1. Pinhole

Lub pinhole yog vim yog adsorption ntawm hydrogen gas rau ntawm qhov chaw plated, uas yuav tsis tso tawm rau lub sijhawm ntev. Cov tshuaj plating tsis tuaj yeem ntub dej ntawm qhov chaw plated, yog li cov txheej txheem electrolytic plating tsis tuaj yeem txheeb xyuas electrolytically. Raws li lub thickness ntawm txheej nce nyob rau hauv ib ncig ntawm lub hydrogen evolution point, ib tug pinhole yog tsim nyob rau hauv lub hydrogen evolution point. Characterized los ntawm ib tug ci iab puag ncig lub qhov thiab tej zaum ib tug me me upturned tus Tsov tus tw. Thaum tsis muaj tus neeg sawv cev ntub dej hauv cov tshuaj plating thiab qhov ceev tam sim no siab, pinholes yog ib qho yooj yim los tsim.

2. Piav

Pockmarks yog vim qhov chaw plated tsis huv, muaj cov khoom siv adsorbed, lossis cov khoom siv raug tshem tawm hauv cov tshuaj plating. Thaum lawv ncav cuag qhov chaw ntawm lub workpiece nyob rau hauv qhov kev txiav txim ntawm hluav taws xob teb, lawv yog adsorbed rau nws, uas cuam tshuam rau electrolysis. Cov khoom no yog embedded nyob rau hauv lub electroplating txheej, me me pob (dumps) yog tsim. Cov yam ntxwv yog tias nws yog convex, tsis muaj qhov tshwm sim ci ntsa iab, thiab tsis muaj qhov ruaj khov. Nyob rau hauv luv luv, nws yog tshwm sim los ntawm qias neeg workpiece thiab qias neeg plating tov.

3. Airflow kab txaij

Airflow streaks yog vim muaj ntau ntxiv los yog siab cathode tam sim no ceev los yog complexing tus neeg sawv cev, uas txo cov cathode tam sim no efficiency thiab ua rau ib tug loj npaum li cas ntawm hydrogen evolution. Yog tias cov tshuaj plating ntws maj mam thiab cov cathode txav mus qeeb, cov roj hydrogen yuav cuam tshuam rau kev teeb tsa ntawm cov khoom siv hluav taws xob hauv cov txheej txheem ntawm kev nce mus rau saum npoo ntawm lub workpiece, tsim cov kab txaij airflow los ntawm hauv qab mus rau sab saum toj.

4. Mask plating (pom hauv qab)

Mask plating yog vim lub fact tias lub mos flash ntawm tus pin txoj hauj lwm nyob rau saum npoo ntawm lub workpiece tsis tau raug tshem tawm, thiab cov electrolytic deposition txheej yuav tsum tsis txhob ua ntawm no. Cov khoom siv hauv paus tuaj yeem pom tom qab electroplating, yog li nws yog hu ua raug hauv qab (vim tias lub teeb muag muag yog ib qho translucent lossis pob tshab resin tivthaiv).

5. Txheej brittleness

Tom qab SMD electroplating thiab txiav thiab sib sau, nws tuaj yeem pom tias muaj qhov tawg ntawm qhov khoov ntawm tus pin. Thaum muaj qhov tawg ntawm cov nickel txheej thiab cov substrate, nws raug txiav txim tias cov nickel txheej yog nkig. Thaum muaj qhov tawg ntawm txheej tin thiab txheej npib tsib xee, nws tau txiav txim siab tias txheej tin yog nkig. Feem ntau ntawm cov ua rau brittleness yog additives, ntau brighteners, los yog ntau inorganic thiab organic impurities nyob rau hauv lub plating tov.