Kev Tsim Nyog Rau PCB Structures:

Multilayer PCByog tsim los ntawm tooj liab ntawv ci, prepreg, thiab core board. Muaj ob hom lamination qauv, uas yog, lamination qauv ntawm tooj liab ntawv ci thiab core board thiab lamination qauv ntawm core board thiab core board. Cov ntawv ci tooj liab thiab cov core board lamination qauv yog qhov nyiam, thiab cov txheej txheem txheej txheem lamination tuaj yeem siv rau cov phaj tshwj xeeb (xws li Rogess44350, thiab lwm yam) ntau txheej boards thiab hybrid qauv boards.

1.Txoj kev xav tau ntawm cov qauv nias txhawm rau txhawm rau txo qhov warpage ntawm PCB, PCB lamination qauv yuav tsum ua tau raws li qhov yuav tsum tau muaj symmetry, uas yog, lub thickness ntawm cov ntawv ci tooj liab, hom thiab thickness ntawm dielectric txheej, cov qauv faib hom. (circuit txheej, dav hlau txheej), lamination, thiab lwm yam txheeb ze rau PCB ntsug Centrosymmetric,

2.Conductor tooj liab thickness

(1) Lub thickness ntawm tus neeg xyuas pib tooj liab qhia rau ntawm daim duab yog lub thickness ntawm cov tiav tooj liab, uas yog, lub thickness ntawm txheej txheej ntawm tooj liab yog lub thickness ntawm lub hauv qab tooj liab ntawv nyiaj ntxiv rau lub thickness ntawm electroplating txheej, thiab thickness. ntawm lub puab txheej ntawm tooj liab yog lub thickness ntawm lub puab txheej ntawm hauv qab tooj liab ntawv ci. Nyob rau hauv daim duab, txheej txheej tooj liab thickness yog cim raws li "copper foil thickness + plating, thiab puab txheej tooj liab thickness yog cim raws li "copper foil thickness".

(2) Kev ceev faj rau daim ntawv thov ntawm 2OZ thiab saum toj no tuab hauv qab tooj liab yuav tsum tau siv symmetrically thoob plaws hauv pawg.

Tsis txhob muab lawv tso rau ntawm L2 thiab Ln-2 cov khaubncaws sab nraud povtseg kom ntau li ntau tau, uas yog, cov txheej txheem thib ob ntawm sab saum toj thiab hauv qab, kom tsis txhob muaj qhov tsis sib xws thiab wrinkled PCB.

3. Kev xav tau rau cov qauv nias

Cov txheej txheem lamination yog txheej txheem tseem ceeb hauv kev tsim PCB. Qhov ntau ntawm cov laminations, qhov phem dua qhov tseeb ntawm qhov sib dhos ntawm lub qhov thiab cov disk, thiab qhov loj dua qhov deformation ntawm PCB, tshwj xeeb tshaj yog thaum nws yog asymmetrically laminated. Lamination muaj cov kev xav tau rau stacking, xws li tooj liab thickness thiab dielectric thickness yuav tsum sib phim.