov hmoov av nyob rau hauv huab cua yuav tsum muaj siab. Raws li qhov ntom ntawm cov kab nce thiab cov kab ua me, cov plua plav cov ntsiab lus tsawg dua lossis sib npaug rau 10,000 lossis ntau dua.
Khoom Taw Qhia:
Zaj duab xis qhuav: qhuav zaj duab xis brooresist rau luv yog dej-soluble tiv thaiv zaj duab xis. Lub thickness feem ntau 1.2mil, 1.5mil thiab 2mil. Nws tau muab faib ua peb txheej: Polyester tiv thaiv zaj duab xis, polyethylene diaphragm thiab cov duab yeeb yaj kiab. Lub luag haujlwm ntawm Polyethylene Diaphragm yog los tiv thaiv cov mos yeeb yaj kiab barrier tus neeg saib xyuas thaum lub sij hawm thauj mus los thiab sijhawm khaws cia ntawm cov yeeb yaj kiab qhuav. Cov yeeb yaj kiab tiv thaiv tuaj yeem tiv thaiv cov pa los ntawm kev nkag mus rau cov txheej barrier thiab tsis txhob muaj kev cuam tshuam nrog dawb radicals nyob rau hauv nws ua rau photopolymerization. Cov yeeb yaj kiab qhuav uas tsis tau polymerized yog yooj yim ntxuav tawm los ntawm cov sodium carbonate daws.
Ntub dej zaj duab xis: ntub dej zaj duab xis yog ib qho kev ua kua ua kua, tsuas yog tsim ntawm high-rhiab, rhiab, muab tub lim thiab ib qho me me ntawm cov kuab tshuaj me me. Kev tsim khoom viscosity yog 10-15dpa.s, thiab nws muaj corrosion tsis kam thiab electroplating tsis kam. , Ntub dej zaj duab xis txheej txheej txheem xws li tshuaj ntsuam luam ntawv thiab txau.
Qhia Taw Qhia:
Zaj duab xis qhuav xyaum qauv, cov txheej txheem ntau lawm yog raws li hauv qab no:
Kev kho mob ua ntej-lamation-raug-kev txhim kho-etching-zaj duab xis tshem tawm
Pretreathe
Lub Hom Phiaj: Tshem tawm cov khoom paug ntawm cov txheej txheem tooj liab, txheej thiab lwm yam tsis zoo, thiab nce qhov tseeb ntawm lub ntsej muag tooj liab los pab txhawb cov txheej txheem lamination tom ntej
Cov Khoom Siv Raw: Lub Log Txhuam Log
Ua ntej ua txoj kev:
(1) sandblasting thiab sib tsoo txoj kev
(2) Txuj Ci Kho Mob
(3) Kev sib tsoo cov txheej txheem
Tus txheej txheem yooj yim ntawm txoj kev siv tshuaj lom neeg: siv tshuaj lom neeg xws li sps thiab lwm cov kua qaub ua kom tshem tawm impurities xws li roj thiab oxides ntawm tus tooj liab nto.
Tshuaj Tu:
Siv cov roj alkaline kom tshem tawm cov roj stains, ntiv tes los tshem tawm cov tooj liab liab, thiab thaum kawg ua cov yeeb yaj kiab tshiab tag nrho nrog cov nplaum nplaum zoo heev.
Cov ntsiab lus tswj:
a. Sib tsoo ceev (2.5-3.2mm / min)
b. Hnav caws pliav dav (500 # rab koob txhuam muag coj caws pliav lug dav: 8-16mm), kev ntsuas dej zeb, ziab khaub ncaws (80-90 ℃)
Lamination
Lub Hom Phiaj: Muab tshuaj txhuam ib qho kev tiv thaiv corrosive qhuav ntawm tooj liab saum ntawm cov txheej txheem substrate los ntawm kev nias kub.
Cov khoom siv raw lub ntsiab: qhuav zaj duab xis, kev daws teeb meem hom, uas yuav muaj los ntawm cov organic kua ntses radicals, uas yuav muaj nrog muaj zog alkali kom nws organic acid radicals. Yaj deb.
Lub hauv paus ntsiab lus: Dov zaj yeeb yaj kiab qhuav (zaj duab xis): Thawj cov yeeb yaj kiab qhuav rau ntawm cov duab liab thiab tom qab ntawd ua kom zoo nkauj los ntawm tshav kub thiab nws cov xim ua kom sov. Zaj duab xis ua tiav los ntawm lub siab ntawm cov xovxwm kub kub thiab qhov kev txiav txim ntawm cov nplaum hauv qhov tsis kam.
Peb lub ntsiab ntawm reel qhuav zaj duab xis: siab, kub, kis ceev
Cov ntsiab lus tswj:
a. Film Rate (1.5m / min), Ua Yeeb Yam Siab (5 +/- 1kg / CM2), Kev Lom Zem Kub (110 +), Tawm Qhov Kub (40-60 ℃)
b. Ntub Zaj Duab Xis Txheej: Txheej nrawm, Txheej Txheej, Pre-Bake Sijhawm / Kub (5-20 feeb rau thawj sab, 10-20 feeb rau thawj sab)
Nphav
Lub Hom Phiaj: Siv cov khoom siv teeb kom hloov cov duab ntawm cov thawj zaj duab xis thawj rau cov duab.
Cov khoom siv raw lub ntsiab: cov yeeb yaj kiab siv nyob rau hauv cov txheej txheem sab hauv ntawm zaj duab xis yog ib qho tsis zoo, thiab ib feem dub yog opaque thiab tsis hnov mob. Cov yeeb yaj kiab siv nyob rau hauv txheej sab nraud yog ib zaj yeeb yaj kiab zoo, uas yog qhov rov qab ntawm zaj duab xis siv nyob rau hauv txheej sab hauv.
Lub hauv paus ntsiab lus ntawm cov yeeb yaj kiab qhuav Cov dawb radicals pib sib txuas ntawm monomers los ua ib qho spatial network macromolecular qauv insoluble hauv dilute alkali.
Tswj Cov Ntsiab Lus: Cov Lus Qhia Txog Qhov Ncauj Lus, Raug Voungetal Lub Hauv Paus (6-8
Kev tsim kho
Lub Hom Phiaj: Siv cov lus lye ntxuav tawm ntawm ib feem ntawm cov zaj duab xis qhuav uas tsis tau thim cov tshuaj tiv thaiv.
Cov khoom siv tseem ceeb: NA2CO3
Cov zaj duab xis qhuav uas tsis tau dhau los polymerization yog ntxuav kom deb, thiab cov yeeb yaj kiab qhuav uas tau khaws tseg rau saum npoo ntawm lub rooj tsavxwm yog kev tiv thaiv txheej thaum etching.
Kev txhim kho lub hauv paus ntsiab lus: cov pab pawg nquag hauv ib feem uas tsis tau daws teeb meem, yog li yaj cov yeeb yaj kiab uas tsis pom zoo, thaum lub sijhawm qhuav zaj duab xis ntawm qhov nthuav dav tsis yog yaj.